Datasheet BYW81G-200 Datasheet (SGS Thomson Microelectronics)

1/6

BYW81G-200

BYW81P-200 / BYW81PI-200

®

July 2002 - Ed: 3E

HIGH EFFICIENCY FAST RECOVERY RECTIFIER DIODES

TO-220AC

(Plastic)

BYW81P-200

■

SUITED FOR SMPS

■

VERY LOW FORWARD LOSSES

■

NEGLIGIBLE SWITCHING LOSSES

■

HIGH SURGE CURRENT CAPABILITY

■

HIGH AVALANCHE ENERGY CAPABILITY

■

INSULATED VERSION : Insulating voltage = 2500 V

RMS

Capacitance = 7 pF

DESCRIPTION

FEATURES

Single chip rectifier suited for switchmode power supply and high frequency DC to DC converters. Packaged in TO-220AC and D²PAK, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications.

TO-220AC Ins.

(Plastic)

BYW81PI-200

Symbol Parameter Value Unit

I

F(RMS)

RMS forward current

35 A

I

F(AV)

Average forward current δ = 0.5

BYW81P Tc=115°C

15 A

BYW81PI/G Tc=90°C

15

I

FSM

Surge non repetitive forward current

tp=10ms sinusoidal

200 A

Tstg

Tj

Storage and junction temperature range

-40to+150

°C °C

ABSOLUTE MAXIMUM RATINGS

Symbol Parameter Value Unit

V

RRM

Repetitive peak reverse voltage

200 V

K

A

K

A

K

NC

A

D2PAK

(Plastic)

BYW81G-200

BYW81P-200 / BYW81PI-200 / BYW81G-200

2/6

Symbol Test Conditions Min. Typ. Max. Unit

I

R

*

T

j

= 25°C VR=V

RRM

20 µA

T

j

= 100°C

1.5 mA

V

F**

Tj= 125°C IF=12A

0.85 V

T

j

= 125°C IF=25A

1.05

T

j

= 25°C IF=25A

1.15

Pulse test : * tp = 5 ms, duty cycle<2% ** tp = 380 µs, duty cycle<2%

ELECTRICAL CHARACTERISTICS STATIC CHARACTERISTICS

Symbol Test Conditions Min. Typ. Max. Unit

trr T

j

= 25°C IF= 0.5A

IR=1A

Irr = 0.25A 25 ns

I

F

=1A

VR= 30V

dIF/dt = -50A/µs40

tfr T

j

= 25°C IF=1A

VFR=1.1xV

F

tr=10ns 15 ns

V

FP

Tj= 25°C IF=1A tr=10ns 2 V

RECOVERY CHARACTERISTICS

Symbol Parameter Value Unit

Rth (j-c)

Junction to case

BYW81P

2.0 °C/W

BYW81PI / G

3.5

THERMAL RESISTANCE

BYW81P-200 / BYW81PI-200 / BYW81G-200

3/6

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

0

50

100

150

200

250

300

350

T

I

M

=tp/T

tp

I

M(A)

P=10W

P=20W

P=30W

Fig. 2: Peak current versus form factor.

0.1 1 10 100 200

Tj=125 C

o

IFM(A)

VFM(V)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

Fig. 3: Forward voltage drop versus forward current (maximum values).

0.1

1.0

0.2

0.5

Zth(j-c) (tp. )

K=

Rth(j-c)

=0.5

=0.2

=0.1

Single pulse

tp(s)

T

=tp/T

tp

1.0E-03 1.0E-02 1.0E-01

1.0E+00

K

Fig. 4: Relative variation of thermal impedance junction to case versus pulse duration.

0 2.5 5 7.5 10 12.5 15 17.5 20

0.0

2.5

5.0

7.5

10.0

12.5

15.0

17.5

20.0

=0.05

=0.1

=0.2

=0.5

T

=tp/T

tp

I

F(av)(A)

P

F(av)(W)

=1

Fig. 1: Average forward power dissipation versus average forward current.

