Datasheet BYW81PI-200, BYW81P-200 Datasheet (SGS Thomson Microelectronics)

Page 1
BYW81P-200
BYW81PI-200
HIGH EFFICIENCY FAST RECOVERY RECTIFIER DIODES
FEATURES
Insulatingvoltage= 2500 V Capacitance= 7 pF
DESCRIPTION
Single chip rectifier suited for switchmode power supplyand highfrequencyDC to DC converters. Packagedin TO-220ACthis device is intended for use in low voltage, high frequency inverters, free wheelingand polarityprotectionapplications.
RMS
K
TO-220AC
(Plastic)
BYW81P-200
A
isolated
TO-220AC
(Plastic)
BYW81PI-200
A
K
ABSOLUTE MAXIMUMRATINGS
Symbol Parameter Value Unit
I
F(RMS)
I
F(AV)
I
FSM
Tstg
Tj
RMSforward current Averageforward current
δ = 0.5
BYW81P Tc=115°C BYW81PI Tc=90°C
Surgenon repetitiveforwardcurrent
Storageand junctiontemperaturerange
tp=10ms sinusoidal
35 A 15 A
15
200 A
- 40 to+ 150
- 40 to+ 150
Symbol Parameter Value Unit
V
RRM
October 1999 - Ed: 2D
Repetitivepeakreverse voltage
200 V
°C °C
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Page 2
BYW81P-200/ BYW81PI-200
THERMALRESISTANCE
Symbol Parameter Value Unit
Rth(j-c)
Junctionto case
BYW81P
BYW81PI
2.0 °C/W
3.5
ELECTRICAL CHARACTERISTICS STATICCHARACTERISTICS
Symbol TestConditions Min. Typ. Max. Unit
I
*
R
V
F**
Pulse test : * tp = 5 ms, duty cycle < 2 %
=25°CV
T
j
T
= 100°C
j
Tj= 125°CI
T
= 125°CI
j
T
=25°CI
j
** tp = 380µs, duty cycle < 2 %
=V
R
RRM
=12A
F
=25A
F
=25A
F
20
1.5 mA
0.85 V
1.05
1.15
µ
A
To evaluatethe conductionlossesuse thefollowing equation: P = 0.65x I
F(AV)
+0.016 x I
F2(RMS)
RECOVERYCHARACTERISTICS
Symbol TestConditions Min. Typ. Max. Unit
trr T
tfr T
V
FP
=25°CI
j
=25°CI
j
Tj=25°CI
=0.5A
F
=1A
I
R
I
=1A
F
=30V
V
R
=1A
F
=1.1 x V
V
FR
=1A tr = 10 ns 2 V
F
Irr = 0.25A 25 ns
dI
/dt = -50A/µs40
F
tr=10ns 15 ns
F
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Page 3
BYW81P-200/ BYW81PI-200
Fig.1 : Average forward power dissipation versus
averageforward current.
P
F(av)(W)
20.0
17.5
=0.05
=0.1
=0.2
=0.5
=1
15.0
12.5
10.0
7.5
T
5.0
2.5
0.0 0 2.5 5 7.5 10 12.5 15 17.5 20
Fig.3 :
Forward voltage drop versus forward
I
F(av)(A)
=tp/T
tp
current(maximumvalues).
VFM(V)
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.1 1 10 100 200
Tj=125 C
o
IFM(A)
Fig.2: Peakcurrent versusform factor.
I
M(A)
350 300
T
250 200 150 100
P=10W
P=20W
P=30W
=tp/T
tp
50
0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Fig.4 :
Relative variation of thermal impedance
junctionto case versuspulse duration.
