Datasheet C2012NPO470JGTS Specification

Page 1
MLCC NP0 Series approval sheet
Page 2
Electronics Corp.
Multi-Layer Ceramic Capacitor C-G1-7-00
General Specification
General introduction:
Ceramic capacitors (or condenser) are widely used in electronic circuitry for coupling, de-coupling and in filters. These different functions require specific capacitor properties. Ceramic capacitors can be divided into two classes,
Class 1
In these capacitors dielectric materials are used which have a very high specific resistance, very good Q and linear temperature dependence. They are used in such applications as oscillators and filters where low losses, capacitance drift compensation and high stability are required.
Class 2
These capacitors have higher losses and have non-linear characteristics. They are used for coupling and de-coupling.
Construction:
G 1
The capacitance of a ceramic capacitor depends on the area of the electrodes (A), the thickness of the ceramic dielectric (t) and the dielectric constant of the ceramic material (ε multi-layer ceramic capacitors :
C =ε
The standard capacitance unit is the “Farad”. A cap acitor has capacitance of one farad is when one coulomb charges two parallel conductive plate to one volt potential. The rated voltage is dependent on the dielectric strength, which is mainly governed by the thickness of the dielectric layer and the ceramic structure. For this reason a reduction of the layer thickness is limited. Figure 1 shows the construction of a multi-layer capacitor. The electrodes are normally mixed palladium with silver since the electrodes are applied before the ceramic is fired at a temperature where silver would oxidize.
r ε0
A/t n
) ; and on the number of dielectric layers (n) with
r
Manufacturing of ceramic capacitors
The raw materials are finely milled and carefully mixed. Thereafter the powders are calcined at temperatures between 1100 and 1300 to achieve the required chemical composition. Then, the resultant mass is reground and dopes and/or sintering means are added. The finely ground material is mixed with a solvent and binding matter. Casting or rolling obtains thin sheets. For multi-layer capacitors electrode material is printed on the sheets and after stacking and pressing of the sheets co-fired with the ceramic compact at temperatures between 1000 and 1400℃. The totally enclosed electrodes of a multi-layer capacitor guarantee good life test behavior as well.
Darfon Product Specification 1
Page 3
Electronics Corp.
Multi-Layer Ceramic Capacitor C-G1-7-00
Operating Voltage
The operating voltage for the capacitors must always be lower than its rated voltage. If an AC voltage is applied, the peak voltage should be lower than the rated voltage of the capacitor. And if both AC and a pulse voltage may be presented, then the sum of the peak should also be lower than the rated voltage of the capacitor chosen.
E Standard Number
E 3 1.0 2.2 4.7
E 6 1.0 1.5 2.2 3.3 4.7 6.8 E12 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 E24 1.0 1.1 1.2 1.3 1.5 1.6 1.8 2.0 2.2 2.4 2.7 3.0 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1
* Non-standard capacitance is available on request.
Available Tolerance
G 1
T. C. Capacitance * Standard Tolerance
Cap < 5pF
NP0 (C0G)
X5R X7R
Y5V E3 Z = -20% to +80% M = ± 20%
5pF Cap < 10pF D = ± 0.5pF
Cap 10pF
E12
E6
* Non-standard capacitance is available on request.
C = ± 0.25pF
D = ± 0.5pF
J = ± 5%
K = ±10%
K = ± 10%
M = ± 20%
Available Tolerance
on Request
B = ± 0.1pF
B = ± 0.1pF
C = ± 0.25pF
F = ± 1%
G = ± 2%
J = ± 5%
Darfon Product Specification 2
Page 4
Electronics Corp.
Multi-Layer Ceramic Capacitor C-G1-7-00
Physical Outline
Termination
(2) Electrode, PdAg or Ni (1) Dielectric
(3) Ag or Cu (4) Ni (5) Sn
G 1
Material Type
Code
Elements
1 Dielectric TiO2 CaZrO3 BaTiO3 BaTiO3 2 Electrode PdAg Ni PdAg Ni 3 Ag Cu Ag Cu
4 Ni 5
* NME (Nobel Metal Electrode), BME (Base Metal Electrode)
Termination**
Temperature Compensation
NME* BME* NME* BME*
Class I
Sn
** All Darfon’s MLCC products are produced under lead-free plating process and in compliance with the
lead-free requirement of Green Plan and ROHS.
High Permittivity
Class II
Darfon Product Specification 3
Page 5
Electronics Corp.
