Datasheet BYW29FP-200 Datasheet (SGS Thomson Microelectronics)

Page 1
®
HIGH EFFICIENCY FAST RECOVERY DIODES
MAIN PRODUCT CHARACTERISTICS
BYW29/F/FP/G-200
I
F(AV)
RRM
8A
200 V trr (max) 25 ns V
(max) 0.85 V
F
FEATURES AND BENEFITS
Very Low Forward Losses
Negligible switching losses
High surge current capability
Insulated packages (ISOWATT220AC,
TO-220FPAC): Insulation voltage: 2000 VDC Typical insulation capacitance = 12 pF
DESCRIPTION
Single rectifier suited for Switch Mode Power Supply and high frequency DC to DC converters. Packaged in TO-220AC, ISOWATT220AC, TO-220FPAC and D
2
PAK, this device is intended for use in high frequency inverters, free wheeling and polarity protection applications.
ABSOLUTE MAXIMUM RATINGS
AK
K
A
NC
2
D
PAK
BYW29G-200
K
TO-220AC
BYW29-200
TO-220FPAC
BYW29FP-200
A
ISOWATT220AC
BYW29F-200
A
K
A
K
Symbol Parameter Value Unit
V
RRM
I
F(RMS)
I
F(AV)
Repetitive peak reverse voltage 200 V RMS forward current 16 A Average forward current
δ = 0.5
D2PAK / TO-220AC
ISOWATT220AC
Tc =120°C 8 A
Tc = 100°C
TO-220FPAC
I
FSM
Surge non repetitive forward current (All pins connected)
tp=10ms sinusoidal
80 A
Tstg Storage and junction temperature range - 65 to + 150 °C
Tj Maximum operating junction temperature + 150
May 2002 - Ed: 4B
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BYW29/F/FP/G-200
THERMAL RESISTANCE
Symbol Parameter Value Unit
Rth (j-c) Junction to case thermal resistance TO-220AC
2.8 °C/W
D2PAK ISOWATT220AC 5 TO-220FPAC 5.5
STATIC ELECTRICAL CHARACTERISTICS
Symbol Parameter Test Conditions Min. Typ. Max. Unit
* Reverse leakage current VR=V
I
R
V
F**
Pulse test : * tp = 5 ms, duty cycle<2%
To evaluate the conduction losses use the following equation : P=0.65xI
Forward voltage drop IF=5A Tj= 125°C 0.85 V
** tp = 380 µs, duty cycle<2%
+ 0.040 I
F(AV)
F2(RMS)
RRM
=10A Tj= 125°C 1.05
I
F
=10A Tj=25°C 1.15
I
F
Tj= 25°C 10 µA
= 100°C 0.6 mA
T
j
RECOVERY CHARACTERISTICS
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
rr
Reverse recovery time
Tj= 25°C IF= 0.5A Irr = 0.25 A IR=1A
=25°CI
T
j
=1A
F
25 ns
35
dIF/dt = -50A/µsVR=30V
t
fr
Forward recovery
time
Tj=25°CI
=1A
F
dIF/dt = 100A/µs
15
VFR= 1.1xVFmax
V
FP
Peak forward voltage
Tj=25°CIF=1A dIF/dt = 100A/µs
2
ns
V
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BYW29/F/FP/G-200
Fig.1 : Average forward power dissipation versus
average forward current.
PF(av)(W)
12
10
8
6
4
2
0
01234567891011
δ = 0.05
δ = 0.1
δ = 0.2
IF(av)(A)
δ = 0.5
δ
=tp/T
δ = 1
T
tp
Fig.3 : Forward voltage drop versus forward cur­rent (maximum values).
IFM(A)
100.0
Fig.2 : Peak current versus form factor.
IM(A)
160
140
P = 10W
120
100
80
60
40
20
P= 5W
0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
δ
P = 15W
T
IM
δ
=tp/T
tp
Fig.4-1 : Relative variation of thermal impedance junctiontocaseversus pulse duration (TO-220AC,
2
PAK).
D
Zth(j-c)/Rth(j-c)
1.0
δ = 0.5
10.0
1.0
Tj=125°C
Tj=25°C
VFM(V)
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Fig.4-2 :Relative variation of thermal impedance
junction to case versus pulse duration (TO-220FPAC, ISOWATT220AC).
Zth(j-c)/Rth(j-c)
1.0
δ = 0.5
δ = 0.2
δ = 0.1
0.1
Single pulse
T
tp(s)
0.0
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
δ
=tp/T
tp
δ = 0.2
δ = 0.1
δ
=tp/T
T
2
PAK).
Tc=120°C
tp
Tc=25°C
Tc=75°C
Single pulse
tp(s)
0.1
1.E-03 1.E-02 1.E-01 1.E+00
Fig.5-1 :Nonrepetitive surge peakforwardcurrent
versus overload duration (TO-220AC, D
IM(A)
80
70
60
50
40
30
20
IM
10
0
1.E-03 1.E-02 1.E-01 1.E+00
δ=0.5
t
t(s)
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BYW29/F/FP/G-200
Fig.5-2 : Non repetitive surge peak forward cur-
rent versus overload duration (TO-220FPAC, ISOWATT220AC).
