Datasheet BZG03C91, BZG03C82, BZG03C75, BZG03C68, BZG03C62 Datasheet (Vishay Telefunken)

Silicon Z–Diodes

Features

D

Glass passivated junction

D

High reliability

D

Voltage range 10V to 270V

D

Fits onto 5 mm SMD footpads

D

Wave and reflow solderable

Applications

Voltage stabilization

BZG03C...

Vishay Telefunken

15 811

Absolute Maximum Ratings

Tj = 25_C

Parameter Test Conditions Type Symbol Value Unit

Power dissipation R

Non repetitive peak surge power
dissipation

Junction temperature T
Storage temperature range T

<25K/W, T

thJA

R

<100K/W, T

thJA

tp=100ms sq.pulse, Tj=25°C
prior to surge

=100°C P

amb

=50°C P

amb

P

V
V

ZSM

j

stg

3 W

1.25 W
600 W

175

–65...+150

Maximum Thermal Resistance

Tj = 25_C

Parameter Test Conditions Symbol Value Unit
Junction lead R
Junction ambient mounted on epoxy–glass hard tissue, Fig. 1a R

mounted on epoxy–glass hard tissue, Fig. 1b R
mounted on Al–oxid–ceramic (Al2O3), Fig. 1b R

thJL
thJA
thJA
thJA

25 K/W
150 K/W
125 K/W
100 K/W

Electrical Characteristics

Tj = 25_C

Parameter Test Conditions Type Symbol Min Typ Max Unit

Forward voltage IF=0.5A V

F

°
°

1.2 V

C
C

Document Number 85593
Rev. 5, 01-Apr-99 1 (5)

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BZG03C...

y

BZG03C

Vishay Telefunken

Type

...

Min. Typ. Max. Typ. Max. Typ. Max. Max.
10 9.4 10 10.6 2 4 0.05 0.09 50 10 7.5
11 10.4 11 11.6 4 7 0.05 0.10 50 4 8.2
12 11.4 12 12.7 4 7 0.05 0.10 50 3 9.1
13 12.4 13 14.1 5 10 0.05 0.10 50 2 10
15 13.8 15 15.6 5 10 0.05 0.10 50 1 11
16 15.3 16 17.1 6 15 0.06 0.11 25 1 12
18 16.8 18 19.1 6 15 0.06 0.11 25 1 13
20 18.8 20 21.2 6 15 0.06 0.11 25 1 15
22 20.8 22 23.3 6 15 0.06 0.11 25 1 16
24 22.8 24 25.6 7 15 0.06 0.11 25 1 18
27 25.1 27 28.9 7 15 0.06 0.11 25 1 20
30 28 30 32 8 15 0.06 0.11 25 1 22
33 31 33 35 8 15 0.06 0.11 25 1 24
36 34 36 38 21 40 0.06 0.11 10 1 27
39 37 39 41 21 40 0.06 0.11 10 1 30
43 40 43 46 24 45 0.07 0.12 10 1 33
47 44 47 50 24 45 0.07 0.12 10 1 36
51 48 51 54 25 60 0.07 0.12 10 1 39
56 52 56 60 25 60 0.07 0.12 10 1 43
62 58 62 66 25 80 0.08 0.13 10 1 47
68 64 68 72 25 80 0.08 0.13 10 1 51
75 70 75 79 30 100 0.08 0.13 10 1 56
82 77 82 87 30 100 0.08 0.13 10 1 62
91 85 91 96 60 200 0.09 0.13 5 1 68

100 94 100 106 60 200 0.09 0.13 5 1 75
110 104 110 116 80 250 0.09 0.13 5 1 82
120 114 120 127 80 250 0.09 0.13 5 1 91
130 124 130 141 110 300 0.09 0.13 5 1 100
150 138 150 156 130 300 0.09 0.13 5 1 110
160 158 160 171 150 350 0.09 0.13 5 1 120
180 168 180 191 180 400 0.09 0.13 5 1 130
200 188 200 212 200 500 0.09 0.13 5 1 150
220 208 220 233 350 750 0.09 0.13 2 1 160
240 228 240 256 400 850 0.09 0.13 2 1 180
270 251 270 289 450 1000 0.09 0.13 2 1 200

V

Z

V

rzj and TKVZ at I

W

%/K mA

Z

IR at V

m

A V

R

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Rev. 5, 01-Apr-992 (5)

Characteristics (Tj = 25_C unless otherwise specified)

BZG03C...

Vishay Telefunken

a) b)

2.0

1.5

10.0

25.0

94 9313

Figure 1. Boards for R

(copper overlay 35m)

2.6

5.0

definition

thJA

25.0

1.0

2.0

3.0

2.5

2.0

1.5

1.0

F

I – Forward Current ( A )

0.5

0

0 0.5 1.0 1.5

94 9581

VF – Forward Voltage ( V )

Figure 4. Forward Current vs. Forward Voltage

10000

1000

Dissipation ( W )

100

2.0

2.4 2.2

7.0

94 9314

Figure 2. Recommended foot pads (in mm)

4

3

R

=25K/W

thJA

2

R

=100K/W

thJA

1

tot

P – Total Power Dissipation ( W )

0

0

40 80 120 160

94 9580

T

– Ambient Temperature ( °C )

amb

Figure 3. Total Power Dissipation vs.

Ambient Temperature

2.4

200

ZSM

P – Non-Repetitive Surge Power

10

0.01 0.1 1 10

94 9582

tp – Pulse Length ( ms )

100

Figure 5. Non Repetitive Surge Power Dissipation

vs. Pulse Length

Document Number 85593
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BZG03C...

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1000

100

tp/T=0.5
tp/T=0.2

10

tp/T=0.1

tp/T=0.05
tp/T=0.02

1

thp

Z – Thermal Resistance for Pulse Cond. (K/W)

–5

10

Figure 6. Thermal Response

Dimensions in mm

–4

10

tp/T=0.01

–3

10

–2

10
tp – Pulse Length ( s )94 9583

–1

10

0

10

1

10

2

10

14275

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BZG03C...

Vishay Telefunken

Ozone Depleting Substances Policy Statement

It is the policy of Vishay Semiconductor GmbH to

1. Meet all present and future national and international statutory requirements.

2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as their

impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as

ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and

forbid their use within the next ten years. V arious national and international initiatives are pressing for an earlier ban
on these substances.

Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of
ODSs listed in the following documents.

1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively

2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA

3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.

Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.

We reserve the right to make changes to improve technical design and may do so without further notice.

Parameters can vary in different applications. All operating parameters must be validated for each customer application

by the customer. Should the buyer use Vishay-Telefunken products for any unintended or unauthorized application, the

buyer shall indemnify Vishay-Telefunken against all claims, costs, damages, and expenses, arising out of, directly or

indirectly , any claim of personal damage, injury or death associated with such unintended or unauthorized use.

Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany

Telephone: [phone], Fax number: 49 (0)7131 67 2423

Document Number 85593
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