A
Multi-Layer Ceramic Capacitor C-G1-7-00
Dimensions
G 1
L
g
W
T
TYPICAL TOLERANCE
SIZE CODE L W T
(EIA) (Length) (Width) (Max Thickness) (Min) (Termination Min/Max)
0603 0.6+/-0.03 0.3+/-0.03 0.33 0.15 0.10/0.20 mm
(0201) (0.024+/-0.001) (0.012+/-0.001) (0.013) (0.006) (0.004/0.008) (inch)
1005 1.0 +/- 0.05 0.5 +/- 0.05 0.55 0.30 0.10 / 0.30 mm
(0402) (0.040 +/- 0.002) (0.020 +/- 0.002) (0.022) (0.012) (0.004 / 0.012) (inch)
1608 1.6 +/- 0.10 0.8 +/- 0.10 0.90 0.50 0.25 / 0.65 mm
(0603) (0.063 +/- 0.004) (0.031 +/- 0.004) (0.035) (0.020) (0.010 / 0.026) (inch)
2012 2.0 +/- 0.15 1.25 +/- 0.20 1.45 0.70 0.25 / 0.75 mm
(0805) (0.079 +/- 0.006) (0.049 +/- 0.008) (0.057) (0.028) (0.010 / 0.030) (inch)
3216 3.2 +/- 0.15 1.6 +/- 0.20 1.80 1.50 0.25 / 0.75 mm
(1206) (0.126 +/- 0.006) (0.063 +/- 0.008) (0.069) (0.060) (0.010 / 0.030) (inch)
3225 3.2 +/- 0.20 2.5 +/- 0.20 2.70 1.50 0.25 / 0.75 mm
(1210) (0.126 +/- 0.008) (0.098 +/- 0.008) (0.106) (0.060) (0.010 / 0.030) (inch)
g
A
UNIT
SPECIAL TOLERANCE
SIZE CODE L W T
(EIA) (Length) (Width) (Max Thickness) (Min) (Termination Min/Max)
1005* 1.0 +/- 0.15 0.5 +/- 0.15 0.65 0.30 0.10 / 0.30 mm
(0402) (0.040 +/- 0.006) (0.020 +/- 0.006) (0.026) (0.012) (0.004 / 0.012) (inch)
1608* 1.6 + 0.15/-0.1 0.8 + 0.15/-0.1 0.95 0.50 0.25 / 0.65 mm
(0603) (0.063 +0.006/- 0.004) (0.031 +0.006/-0.004) (0.037) (0.020) (0.010 / 0.026) (inch)
2012* 2.0 +/- 0.20 1.25 -0.20/+0.30 1.55 0.70 0.25 / 0.75 mm
(0805) (0.079 +/- 0.008) (0.049 -0.008/+0.012) (0.061) (0.028) (0.010 / 0.030) (inch)
3216* 3.2 +/- 0.20 1.6 -0.20/+0.30 1.90 1.50 0.25 / 0.75 mm
(1206) (0.126 +/- 0.008) (0.063 -0.008/+0.012) (0.075) (0.060) (0.010 / 0.030) (inch)
3225* 3.2 +/- 0.30 2.5 +/- 0.30 2.80 1.50 0.25 / 0.75 mm
(1210) (0.126 +/- 0.012) (0.098 +/- 0.012) (0.11) (0.060) (0.010 / 0.030) (inch)
g
A
UNIT
Darfon Product Specification 4
Page 6
Electronics Corp.
Multi-Layer Ceramic Capacitor C-G1-7-00
DARFON Part Number
C
1005 NP0 101 J G T S
PRODUCT CODE
C = Capacitor SMD
SIZE in mm (EIA CODE, in inch)
0402(01005) 0603(0201) 1005 (0402) 1608 (0603) 2012 (0805) 3216 (1206) 3225(1210) 4520 (1808) 4532 (1812)
T. C.
NP0: 0 ± 30ppm/ -55 to +125 X7R: ±15% -55 to +125 X5R: ±15% -55 to +85 Y5V: +22%/-82% -30 to +85
CAPACITANCE CODE
Expressed in pico-farads and identified by a three-digit number. First two digits represent significant figures. Last digit specifies the number of zeros. (Use 9 for 1.0 through 9.9pF Use 8 for 0.2 through 0.99pF) (Example: 2.2pF=229 or 0.47pF=478)
TOLERANCE CODE
A: ± 0.05pF B: ± 0.1pF C: ± 0.25pF D: ± 0.5pF F: ±1% G: ±2% J: ±5% K: ±10% M: ±20% Z: +80/-20%
VOL TAGE CODE
B: 4V C: 6.3V D: 10V E: 16V F: 25V N: 35V G: 50V H: 100V J: 200V K: 250V L: 500V M: 630V P: 1KV Q: 2KV R: 3KV S: 4KV
PACKAGING CODE
T: Paper tape reel Ø180mm (7”) P: Embossed tape reel Ø180mm (7”) N: Paper tape reel Ø250mm (10”) D: Embossed tape reel Ø250mm (10”) A: Paper tape reel Ø330mm (13”) E: Embossed tape reel Ø330mm (13”) B: Bulk, loosed in bag C: Bulk cassette W: Special Packing
Product Type
S: Standard Ceramic Capacitor Q: High Q/Low ESR
G 1
Darfon Product Specification 5
Page 7
Electronics Corp.
Multi-Layer Ceramic Capacitor C-G1-7-00
Product Range
NP0 (Class I)
Type Size
T.C. RV 0603 (0201) 1005 (0402) 1608 (0603) 2012 (0805) 3216 (1206)
NPO
Class I
X7R (Class II)
Type
T.C. RV 0603 (0201) 1005 (0402) 1608 (0603) 2012 (0805) 3216 (1206) 3225 (1210)
X7R
Class II
16V 2.7nF~3.3nF 12nF~39nF 25V 0.20pF~100pF 0.20pF~22pF 50V 0.20pF~18pF 0.20pF~470pF/1nF 0.20pF~2.2nF 0.50pF~10nF 1.50pF~10nF
100V 0.20pF~220pF 0.20pF~1nF 0.50pF~3.3nF 1.50pF~4.7nF
Size
6.3V 4.7uF~10uF 10V 3.3nF/4.7nF/10nF 100pF~100nF 100pF~1uF 1uF/2.2uF/4.7uF/10uF 2.2uF 16V 100pF~100nF 100pF~1uF 330nF/470nF/1uF/ 2.2uF 470nF~10uF 10uF 25V 100pF~2.2nF 100pF~22nF 100pF~1uF 1nF~1uF 220nF~4.7uF 4.7uF/10uF 50V 100pF~2.2nF 100pF~10nF 100pF~100nF 150pF~470nF 1nF~1uF
100V 100pF~10nF 150pF~22nF 1nF~100nF
G 1
X5R (Class II)
Type Size
T.C. RV 0603 (0201) 1005 (0402) 1608 (0603) 2012 (0805) 3216 (1206) 3225 (1210)
6.3V 2.2nF~220nF 470nF~4.7uF 2.2uF/ 4.7uF/10uF 4.7uF~22uF 22uF/47uF 47uF/100uF
X5R
Class
10V 2.2nF~100nF 15nF~1uF 220nF~4.7uF 2.2uF~10uF 2.2uF~10uF 22uF 16V 15nF~1uF 220nF~2.2uF 1uF~10uF 2.2uF~10uF 4.7uF~22uF
II
25V 100nF 220nF/1uF 1uF~4.7uF 2.2uF~10uF 4.7uF/ 10uF
Y5V (Class II)
Type Size
T.C. RV 0603 (0201) 1005 (0402) 1608 (0603) 2012 (0805)
6.3V
22nF~100nF 10nF~1uF 10nF~2.2uF
Y5V
Class II
Note(1) Other size, capacitance, and voltage are available upon customer’s request.
