Datasheet BZG04-9V1, BZG04-8V2, BZG04-82, BZG04-75, BZG04-68 Datasheet (Philips)

...

Download

Page 1

DISCRETE SEMICONDUCTORS

DATA SH EET

handbook, halfpage

M3D168

BZG04 series

Transient voltage suppressor diodes

Preliminary speciﬁcation Supersedes data of 1996 Jun 10 File under Discrete Semiconductors, SC01

1996 Sep 19

Page 2

Philips Semiconductors Preliminary speciﬁcation

Transient voltage suppressor diodes BZG04 series

FEATURES

• Glass passivated

• High maximum operating

DESCRIPTION

DO-214AC surface mountable package with glass passivated chip.

The well-defined void-free case is of a transfer-moulded thermo-setting plastic.

temperature

• Low leakage current

• Excellent stability

• UL 94V-O classified plastic

handbook, 4 columns

cathode band

package

• Transient suppressor stand-off voltage range:

8.2 to 220 V for 32 types

• Shipped in 12 mm embossed tape.

Top view Side view

MSA473

Fig.1 Simplified outline (DO-214AC; SOD106) and symbol.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

RSM

non-repetitive peak reverse power dissipation

10/1000 µs exponential pulse (see Fig.4); Tj=25°C prior to

− 300 W

surge; see also Fig.2

stg

storage temperature −65 +175 °C junction temperature −65 +175 °C

1996 Sep 19 2

Page 3

Philips Semiconductors Preliminary speciﬁcation

Transient voltage suppressor diodes BZG04 series

ELECTRICAL CHARACTERISTICS Total series

=25°C unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

Per type

= 25°C unless otherwise specified.

TYPE

NUMBER

BZG04-8V2 9.4 0.05 0.09 50 14.8 20.3 20 8.2 BZG04-9V1 10.4 0.05 0.10 50 15.7 19.1 5 9.1 BZG04-10

BZG04-1 1 BZG04-12 BZG04-13 BZG04-15 BZG04-16 BZG04-18 BZG04-20 BZG04-22 BZG04-24 BZG04-27 BZG04-30 BZG04-33 BZG04-36 BZG04-39 BZG04-43 BZG04-47 BZG04-51 BZG04-56 BZG04-62 BZG04-68 BZG04-75 BZG04-82 BZG04-91 BZG04-100

forward voltage IF= 0.5 A; see Fig.3 − 1.2 V

REVERSE

BREAKDOWN

VOLTAGE

(V)

(BR)R

at I

test

TEMPERATURE

COEFFICIENT

SZ(%/K) at I

test

TEST

CURRENT

test

(mA)

(CL)R

CLAMPING

VOLTAGE

(V)

at I

note 1

RSM

REVERSE CURRENT

at STAND-OFF

VOLTAGE

(µA)

(A)

MIN. MIN. MAX. MAX. MAX.

1 1.4 0.05 0.10 50 17.0 17.7 5 10

12.4 0.05 0.10 50 18.9 15.9 5 11

13.8 0.05 0.10 50 20.9 14.4 5 12

15.3 0.06 0.1 1 25 22.9 13.1 5 13

16.8 0.06 0.1 1 25 25.6 11.7 5 15

18.8 0.06 0.1 1 25 28.4 10.6 5 16

20.8 0.06 0.1 1 25 31.0 9.7 5 18

22.8 0.06 0.1 1 25 33.8 8.9 5 20

25.1 0.06 0.1 1 25 38.1 7.9 5 22 28 0.06 0.1 1 25 42.2 7.1 5 24 31 0.06 0.1 1 25 46.2 6.5 5 27 34 0.06 0.1 1 10 50.1 6.0 5 30 37 0.06 0.1 1 10 54.1 5.5 5 33 40 0.07 0.12 10 60.7 4.9 5 36 44 0.07 0.12 10 65.5 4.6 5 39 48 0.07 0.12 10 70.8 4.2 5 43 52 0.07 0.12 10 78.6 3.8 5 47 58 0.08 0.13 10 86.5 3.5 5 51 64 0.08 0.13 10 94.4 3.2 5 56 70 0.08 0.13 10 103.5 2.9 5 62 77 0.08 0.13 10 114 2.6 5 68 85 0.09 0.13 5 126 2.4 5 75 94 0.09 0.13 5 139 2.2 5 82