IM(A)
60
50
40
30
20
IM
10
0
1.E-03 1.E-02 1.E-01 1.E+00
δ=0.5
t
t(s)
Tc=25°C
Tc=75°C
Tc=100°C
Fig.7 : Junction capacitance versus reverse volt­age applied (Typical values).
C(pF)
100
F=1MHz
Vosc=30mV
Tj=25°C
Fig.6 : Average current versus ambient tempera­ture. (δ = 0.5)
IF(av)(A)
10
9 8 7 6 5 4 3 2 1 0
0 25 50 75 100 125 150
Rth(j-a)=Rth(j-c)
Rth(j-a)=15°C:W
Tamb(°C)
ISOWATT220AC
TO-220FPAC
TO-220AC/D²PAK
Fig.8 : Reverse recovery charges versus dIF/dt (90%confidence).
Qrr(nC)
1000
IF=8A VR=100V Tj=100°C
VR(V)
10
1 10 100 1000
Fig.9 : Peak reverse recovery current versus
dIF/dt (90% confidence).
IRM(A)
100
IF=8A VR=100V Tj=100°C
10
1
10 100 1000
dIF/dt(A/µs)
100
dIF/dt(A/µs)
10
10 100 1000
Fig.10 : Dynamic parameters versus junction tem-
perature.
Qrr; IRM[Tj] / Qrr; IRM[Tj=125°C]
1.50
IF=8A
VR=100V
1.25
1.00
0.75
0.50
0.25
0.00 0 25 50 75 100 125 150
IRM
QRR
Tj(°C)
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Page 5
Fig.11 : Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35µm) for
2
PAK.
D
Rth(j-a)(°C/W)
80
70
60
50
40
30
20
10
0
02468101214161820
PACKAGE MECHANICAL DATA
2
PAK (Plastic)
D
E
L2
L
L3
G
S(cm²)
A
C2
A1
B2 B
* FLAT ZONE NO LESS THAN 2mm
C
A2
M
*
R
V2
BYW29/F/FP/G-200
DIMENSIONS
REF.
A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009
D
B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067
C 0.45 0.60 0.017 0.024
C2 1.23 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.40 0.393 0.409
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069
M 2.40 3.20 0.094 0.126 R 0.40 typ. 0.016 typ.
V2
Millimeters Inches
Min. Max. Min. Max.
FOOT PRINT (in millimeters)
16.90
10.30
8.90
5.08
1.30
3.70
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BYW29/F/FP/G-200
PACKAGE MECHANICAL DATA
TO-220AC
H2
L5
Ø I
L6
L2
L9
F1
L4
F
G
DIMENSIONS
REF.
Millimeters Inches
Min. Max. Min. Max.
A
C
A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107
L7
E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
D
H2 10.00 10.40 0.393 0.409
L2 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551
M
E
L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154
M 2.6typ. 0.102 typ.
Diam. I 3.75 3.85 0.147 0.151
PACKAGE MECHANICAL DATA
TO-220FPAC
H
Dia
L6
L2
L3
L5
D
L4
G1
G
F1
F
REF. DIMENSIONS
Millimeters Inches
A
B
Min. Max. Min. Max.
A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027
F 0.75 1 0.030 0.039
L7
F1 1.15 1.70 0.045 0.067
G 4.95 5.20 0.195 0.205
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409 L2 16 Typ. 0.63 Typ. L3 28.6 30.6 1.126 1.205 L4 9.8 10.6 0.386 0.417 L5 2.9 3.6 0.114 0.142
E
L6 15.9 16.4 0.626 0.646 L7 9.00 9.30 0.354 0.366
Dia. 3.00 3.20 0.118 0.126
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PACKAGE MECHANICAL DATA
ISOWATT220AC
BYW29/F/FP/G-200
H
A
B
REF.
Millimeters Inches
DIMENSIONS
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
Diam
L6
L2
L3
L7
B 2.50 2.70 0.098 0.106
D 2.40 2.75 0.094 0.108
E 0.40 0.70 0.016 0.028
F 0.75 1.00 0.030 0.039 F1 1.15 1.70 0.045 0.067
G 4.95 5.20 0.195 0.205
F1
H 10.00 10.40 0.394 0.409 L2 16.00 Typ. 0.630 Typ. L3 28.60 30.60 1.125 1.205 L6 15.90 16.40 0.626 0.646
F
G
D E
L7 9.00 9.30 0.354 0.366
Diam 3.00 3.20 0.118 0.126
Type Marking Package Weight Base Qty DeliveryMode
BYW29-200 BYW29-200 TO-220AC 1.86 g 50 Tube
BYW29F-200 BYW29F-200 ISOWATT220AC 2.2 g 50 Tube
BYW29FP-200 BYW29FP-200 TO-220FPAC 2 g 50 Tube
2
BYW29G-200 BYW29G-200 D
Cooling method: by conduction (C)
Recommended torque value (ISOWATT220AC, TO-220FPAC): 0.55 N.m
Maximum torque value: 0.7 N.m
Recommended torque value (TO-220AC): 0.8 N.m
Maximum torque value: 1.0 N.m
Epoxy meets UL94, V0
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© 2002 STMicroelectronics - Printed in Italy - All rights reserved.
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