10V 10nF~1uF 10nF~2.2uF 16V 10nF~220nF 10nF~2.2uF 100nF~2.2uF
25V 50V
10nF~100nF 10nF~330nF 100nF ~2.2uF 10nF~33nF 10nF~220nF 100nF~1uF
(2) Product range might be extended due to technology improvement or new product releasedfor up-to-dat e information,
please contact our sales.
(3) Part of Y5V product will be phased out.
Darfon Product Specification 6
Page 8
Electronics Corp.
Multi-Layer Ceramic Capacitor C-G1-7-00
Packaging
Tape and Reel Packaging
Tape and reel packaging is currently the most promising system for high-speed production. A typical 180mm (7 inch) diameter reel contains 1,500 to 15,000 capacitors, 250mm (10 inch) contains 10,000 capacitors, and 330mm(13 inch) contains 10,000 to 50,000 capacitors. Three standard sizes are available in taped and reeled package either with paper carrier tapes or embossed tapes.
Reel Specifications
13.0+/-0.5
2.0+/-0.5
21.0+/-0.8
10.0+/-1.5 for 8mm wide tape
14.0+/-1.5 for 12mm wide tape
T
D
50 min.
G
TAPE WIDTH
(mm)
8
8
G
(mm)
10.0 +/- 1.5 14.5 180
10.0 +/- 1.5 14.5 250
T max.
(mm)
D
(mm)
8
12
10.0 +/- 1.5 14.5 330
14.0 +/- 1.5 18.5 180
Darfon Product Specification 7
Page 9
Electronics Corp.
A
Multi-Layer Ceramic Capacitor C-G1-7-00
Paper Tape Specifications
2mm and 4mm pitch tape
4.0+/-0.1
P
1.5
+0.1
- 0.0
2.0+/-0.05
B
1.75+/-0.1
F
1.1 max.
W
G 1
SYMBOL
A
B
F
P
W
Direction of feed
PRODUCT SIZE CODE
0603 (0201) 1005 (0402) 1608 (0603) 2012 (0805) 3216 (1206)
SIZE TOL. SIZE TOL. SIZE TOL. SIZE TOL. SIZE TOL.
Cardboard
UNIT
0.38 +/- 0.04 0.60 +/- 0.04 1.0 +/- 0.2 1.5 +/- 0.2 1.9 +/- 0.2 mm
0.68 +/- 0.04 1.12 +/- 0.04 1.8 +/- 0.2 2.3 +/- 0.2 3.6 +/- 0.2 mm
3.50 +/- 0.05 3.50 +/- 0.05 3.5 +/- 0.05 3.5 +/- 0.05 3.5 +/- 0.05 mm
2.00 +/- 0.10 2.00 +/- 0.10 4.0 +/- 0.1 4.0 +/- 0.1 4.0 +/- 0.1 mm
8.00 +/- 0.20 8.00 +/- 0.20 8.0 +/- 0.2 8.0 +/- 0.2 8.0 +/- 0.2 mm
Darfon Product Specification 8
Page 10
Electronics Corp.
A
Multi-Layer Ceramic Capacitor C-G1-7-00
Embossed Tape Specifications
4mm and 8mm pitch tape
D
P
1
0
P
0
K
P
2
E
0
T
G 1
0
B
0
D
1
Direction of feed
ko: so chosen that the orientation of the component cannot change. For W= 8mm: T For W= 12mm: T
=2.5mm max.
2
= 4.5mm
2
PRODUCT SIZE CODE
DIMENSION
(mm)
P1 PO P2
A0 nominal clearance* B0 nominal clearance*
2012 (0805) 3216 (1206) 3225 (1210) 4520 (1808) 4532 (1812)
4 4 4 8 8 +/- 0.10 4 4 4 4 4 +/- 0.10 2 2 2 2 2 +/- 0.05
0.2 0.3 0.3 0.4 0.4 -
0.2 0.3 0.3 0.4 0.4 -
4 mm tape 8 mm tape
Top tape
F
W
T
1
T
2
TOLERANCE
(mm)
K0 minimum clearance*
W
E
F D0 D1
T
T1 T2
0.05 0.05 0.05 0.05 0.05 -
8.0 8.0 8.0 12.0 12.0 +/- 0.20
1.75 1.75 1.75 1.75 1.75 +/- 0.10
3.5 3.5 3.5 5.5 5.5 +/- 0.05
1.5 1.5 1.5 1.5 1.5 +0.1/-0.0
1 min 1 min 1 min 1.5 min 1.5 min +0.1/-0.0
0.25 0.25 0.25 0.25 0.25 +/- 0.10
0.05 0.05 0.05 0.05 0.05 +/- 0.01
2.5 max. 2.5 max. 2.5 max. 4.5 4.5
* Typical capacitors displace in pocket.
Darfon Product Specification 9
-
Page 11
Electronics Corp.
Multi-Layer Ceramic Capacitor C-G1-7-00
Thickness and Taping Amount
G 1
Thickness
Code Spec Size(EIA) Paper Embossed Paper Embossed Paper Embossed
A 0.30+/-0.03 0603 (0201) 15K B 0.50+/-0.05 1005 (0402) 10K 50K B 0.50+/-0.15 1005 (0402) 10K 50K Q 0.45+/-0.05 1005 (0402) 10K 50K
C 0.60+/-0.15 Q 0.45+/-0.05 1608(0603) 4K 10K 15K
D 0.80+/-0.10 1608(0603) 4K 10K 15K D 0.80+0.15/ -0.10 1608 (0603) 4K 10K 15K
E 0.85+/-0.15
I 0.95+/-0.15
F 1.15+/-0.20
G 1.25 +/-0.20
G 1.25+0.3/-0.2
L 1.60+/-0.20
L 1.60+0.30/-0.20
N 2.00+/-0.20
N 2.00+/-0.30 3225 (1210) 2K P 2.50+/-0.20 3225(1210) 500pcs/1K P 2.50+/-0.30 3225(1210) 500pcs/1K
2012 (0805) 4K 10K 15K
3216(1206) 4K 10K 15K
2012 (0805) 4K 10K 15K 3216 (1206) 4K 10K 15K 3225 (1210) 3K 10K 4532 (1812) 1K
2012(0805) 3K
3216(1206) 3K 3216 (1206) 3K 10K 4520 (1808) 3K 2012 (0805) 2K/3K 10K 3216 (1206) 3K 10K 3225 (1210) 3K
4520(1808) 3K
4532(1812) 1K
2012(0805) 2K/3K 10K
3216(1206) 3K 10K
3225(1210) 3K
3216(1206) 2K
3225(1210) 2K
4520(1808) 2K
4532(1812) 1K
3216(1206) 2K
3225(1210) 2K
4520(1808) 2K
45321812) 1K 3216 (1206) 2K/3K 3225 (1210) 2K 4520 (1808) 1K
4532(1812) 1K
180 mm (7”) 250 mm (10”) 330 mm (13”)
Amount per reel
Darfon Product Specification 10
Page 12
Electronics Corp.
