
Silicon Epitaxial Planar Z–Diodes
Features
D
Sharp edge in reverse characteristics
D
Low reverse current
D
Low noise
D
Very high stability
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Applications
Voltage stabilization
Absolute Maximum Ratings
Tj = 25_C
Parameter Test Conditions Type Symbol Value Unit
Power dissipation l=4mm, TL=25°C P
Junction temperature T
Storage temperature range T
Maximum Thermal Resistance
Tj = 25_C
Parameter Test Conditions Symbol Value Unit
Junction ambient l=4mm, TL=constant R
thJA
Electrical Characteristics
Tj = 25_C
Parameter Test Conditions Type Symbol Min Typ Max Unit
Forward voltage IF=200mA V
F
stg
V
j
94 9369
1.3 W
175
–65...+175
110 K/W
1 V
°
C
°
C
Document Number 85607
Rev. 3, 01-Apr-99 1 (5)
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Type V
BZX85B... V mA V
1) IZT for VZT and r
Znom
r
zjT
zjk
W W
at I
ZK
mA
IR at V
m
A V %/K
R
TK
2V7 2.7 80 2.64 to 2.76 < 20 < 400 1 < 150 1 –0.08 to –0.05
3V0 3.0 80 2.94 to 3.06 < 20 < 400 1 < 100 1 –0.08 to –0.05
3V3 3.3 80 3.24 to 3.36 < 20 < 400 1 < 40 1 –0.08 to –0.05
3V6 3.6 60 3.52 to 3.68 < 20 < 500 1 < 20 1 –0.08 to –0.05
3V9 3.9 60 3.82 to 3.98 < 15 < 500 1 < 10 1 –0.07 to –0.02
4V3 4.3 50 4.22 to 4.38 < 13 < 500 1 < 3 1 –0.07 to –0.01
4V7 4.7 45 4.60 to 4.80 < 13 < 500 1 < 3 1 –0.03 to +0.04
5V1 5.1 45 5.00 to 5.20 < 10 < 500 1 < 1 1.5 –0.01 to +0.04
5V6 5.6 45 5.48 to 5.72 < 7 < 400 1 < 1 2 0 to +0.045
6V2 6.2 35 6.08 to 6.32 < 4 < 300 1 < 1 3 +0.01 to +0.055
6V8 6.8 35 6.66 to 6.94 < 3.5 < 300 1 < 1 4 +0.015 to +0.06
7V5 7.5 35 7.35 to 7.65 < 3 < 200 0.5 < 1 4.5 +0.02 to +0.065
8V2 8.2 25 8.04 to 8.36 < 5 < 200 0.5 < 1 6.2 0.03 to 0.07
9V1 9.1 25 8.92 to 9.28 < 5 < 200 0.5 < 1 6.8 0.035 to 0.075
10 10 25 9.80 to 10.20 < 7 < 200 0.5 < 0.5 7.5 0.04 to 0.08
11 11 20 10.78 to 11.22 < 8 < 300 0.5 < 0.5 8.2 0.045 to 0.08
12 12 20 11.76 to 12.24 < 9 < 350 0.5 < 0.5 9.1 0.045 to 0.085
13 13 20 12.74 to 13.26 < 10 < 400 0.5 < 0.5 10 0.05 to 0.085
15 15 15 14.70 to 15.30 < 15 < 500 0.5 < 0.5 11 0.055 to 0.09
16 16 15 15.70 to 16.30 < 15 < 500 0.5 < 0.5 12 0.055 to 0.09
18 18 15 17.64 to 18.36 < 20 < 500 0.5 < 0.5 13 0.06 to 0.09
20 20 10 19.60 to 20.40 < 24 < 600 0.5 < 0.5 15 0.06 to 0.09
22 22 10 21.55 to 22.45 < 25 < 600 0.5 < 0.5 16 0.06 to 0.095
24 24 10 23.5 to 24.5 < 25 < 600 0.5 < 0.5 18 0.06 to 0.095
27 27 8 26.4 to 27.6 < 30 < 750 0.25 < 0.5 20 0.06 to 0.095
30 30 8 29.4 to 30.6 < 30 < 1000 0.25 < 0.5 22 0.06 to 0.095
33 33 8 32.4 to 33.6 < 35 < 1000 0.25 < 0.5 24 0.06 to 0.095
36 36 8 35.3 to 36.7 < 40 < 1000 0.25 < 0.5 27 0.06 to 0.095
39 39 6 38.2 to 39.8 < 50 < 1000 0.25 < 0.5 30 0.06 to 0.095
VZ
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Rev. 3, 01-Apr-992 (5)

Characteristics (Tj = 25_C unless otherwise specified)
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2.0
1.6
1.2
l=4mm
0.8
l=20mm
0.4
tot
P – Total Power Dissipation ( W )
l=10mm
0
200
95 9612
–50
0 50 100 150
T
– Ambient Temperature ( °C )
amb
Figure 1. Total Power Dissipation vs. Ambient Tempera-
ture
250
200
150
100
ll
1000
100
VR=20V
10
D
C – Diode Capacitance ( pF )
VR=30V
f=1 MHz
T
=25°C
amb
1
010203040
95 9616
VZ – Z-Voltage ( V )
Figure 3. Diode Capacitance vs. Z–Voltage
1000
W
100
10
IZ=1mA
2mA
5mA
10mA
20mA
VR=0V
VR=2V
VR=5V
50
60
50
TL=constant
25
thJA
R – Therm. Resist. Junction / Ambient ( K/W )
95 9613
0
0 5 10 15 20
l – Lead Length ( mm )
Figure 2. Thermal Resistance vs. Lead Length
1000
100
tp/T=0.1
tp/T=0.05
tp/T=0.02
tp/T=0.5
tp/T=0.2
10
Single Pulse
1
thp
Z – Thermal Resistance for Pulse Cond. (K/W)
–1
10
0
10
Figure 5. Thermal Response
30
tp/T=0.01
tp – Pulse Length ( ms )95 9614
Z
r – Differential Z-Resistance ( )
1
110
95 9615
VZ – Z-Voltage ( V )
Figure 4. Differential Z–Resistance vs. Z–Voltage
R
=110K/W
thJA
D
T=T
jmax–Tamb
iZM=(–VZ+(V
1
10
2
+4rzjDT/Z
Z
2
10
thp
1/2
)
)/(2rzj)
100
3
10
Document Number 85607
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Rev. 3, 01-Apr-99 3 (5)

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Dimensions in mm
technical drawings
according to DIN
specifications
Standard Glass Case
54 B 2 DIN 41880
JEDEC DO 41
Weight max. 0.3g
∅ 0.85 max.
Cathode Identification
4.1 max.26 min.
94 9368
∅ 2.5 max.
26 min.
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Rev. 3, 01-Apr-994 (5)

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Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as their
impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. V arious national and international initiatives are pressing for an earlier ban
on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of
ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer application
by the customer. Should the buyer use Vishay-Telefunken products for any unintended or unauthorized application, the
buyer shall indemnify Vishay-Telefunken against all claims, costs, damages, and expenses, arising out of, directly or
indirectly , any claim of personal damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423
Document Number 85607
Rev. 3, 01-Apr-99 5 (5)
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