K
1.0
Zth(j-c) (tp. )
K=
Rth(j-c)
0.5
0.2
0.1
=0.5
=0.2
=0.1
T
Single pulse
tp(s)
1.0E-03 1.0E-02 1.0E-01 1.0E+00
=tp/T
I
M
tp
Fig.5 :
Non repetitive surge peak forward current versusoverloadduration. (BYW81P)
I
M(A )
160 150 140 130 120 110 100
90 80 70 60 50
IM
40 30 20 10
0
0.001 0.01 0.1 1
t =0.5
t(s)
Tc=25 C
Tc=75 C
Tc=115 C
Fig.6 :
Non repetitive surge peak forward current versusoverloadduration. (BYW81PI)
I
M(A)
120 110 100
90 80
o
o o
70 60 50 40
IM
30 20 10
0
0.001 0.01 0.1 1
t =0.5
t(s)
o
Tc=25 C
Tc=60 C
o
Tc=90 C
o
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Page 4
BYW81P-200/ BYW81PI-200
Fig.7 :
Average current versus ambient temperature. (dutycycle : 0.5) (BYW81P)
I
F(av)(A)
16 15 14 13 12 11 10
9 8 7 6 5 4 3 2 1 0
0 20 40 60 80 100 120 140 160
Rth(j-a)=15 C/W
=0.5
T
=tp/T
tp
Rth(j-a)=Rth(j-c)
o
Tamb( C)
o
Fig.9 : Junction capacitance versus reverse
voltageapplied(Typical values).
C(pF)
120 115 110 105 100
95 90 85 80
F=1Mhz Tj=25 C
VR(V)
1
10 30 50 70
o
Fig.8 :
Average current versus ambient temperature. (dutycycle : 0.5) (BYW81PI)
I
F(av)(A)
16 15 14 13 12 11 10
9 8 7
=0.5
6 5 4 3 2
=tp/T
1 0
0 20 40 60 80 100 120 140 160
Rth(j-a)=15 C/W
T
tp
o
Tamb( C)
Rth(j-a)=Rth(j-c)
o
Fig.10: Recoverychargesversus dIF/dt.
QRR(nC)
60
90%CONFIDENCE
IF=IF(av)
50
O
40
30
20
10
Tj=100 C
Tj=25 C
O
dIF/dt(A/us)
0
11020406080
Fig.11:
3.0
2.5
Peakreversecurrent versus dIF/dt.
IRM(A)
90%CONFIDENCE
IF=IF(av)
Tj=100 C
2.0
1.5
1.0
0.5
0.0 110
Tj=25 C
dIF/dt(A/us)
20 40 60 80
4/6
Fig.12 :
Dynamic parameters versus junction
temperature.
QRR;IRM[Tj]/QRR;IRM[Tj=125 C]
1.50
O
1.25
1.00
IRM
0.75
0.50
O
0.25
0.00 0 255075100125150
o
Tj( C)
o
QRR
Page 5
PACKAGEMECHANICAL DATA
TO-220AC(JEDECoutline)
BYW81P-200/ BYW81PI-200
H2
L5
ØI
L6
L2
L9
F1
L4
F
G
Marking
: Typenumber Coolingmethod : C Weight: 1.9 g Recommendedtorque value: 0.8m.N Maximumtorquevalue : 1.0m.N
A
C
REF.
Millimeters Inches
DIMENSIONS
Min. Max. Min. Max.
L7
A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
D
G 4.95 5.15 0.194 0.202
H2 10.00 10.40 0.393 0.409
L2 16.40typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116
M
E
L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
Diam.I 3.75 3.85 0.147 0.151
PACKAGEMECHANICAL DATA
TO-220AC(isolated)
B
I
A
a2
Marking
e
: Typenumber
L
F
a1
l2
b1
Coolingmethod : C Weight: 2.2g Recommendedtorque value : 0.8m.N Maximumtorquevalue : 1.0m.N
C
b2
REF.
Millimeters Inches
DIMENSIONS
Min. Max. Min. Max.
A 14.23 15.87 0.560 0.625 a1 4.50 0.177 a2 12.70 14.70 0.500 0.579
B 10.20 10.45 0.402 0.411 b1 0.64 0.96 0.025 0.038 b2 1.15 1.39 0.045 0.055
C 4.48 4.82 0.176 0.190 c1 0.35 0.65 0.020 0.026 c2 2.10 2.70 0.083 0.106
e 4.58 5.58 0.180 0.220
F 5.85 6.85 0.230 0.270
I 3.55 4.00 0.140 0.157
c1 c2
L 2.54 3.00 0.100 0.118
l2 1.45 1.75 0.057 0.069
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Page 6
BYW81P-200/ BYW81PI-200
Informationfurnishedis believed to be accurate and reliable.However,STMicroelectronics assumes no responsibility for the consequences of use of such informationnor for any infringementof patents or other rights of thirdparties which may result from its use. No licenseis grantedby implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use ascritical components in life support devices or systems without express written ap­proval of STMicroelectronics.
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