Multi-Layer Ceramic Capacitor C-G1-7-00
Peeling Off Force
Peeling off force: 0.1N to 1.0N in the direction shown below. The peeling speed: 300+/-10 mm/min
165 ° to 180°
1. The taped tape on reel is wound clock wise. The sprocket holes are to the right as the tape is pulled toward the user.
2. There are minimum 150 mm as the leader and minimum 40 mm empty tape as the tail be attached to the end of the tape.
Peeling force
Top tape
Base tape
Darfon Product Specification 11
Page 13
Electronics Corp.
Multi-Layer Ceramic Capacitor C-S1-7-00
C0G (NP0) Dielectrics
Features
A monolithic structure ensures high reliability and mechanical strength.
High capacitance density.
A wide range of capacitance values in standard case size.
Suitable for high speed SMT placement on PCBs.
Ni barrier termination highly resistance to migration.
Lead-free termination is in compliance with the requirement of green plan and ROHS.
Applications
General electronic equipment.
Custom Application
S 1
C0G (NP0) Dielectric Characteristics
Capacitance Range 0.20pF to 39nF
Size (mm)
(EIA inch)
Test Voltage 1.0 ± 0.2Vrms
Test Frequency
Capacitance Tolerance
Operating Temperature Range
Maximum Capacitance Change
Rated Voltage 16, 25, 50, 100 VDC
Dissipation Factor (DF)
Insulation Resistance (+25, RVDC)
Insulation Resistance (+125, RVDC)
0603 1005 1608 2012 3216
(0201) (0402) (0603) (0805) (1206)
1.0 ± 0.2MHz for cap1,000pF, 1.0 ± 0.2KHz for cap>1,000pF
± 0.25pF, ± 0.50pF for cap5pF (± 0.1pF available on request)
± 0.50pF for 5pF≦cap<10pF (± 0.1pF, ± 0.25pF available on request)
± 5%, ± 10% for cap10pF (± 1%, ± 2% available on request)
-55 to +125
0 ± 30 ppm/ (EIA C0G)
1/(400 + 20 x C) for cap30pF, C in pF 0.1% max. for cap>30pF
10,000 M min. or 500-F min., whichever is smaller
1,000 M min. or 50-F min., whichever is smaller
Darfon Product Specification 1
Page 14
Electronics Corp.
Multi-Layer Ceramic Capacitor C-S1-7-00
Product Range and Thickness
CLASS Class I
TYPE Standard
T.C. C0G (NP0) SIZE 0603 1005 1608 2012 3216 (EIA) 0201 0402 0603 0805 1206
RV 25V 50V 50V 100V 16V 50V 100V 50V 100V 16V 50V 100V
0.20 p B B D D
0.50 p A A B B D D C C
0.75 p A A B B D D C C
1.0 p A A B B D D C C
1.2 p A A B B D D C C
1.5 p A A B B D D C C E E
1.8 p A A B B D D C C E E
2.2 p A A B B D D C C E E
2.7 p A A B B D D C C E E
3.3 p A A B B D D C C E E
3.9 p A A B B D D C C E E
4.7 p A A B B D D C C E E
5.6 p A A B B D D C C E E
6.8 p A A B B D D C C E E
8.2 p A A B B D D C C E E
10 p A A B B D D C C E E
12 p A A B B D D C C E E
15 p A A B B D D C C E E
18 p A A B B D D C C E E
22 p A B B D D C C E E
27 p A B B D D C C E E
33 p A B B D D C C E E
39 p A B B D D C C E E
47 p A B B D D C C E E
56 p A B B D D C C E E
68 p A B B D D C C E E
82 p A B B D D C C E E
Non-standard capacitance or thickness is available on request The thickness might be changed due to technology improvement. * Special length/width tolerance
S 1
Thickness Tolerance
Thickness (mm) Thickness (mm) Thickness (mm) Thickness (mm) Thickness (mm) Thickness (mm)
Code Class Code Class Code Class Code Class Code Code Code Code
A 0.30+/-0.03 C 0.60+/-0.15 E 0.85+/-0.15 G 1.25 -0.20/+0.30 L 1.60+0.3/-0.20 P 2.50+/-0.20 B 0.50+/-0.05 D 0.80+/-0.10 F 1.15+/-0.20 I 0.95+/-0.15 N 2.00+/-0.20 Q 0.45+/-0.05 B 0.50+/-0.15 D 0.8+0.15/-0.1 G 1.25+/-0.20 L 1.60+/-0.20 N 2.00+/-0.30
Special Length/Width Tolerance
Size Code(EIA) 1005(0402) 1608(0603) 2012(0805) 3216(1206) 3225(1210)
Length(mm) 1.0 ± 0.15 1.6 ± 0.15 2.0 ± 0.20 3.2 ± 0.20 3.2 ± 0.30
Width(mm) 0.5 ± 0.15 0.8 ± 0.15 1.25 ± 0.30 1.6 ± 0.30 2.5 ± 0.30
Darfon Product Specification 2
Page 15
Electronics Corp.
Multi-Layer Ceramic Capacitor C-S1-7-00
Continued from previous page.