104 0.09 0.13 5 152 2.0 5 91

1 14 0.09 0.13 5 167 1.8 5 100

at V

(V)

1996 Sep 19 3

Page 4

Philips Semiconductors Preliminary speciﬁcation

Transient voltage suppressor diodes BZG04 series

TYPE

NUMBER

REVERSE

BREAKDOWN

VOLTAGE

(V)

(BR)R

at I

test

TEMPERATURE

COEFFICIENT

SZ(%/K) at I

test

TEST

CURRENT

test

(mA)

(CL)R

CLAMPING

VOLTAGE

(V)

at I

note 1

RSM

REVERSE CURRENT

at STAND-OFF

VOLTAGE

(µA)

(A)

at V

MIN. MIN. MAX. MAX. MAX.

BZG04-110 BZG04-120 BZG04-130 BZG04-150 BZG04-160 BZG04-180 BZG04-200

124 0.09 0.13 5 185 1.6 5 110 138 0.09 0.13 5 204 1.5 5 120 153 0.09 0.13 5 224 1.3 5 130 168 0.09 0.13 5 249 1.2 5 150 188 0.09 0.13 5 276 1.1 5 160 208 0.09 0.13 2 305 1.0 5 180 228 0.09 0.13 2 336 0.9 5 200

BZG04-220 251 0.09 0.13 2 380 0.8 5 220

Note

1. Non-repetitive peak reverse current in accordance with

“IEC 60-1, Section 8”

(10/1000 µs pulse); see Fig.4.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R R

th j-tp th j-a

thermal resistance from junction to tie-point 25 K/W thermal resistance from junction to ambient note 1 100 K/W

note 2 150 K/W

(V)

Notes

1. Device mounted on an Al

printed-circuit board, 0.7 mm thick; thickness of Cu-layer ≥35 µm, see Fig.5.

2O3

2. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.5.

For more information please refer to the

‘General Part of Handbook SC01’

1996 Sep 19 4

Page 5

Philips Semiconductors Preliminary speciﬁcation

Transient voltage suppressor diodes BZG04 series

GRAPHICAL DATA

handbook, halfpage

ZSM

(W)

−2

Tj=25°C prior to surge.

−1

1tp (ms)

Fig.2 Maximum non-repetitive peak reverse

power dissipation as a function of pulse duration (square pulse).

MBH452

handbook, halfpage

F

(A)

Tj=25°C.

MBH453

VF (V)

Fig.3 Forward current as a function of forward

voltage; typical values.

handbook, halfpage

RSM

(%)

100

In accordance with t1=10µs. t2= 1000µs.

“IEC 60-1, Section8”

Fig.4 Non-repetitive peak reverse current pulse

definition.

MGD521

4.5

2.5

1.25

Dimensions in mm.

MSB213

Fig.5 Printed-circuit board for surface mounting.

1996 Sep 19 5

Page 6

Philips Semiconductors Preliminary speciﬁcation

Transient voltage suppressor diodes BZG04 series

PACKAGE OUTLINE

5.5

handbook, full pagewidth

2.3

2.0

0.05

5.1

4.5

4.3

2.8

1.6

2.4

1.4

Dimensions in mm. The marking band indicates the cathode.

3.3

2.7

Fig.6 DO-214AC; SOD106.

0.2

MSA414

1996 Sep 19 6

Page 7

Philips Semiconductors Preliminary speciﬁcation

Transient voltage suppressor diodes BZG04 series

DEFINITIONS

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development. Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later. Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

1996 Sep 19 7