0.001 0.01 0.1 1

0

10

20

30

40

50

60

70

80

90

100

110

120

IM

t =0.5

t(s)

I

M(A)

Tc=25 C

o

Tc=60 C

o

Tc=90 C

o

Fig. 6: Non repetitive surge peak forward current versus overload duration. (BYW81PI / BYW81G)

0.001 0.01 0.1 1

0

10

20

30

40

50

60

70

80

90

100

110

120

130

140

150

160

IM

t =0.5

t(s)

I

M(A)

Tc=25 C

o

Tc=75 C

o

Tc=115 C

o

Fig. 5: Non repetitive surge peak forward current versus overload duration. (BYW81P)

BYW81P-200 / BYW81PI-200 / BYW81G-200

4/6

0 20 40 60 80 100 120 140 160

0

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

T

=tp/T

tp

=0.5

F(av)(A)

I

o

Tamb( C)

Rth(j-a)=15 C/W

o

Rth(j-a)=Rth(j-c)

Fig. 7: Average current versus ambient temperature. (duty cycle : 0.5) (BYW81P)

0 20 40 60 80 100 120 140 160

0

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

T

=tp/T

tp

=0.5

F(av)(A)

I

o

Tamb( C)

Rth(j-a)=15 C/W

o

Rth(j-a)=Rth(j-c)

Fig. 8: Average current versus ambient temperature. (duty cycle : 0.5) (BYW81PI / BYW81G)

1

80

85

10 30 50 70

90

95

100

105

110

115

120

VR(V)

F=1Mhz Tj=25 C

o

C(pF)

Fig. 9: Junction capacitance versus reverse voltage applied (Typical values).

11020406080

0

10

20

30

40

50

60

QRR(nC)

90%CONFIDENCE

Tj=100 C

Tj=25 C

O

IF=IF(av)

dIF/dt(A/us)

Fig. 10: Recovery charges versus dIF/dt.

Tj( C)

QRR;IRM[Tj]/QRR;IRM[Tj=125 C]

0 25 50 75 100 125 150

0.00

0.25

0.50

0.75

1.00

1.25

1.50

IRM

QRR

o

Fig. 12: Dynamic parameters versus junction temperature.

110

0.0

0.5

1.0

1.5

2.0

2.5

3.0

IRM(A)

dIF/dt(A/us)

20 40 60 80

90%CONFIDENCE

Tj=100 C

O

Tj=25 C

O

IF=IF(av)

Fig. 11: Peak reverse current versus dIF/dt.

BYW81P-200 / BYW81PI-200 / BYW81G-200

5/6

■

Marking : Type number

■

Cooling method : C

■

Weight : 2.2 g

■

Recommended torque value : 0.8m.N

■

Maximum torque value : 1.0m.N

PACKAGE MECHANICAL DATA

TO-220AC (JEDEC outline)

■ Marking : Type number

■

Cooling method : C

■

Weight : 1.9 g

■

Recommended torque value : 0.8m.N

■ Maximum torque value : 1.0m.N

PACKAGE MECHANICAL DATA

TO-220AC (isolated)

A

C

D

E

M

L7

H2

Ø I

L5

L6

L9

L4

G

F1

F

L2

REF.

DIMENSIONS

Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107

E 0.49 0.70 0.019 0.027

F 0.61 0.88 0.024 0.034

F1 1.14 1.70 0.044 0.066

G 4.95 5.15 0.194 0.202

H2 10.00 10.40 0.393 0.409 L2 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154

M 2.6 typ. 0.102 typ.

Diam. I 3.75 3.85 0.147 0.151

b1

l2

a1

e

F

L

B

I

A

C

b2

c1

c2

a2

REF.

DIMENSIONS

Millimeters Inches

Min. Max. Min. Max.

A 14.23 15.87 0.560 0.625 a1 4.50 0.177 a2 12.70 14.70 0.500 0.579

B 10.20 10.45 0.402 0.411 b1 0.64 0.96 0.025 0.038 b2 1.15 1.39 0.045 0.055

C 4.48 4.82 0.176 0.190 c1 0.35 0.65 0.020 0.026 c2 2.10 2.70 0.083 0.106

e 4.58 5.58 0.180 0.220

F 5.85 6.85 0.230 0.270

I 3.55 4.00 0.140 0.157 L 2.54 3.00 0.100 0.118 l2 1.45 1.75 0.057 0.069

BYW81P-200 / BYW81PI-200 / BYW81G-200

6/6

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PACKAGE MECHANICAL DATA

D

2

PAK (Plastic)

A

C2

D

R

A2

M

V2

C

A1

G

L

L3

L2

B

B2

E

*

* FLAT ZONE NO LESSTHAN 2mm

REF.

DIMENSIONS

Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009

B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067

C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054

D 8.95 9.35 0.352 0.368

E 10.00 10.40 0.393 0.409

G 4.88 5.28 0.192 0.208

L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069

M 2.40 3.20 0.094 0.126 R 0.40 typ. 0.016 typ.

V2 0° 8° 0° 8°

8.90

3.70

1.30

5.08

16.90

10.30

FOOT PRINT DIMENSIONS (in millimeters)

D²PAK

■

Cooling method: by conduction (method C)