Product Range and Thickness
CLASS Class I
TYPE Standard
T.C. C0G (NP0)
SIZE 0603 1005 1608 2012 3216 (EIA) 0201 0402 0603 0805 1206
RV 25V 50V 50V 100V 16V 50V 100V 50V 100V 16V 50V 100V
100 p A B B D D C C E E 120 p B B D D C C E E 150 p B B D D C C E E 180 p B B D D C C E E 220 p B B D D C C E E 270 p B D D C C E E 330 p B D D C C E E 390 p B D D C E E E 470 p B D D C E E E 560 p D D C E E E 680 p D D C E E E 820 p D D C E E E
1.0 n B D D C E E E
1.2 n D* E E E E
1.5 n D* E E E E
1.8 n D* E E E E
2.2 n D* E E E E
2.7 n D* G G E E
3.3 n D* G G E E
3.9 n G E E
4.7 n G E E
5.6 n G E
6.8 n G F
8.2 n G F
10 n G G
12 n G
15 n G
18 n G
22 n G
27 n G
33 n G
39 n L
Non-standard capacitance or thickness is available on request The thickness might be changed due to technology improvement. * Special length/width tolerance
Thickness Tolerance
Thickness (mm) Thickness (mm) Thickness (mm) Thickness (mm) Thickness (mm) Thickness (mm)
Code Class Code Class Code Class Code Class Code Code Code Code
A 0.30+/-0.03 C 0.60+/-0.15 E 0.85+/-0.15 G 1.25 -0.20/+0.30 L 1.60+0.3/-0.20 P 2.50+/-0.20 B 0.50+/-0.05 D 0.80+/-0.10 F 1.15+/-0.20 I 0.95+/-0.15 N 2.00+/-0.20 Q 0.45+/-0.05 B 0.50+/-0.15 D 0.8+0.15/-0.1 G 1.25+/-0.20 L 1.60+/-0.20 N 2.00+/-0.30
Special Length/Width Tolerance
Size Code(EIA) 1005(0402) 1608(0603) 2012(0805) 3216(1206) 3225(1210)
Length(mm) 1.0 ± 0.15 1.6 ± 0.15 2.0 ± 0.20 3.2 ± 0.20 3.2 ± 0.30
Width(mm) 0.5 ± 0.15 0.8 ± 0.15 1.25 ± 0.30 1.6 ± 0.30 2.5 ± 0.30
S 1
Darfon Product Specification 3
Page 16
Electronics Corp.
Multi-Layer Ceramic Capacitor C-S1-7-00
T aping Amount
Thickness
Code Spec Size(EIA) Paper Embossed Paper Embossed Paper Embossed
A 0.30+/-0.03 0603 (0201) 15K B 0.50+/-0.05 1005 (0402) 10K 50K B 0.50+/-0.15 1005 (0402) 10K 50K Q 0.45+/-0.05 1005 (0402) 10K 50K
C 0.60+/-0.15 Q 0.45+/-0.05 1608(0603) 4K 10K 15K
D 0.80+/-0.10 1608(0603) 4K 10K 15K D 0.80+0.15/ -0.10 1608 (0603) 4K 10K 15K
E 0.85+/-0.15
I 0.95+/-0.15
F 1.15+/-0.20
G 1.25 +/-0.20
G 1.25+0.3/-0.2
L 1.60+/-0.20
L 1.60+0.30/-0.20
N 2.00+/-0.20
N 2.00+/-0.30 3225 (1210) 2K P 2.50+/-0.20 3225(1210) 500pcs/1K P 2.50+/-0.30 3225(1210) 500pcs/1K
2012 (0805) 4K 10K 15K
3216(1206) 4K 10K 15K
2012 (0805) 4K 10K 15K 3216 (1206) 4K 10K 15K 3225 (1210) 3K 10K 4532 (1812) 1K
2012(0805) 3K
3216(1206) 3K 3216 (1206) 3K 10K 4520 (1808) 3K 2012 (0805) 2K/3K 10K 3216 (1206) 3K 10K 3225 (1210) 3K
4520(1808) 3K
4532(1812) 1K
2012(0805) 2K/3K 10K
3216(1206) 3K 10K
3225(1210) 3K
3216(1206) 2K
3225(1210) 2K
4520(1808) 2K
4532(1812) 1K
3216(1206) 2K
3225(1210) 2K
4520(1808) 2K
45321812) 1K 3216 (1206) 2K/3K 3225 (1210) 2K 4520 (1808) 1K
4532(1812) 1K
180 mm (7”) 250 mm (10”) 330 mm (13”)
Amount per reel
Darfon Product Specification 4
Page 17
Electronics Corp.
0

Multi-Layer Ceramic Capacitor C-S1-7-00
C0G (NP0) Specifications
1 Operating Temperature Range NP0: -55 to 125 degree C ---
2 Rated Voltage 16VDC, 25VDC, 50VDC, 100VDC, The rated voltage is defined as the maximum voltage, which
3 Appearance No defects or abnormalities. Visual inspection 4 Dimensions Within the specified dimension. Using calipers 5 Dielectric Strength No defects or abnormalities. No failure shall be observed when 250% of the rated voltage is
6 Insulation Resistance ( I.R.)
7 Capacitance Within the specified tolerance
8 Q/Dissipation Factor ( D.F.) NP0:
9 Capacitance Temperature
Characteristics
10 Termination Strength No removal of the terminations or marking defect. Apply a parallel force of 5N to a PCB mounted sample for
11 Deflection (Bending Strength)
Item Specification Test Method
may be applied continuously to the capacitor.
applied between the terminations for 1 to 5 seconds. The
Rated Voltage: <500V To apply rated
Rated Voltage: 500V To apply 500V.
If C30pF, DF1/(400+20C), C in pF
If C >30pF, DF≦0.1%.
Capacitance change within 0±30ppm/ under operating
temperature range.
No cracking or marking defects shall occur at 1mm deflection.
Capacitance change:
NPO: within ±5% or ± 0.5pF. (whichever is larger)
(Unit in mm)
t :1.6mm(0.8mm for 0603&1005 size)
Fig. a.
100
voltage.
b
c
a
4.5
I.R. 10G or
RiCR≧500Ω-F
(whichever is smaller)
Size a b C
0603 0.3 0.9 0.3
4
1005 0.4 1.5 0.5
1608 1.0 3.0 1.2
2012 1.2 4.0 1.65
3216 2.2 5.0 2.0
charge and discharge current is less than 50mA.
The insulation resistance shall be measured with a DC voltage not exceeding the rated voltage at 25 and 75%RH max, and
within 1 minute of charging.
The capacitance / D.F. shall be measured at 25at the
frequency and voltage shown in the tables.
Item Class I
Frequency 1.0±0.2MHz 1.0±0.2kHz
Voltage 1.0±0.2Vrms 1.0±0.2Vrms
Temperature compensating type:
The capacitance value at 25 and 85 shall be
measured and calculated from the formula given below.
T.C . =( C85-C25)/C25*ΔT*106(PPM/)
10±1sec. *2N for 0603 (EIA 0201).
Solder the capacitor to the test jig (glass epoxy boards) shown
in Fig.a using a SAC305(Sn96.5Ag3.0Cu0.5) solder (then let sit
for 48±4 hours for X7R X5R and Y5V).
Then apply a force in the direction shown in Fig.b. The
soldering shall be done with the reflow method and shall be
conducted with care so that the soldering is uniform and free of
defects such as heat shock.
C1,000pF
R230
Capacitance Meter
45
Fig. b.
20
Class I
1,000pF
50
Pressurizing speed : 1.0mm/sec.
Pressurize
45
Flexure : 1mm
12 Solderability of Termination 90% of the terminations are to be soldered evenly and
continuously.
Immerse the test capacitor into a methanol solution containing rosin for 3 to 5 seconds, preheat it 150 to 180for 2 to 3
minutes and immerse it into Sn-3.0Ag-0.5Cu solder of 245 ± 5 for 3±1seconds.
Darfon Product Specification 5
Page 18
Electronics Corp.
Multi-Layer Ceramic Capacitor C-S1-7-00
Continued from previous page.
Specification
Temp. compensating type
Test Method
*Preheat the capacitor at 120 to 150 for 1 minute.
Immerse the capacitor in a SAC305(Sn96.5Ag3.0Cu0.5)
solder solution at 270±5 for 10±1 seconds. Let sit at room
temperature for 24±2 hours (temperature compensating type)
or 48±4 hours (high dielectric constant type), then measure.
* Preheat 150 to 200 for size℃≧3216.
Initial measurement : perform a heat treatment at 150+0/-10
for one hour and then let sit for 48±4 hours at room
temperature. Perform the initial measurement.
Solder the capacitor to supporting jig (glass epoxy board) and
perform the five cycles according to the four heat treatments
listed in the following table. Let sit for 24±2hrs at room
temperature, then measure.
Step 1: Minimum operating temperature 30±3min
Step 2: Room temperature 2~3 min
Step 3: Maximum operating temperature 30±3min
Step 4: Room temperature 2~3min
13 Resistance to
Soldering Heat
14 Temperature cycle
(Thermal shock)
Item
Appearance No marking defects
Cap. Change NP0 within ±2.5% or 0.25pF ( whichever is larger )
Q/D.F. If C30pF, DF1/(400+20C)
If C >30pF, DF≦0.1%
I.R. I.R.10,000M or RiCR≧500-F.
(whichever is smaller)
Appearance No marking defects
Cap. Change NP0 within ±2.5% or 0.25pF ( whichever is larger )
Q/D.F. If C30pF, DF1/(400+20C)
If C >30pF, DF≦0.1%
I.R. I.R.10,000M or RiCR≧500-F.
(whichever is smaller)
15 Humidity load
16 High temperature
load life test
Appearance No marking defects
Cap. Change NP0 within ±7.5% or 0.75pF ( whichever is larger )
Q/D.F.
I.R. I.R.500M or RiCR≧25-F.
Appearance No marking defects
Cap. Change NP0 within ±7.5% or 0.75pF ( whichever is larger )
Q/D.F.
I.R. More than 1GΩ or RiCr≧50 -F (whichever is less.)
If C30pF, DF≦0.5%
If C30pF,D1/(100+10xC/3) C in pF
(whichever is smaller)
If C30pF, DF≦0.3%
If 10pF<C30pF, DF≦1/(275+5xC/2)
If C10pF, DF1/(200+10C), C in pF
Apply the rated voltage a t 40±2 and 90 to 95% humidity for
500±12 hours. Remove and let sit for 24±2 hours (temperature
compensating type) or 48±4 hours (high dielectric constant
type) at room temperature, then measure.
The charge / discharge current is less than 50mA.
Apply 200% of the rated voltage for 1000±12 hours at the
maximum operating temperature ± 3℃. Let sit for 24± 2 hours
(temperature compensating type) or 48±4 hours (high dielectric
constant type) at room temperature, then measure.
The charge/discharge current is less than 50mA.
Darfon Product Specification 6
Page 19
Electronics Corp.
Multi-Layer Ceramic Capacitor C-C1-1-00
Typical Characteristic Curves
Temperature Coefficient
Class 1 (Temperature Compensation series)
Temperature Coefficient of Temperature Compensation Series
0.40
0.30
0.20
C/C (%)
0.10
0.00
-0.10
Capacitance Change,
-0.20
-0.30
-0.40
-80 -60 -40 -20 0 20 40 60 80 100 120 140
HP 4278A at 1MHz, 1Vrms
C 1
NP0
Temperature (℃)
Darfon Product Specification 1 Rev.: 0
Page 20
Electronics Corp.
X7RX
X
R
Multi-Layer Ceramic Capacitor C-C1-1-00
Class 2 (High Dielectric Constant Series)
Temperature Coefficient of High Dielectric Constant Series
40
HP 4278A at 1KHz, 1Vrms
20
0
C/C (%)
-20
-40
-60
Capacitance Change,
-80
-100
-80 -60 -40 -20 0 20 40 60 80 100 120 140
Capacitance Change vs. DC bias Voltage
Temperature (
C 1
5R
Y5V
)
C/C (%)
ٛ
Capacitance Change,
-100%
Capacitance Change vs. DC Bias
20%
0%
-20%
-40%
-60%
-80%
HP 4284A, 1MHz for NP0 HP 4284A, 1KHz for X5R,X7R,Y5V
NP0
7R / X5
Y5V
0 2 4 6 8 10 12 14 16 18 20
DC Bias (Volt)
Darfon Product Specification 2 Rev.: 0
Page 21
Electronics Corp.
X
X
pF
Multi-Layer Ceramic Capacitor C-C1-1-00
Impedance vs. Frequency
Typical Impedance |Z| vs. Frequency
1000.00
100.00
10.00
Impedance (Ω)
1.00
7R 0603 1nF
7R 0603 10nF
Y5V 0603 0.1uF
NP0 0603 10
NP0 0603 1pFNP0 0603 100pF
HP 4287A+16196A, 0.5V
C 1
0.10
0.01
1 10 100 1000 10000
Frequency (MHz)
Darfon Product Specification 3 Rev.: 0
Page 22
Electronics Corp.
X
Multi-Layer Ceramic Capacitor C-C1-1-00
Aging Rate
10.0
5.0
0.0
-5.0
-10.0
-15.0
Capacitance Change Percent (%)
-20.0
-25.0
-30.0 1 10 100 1000 10000 100000
Typical Curve of Aging Rate of Different Dielectric Material
C 1
NP0
7R, X5R
Y5V
Tim e (Hou rs )
Darfon Product Specification 4 Rev.: 0
Page 23
Electronics Corp.
Multi-Layer Ceramic Capacitor C-A1-4-00
Application Note
Circuit Design
1. Once application and assembly environments have been checked, the capacitor may be used in conformance with the rating and performance, which are provided in both the catalog and the specifications. E xceeding the specifications listed may result in inferior performance. It may also cause a short, open, smoking, or flaming to occur, etc.
2. Please use the capacitors in conformance with the operating temperature provided in both the catalog and the specifications. Be especially cautious not to exceed the maximum temperature. In the situation the maximum temperature set forth in both the catalog and specifications is exceeded, the capacitor’s insulation resistance may deteriorate, power may suddenly surge and short-circuit may occur. The loss of capacitance will occur, and may self-heat due to equivalent series resistance when alternating electric current is passed through. As this effect becomes critical in high frequency circuits, please exercise with caution. When using the capacitor in a (self-heating) circuit, please make sure the surface of the capacitor remains under the maximum temperature for usage. Also, please make certain temperature rise remain below 20 .
3. Please keep voltage under the rated voltage, which is applied to the capacitor. Also, please make certain the peak voltage remains below the rated voltage when AC voltage is super-imposed to the DC voltage. In the situation where AC or pulse voltage is employed, ensure average peak voltage does not exceed the rated voltage. Exceeding the rated voltage provided in both catalog and specifications may lead to defective withstanding voltage or, in worse case situations, may cause the capacitor to burn out.
4. It’s is a common phenomenon of high-dielectric products to have a deteriorated amount of static electricity due to the application of DC voltage.
Storage
1. The chip capacitors shall be packaged in carrier tapes or bulk cases.
2. Keep storage place temperatures from + 5 to +35, humidity from 45 to 70% RH.
3. The storage atmosphere mus t be free of gas containing sulfur and chlorine. Also, avoid exposing the product to saline moisture. If the product is exposed to such atmospheres, the terminations will oxidize and solderability will be affected.
4. The solderability is assured for 12 months from our final inspection date if the above storage condition is followed.
Darfon Product Specification 1 Rev.: 3
Page 24
Electronics Corp.
A
Multi-Layer Ceramic Capacitor C-A1-4-00
Handling
Chip capacitors should be handled with care to avoid contamination or damage. The use of vacuum pick-up or plastic tweezers is recommended for manual placement. Tape and reeled packages are suitable for automatic pick and placement machine.
Flux
1. An excessive amount of flux or too rapid temperature rise can causes solvent burst, solder can generate a large quantity of gas. The gas can spreads small solder particles to cause solder balling effect or bridging problem.
2. Flux containing too high of a percentage of halide may cause corrosion of termination unless sufficient cleaning is applied.
3. Use rosin-type flux. Highly acidic flux (halide content less than 0.2wt%) is not recommended.
4. The water soluble flux causes deteriorated in sulation resistance between outer terminations unless sufficiently cleaned.
Component Spacing
For wave soldering components, the spacing must be sufficient far apart to prevent bridging or shadowing. This is not so important for reflow process but sufficient space for rework should be considered. The suggested spacing for reflow soldering and wave soldering is 0.5mm and 1.0mm, respectively.
Solder Fillet
Too much solder amount may increase solder stress and cause crack risk. Insufficient solder amount may reduce adhesive strength and cause parts falling off PCB. When soldering, confirm that the solder is placed over 0.2mm of the surface of the terminations.
Joint
Land
Resist
Max. buildup
Min. buildup
0.20mm Min.
PCB
dhesive
Darfon Product Specification 2 Rev.: 3
Page 25
Electronics Corp.
Multi-Layer Ceramic Capacitor C-A1-4-00
Recommended Land Pattern Dimensions
When mounting the capacitor to substrate, it’s important to consider carefully that the amount of solder (size of fillet) used has a direct effect upon the capacitor once it’s mounted.
1. The greater the amount of solder, the greater the stress to the elements. As this may cause the substrate to break or crack.
2. In the situation where two or more dev ices are mounted onto a common land separate the device into exclusive pads by using soldering resist.
3. Land width equal to or less than component. It is permissible to reduce land width to 80% of component width.
Land Pattern
b
Size mm (EIA) L x W (mm) a (mm) b (mm) c (mm)
0603 (0201) 0.6*0.3 0.15 to 0.35 0.2 to 0.3 0.25 to 0.3 1005 (0402) 1.0*0.5 0.3 to 0.5 0.35 to 0.45 0.4 to 0.5 1608 (0603) 1.6*0.8 0.7 to 1.0 0.6 to 0.8 0.7 to 0.8 2012 (0805) 2.0*1.25 1.0 to 1.3 0.7 to 0.9 1.0 to 1.2 3216 (1206) 3.2*1.6 2.1 to 2.5 1.0 to 1.2 1.3 to 1.6 3225 (1210) 3.2*2.5 2.1 to 2.5 1.0 to 1.2 2.0 to 2.5 4520 (1808) 4.5*2.0 3.2 to 3.8 1.2 to 1.4 1.7 to 2.0 4532 (1812) 4.5*3.2 3.2 to 3.8 1.2 to 1.4 2.7 to 3.2
Soldering resist
SMD capacitor
c
a
Darfon Product Specification 3 Rev.: 3
Page 26
Electronics Corp.
0
Multi-Layer Ceramic Capacitor C-A1-4-00
Resin Mold
If a large amount of resin is used for molding the chip, cracks may occur due to contraction stress during curing. To avoid such cracks, use a low shrinkage resin. The insulation resistance of the chip will degrade due to moisture absorption. Use a low moisture absorption resin. Check carefully that the resin does not generate a decomposition gas or reaction gas during the curing process or during normal storage. Such gases may crack the chip capacitor or damage the device itself.
Soldering Profile for SMT Process with SnPb Solder Paste
Reflow Soldering
300
250
200
T
Soldering
220 to 230
Within 10 sec.
200
Gradual Natural Cooling
Temperature (℃)
Preheating
60 sec. min.
120 sec. max.
The difference between solder and chip surface should be controlled as following table. The rate of preheat should not exceed 4/sec and a target of 2/sec is preferred.
Chip Size 3216 and smaller 3225 and above
Preheating T150 T130
Within 40 sec.
Time (sec.)
Darfon Product Specification 4 Rev.: 3
Page 27
Electronics Corp.
Multi-Layer Ceramic Capacitor C-A1-4-00
Wave Soldering
300
250
T
Temperature (℃)
Preheating
0
60 sec. ~ 120 sec.
Soldering
230 to 260
Gradual Natural Cooling
Time (sec.)
5 sec. max.
Soldering Iron
Chip Size 3216 and smaller 3225 and above
Preheating T150 -
1. Soldering iron wattage 20W maximum.
2. Iron-tip diameter  3.0mm maximum.
300 270
Temperature (℃)
Preheating
0
60 sec. ~ 120 sec.
270 to 300
T
Soldering
Gradual Natural Cooling
Time (sec.)
3 sec. max.
Chip Size 3216 and smaller 3225 and above
Preheating T190 T130
Darfon Product Specification 5 Rev.: 3
Page 28
Electronics Corp.
Multi-Layer Ceramic Capacitor C-A1-4-00
Soldering
Reflow Soldering for Lead free T ermination
Soldering
300
240 to 260
Within 10 sec.
250
200
Temperature (℃)
The difference between solder and chip surface should be controlled as following table. The rate of preheat should not exceed 4/sec and a target of 2/sec is preferred.
Preheating T150 T130
T
Preheating
0
60 sec. min.
120 sec. max.
Chip Size 3216 and smaller 3225 and above
Over 200 Within 90 sec.
Gradual Natural Cooling
Time (sec.)
Flow Soldering for Lead free Termination
300
250
200
T
Soldering
240 to 260
Gradual Natural Cooling
Temperature (℃)
Preheating
60 sec. ~ 120 sec.
3 ~ 5 sec.
Time (sec.)
Chip Size 3216 and smaller 3225 and above
Preheating T150 -
Darfon Product Specification 6 Rev.: 3
Page 29
Electronics Corp.
Multi-Layer Ceramic Capacitor C-A1-4-00
Soldering Iron
300 270
1. Soldering iron wattage 20W maximum.
2. Iron-tip diameter 3.0mm maximum.
Soldering
270 to 300
Gradual
T
Natural Cooling
Temperature (℃)
Preheating
0
Time (sec.)
60 sec. ~ 120 sec.
3 sec. max.
Chip Size 3216 and smaller 3225 and above
Preheating T190 T130
Darfon Product Specification 7 Rev.: 3
Page 30
Electronics Corp.
Multi-Layer Ceramic Capacitor C-A1-4-00
Chip Layout and Breaking PCB
1. To layout the SMD capacitors for reducing bend stress from board deflection of PCB. The following are
examples of good and bad layout.
Recommended Not Recommended
2. When breaking PCB, the layout should be noted that the mechanical stresses are depending on the position of
capacitors. The following example shows recommendation for better design.
Perforation
E
D
C
Slit
A
B
Magnitude of stresses A > B = C > D > E
Darfon Product Specification 8 Rev.: 3
Page 31
Electronics Corp.
X
Multi-Layer Ceramic Capacitor C-A1-4-00
Aging
The capacitance and dissipation factor of class 2 capacitors decreases with time. It is known as ‘aging’ that follows a logarithmic low and expressed in terms of an aging constant. Aging is caused by a gradual re-alignment of the crystalline structure of the ceramic. The aging constant is defined as the percentage loss of capacitance at a ‘time decade’. The law of capacitance aging is expressed as following equation:
Ct2 = Ct1 x (1 – k x log10(t2/t1)) Ct1: Capacitance after t1 hours of start aging. Ct2: Capacitance after t2 hours of start aging. k: aging constant (capacitance decrease per decade) t1, t2: time in hours from start of aging.
A typical curve of aging rate is shown in following figure.
Typical Curve of Aging Rate of Different Dielectric Material
10.0
5.0
NP0
0.0
-5.0
-10.0
-15.0
Capacitance Change Percent (%)
-20.0
-25.0
-30.0 1 10 100 1000 10000 100000
Time (Hours)
7R, X5R
Y5V
When heating the capacitors above Curie temperature (130℃~150℃) the capacitance can be re-new. So capacitance of class 2 capacitors will be complete de-aged by soldering process; subsequently a new aging process begins. Because of aging, it is specified an age for measurement to meet the prescribed tolerance for class 2 capacitors. Normally, 1000 hours (t2=1000 hrs) is defined.
Darfon Product Specification 9 Rev.: 3
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