Rugged glass SOD57 package, using a high temperature alloyed construction.
This package is hermetically sealed and fatigue free as coefficients of
expansion of all used parts are matched.
ka
2/3 page (Datasheet)
MAM047
Fig.1 Simplified outline (SOD57) and symbol.
−1.6A
see Fig.2;
averaged over any 20 ms period;
see also Fig.6
=50°C; PCB mounting
amb
−0.9A
(see Fig. 12); see Fig.3;
averaged over any 20 ms period;
see also Fig.6
T
=65°C; see Fig.5−8A
amb
−20A
Tj=T
VR=V
L = 120 mH; Tj=T
prior to surge;
j max
RRMmax
j max
prior to
−10mJ
surge; inductive load switched off
1996 Jun 072
Page 3
Philips SemiconductorsProduct specification
Fast soft-recovery
BYV97 series
controlled avalanche rectifiers
ELECTRICAL CHARACTERISTICS
T
=25°C unless otherwise specified.
j
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
F
V
(BR)R
I
R
t
rr
C
d
dI
R
-------dt
forward voltageIF= 3 A; Tj=T
I
= 3 A; see Fig.8−−1.65V
F
reverse avalanche
IR= 0.1 mA
; see Fig.81.35V
j max
breakdown voltage
BYV97F1300−−V
BYV97G1500−−V
reverse currentVR=V
RRMmax
;
−− 1µA
see Fig.9
V
R=VRRMmax
; Tj= 165 °C;
−−150µA
see Fig.9
reverse recovery timewhen switched from IF= 0.5 A
−−500ns
to IR= 1 A; measured at
IR= 0.25 A; see Fig.14
diode capacitancef = 1 MHz; VR= 0 V; see Fig.11−35−pF
maximum slope of
reverse recovery current
when switched from I
VR≥ 30 V and dIF/dt = −1A/µs;
= 1 A to
F
−− 5A/µs
see Figs 10 and 13
THERMAL CHARACTERISTICS
SYMBOLPARAMETERCONDITIONSVALUEUNIT
R
R
th j-tp
th j-a
thermal resistance from junction to tie-pointlead length = 10 mm46K/W
thermal resistance from junction to ambientnote 1100K/W
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig. 12.
For more information please refer to the
“General Part of associated Handbook”
.
1996 Jun 073
Page 4
Philips SemiconductorsProduct specification
Fast soft-recovery
controlled avalanche rectifiers
GRAPHICAL DATA
2.0
handbook, halfpage
I
F(AV)
(A)
1.6
1.2
0.8
0.4
0
0200
a =1.57; VR=V
RRMmax
lead length 10 mm
; δ= 0.5.
100
o
T ( C)
tp
MBD419
1.2
handbook, halfpage
I
F(AV)
(A)
0.8
0.4
0
0200
a =1.57; VR=V
Device mounted as shown in Fig.12.
RRMmax
; δ= 0.5.
BYV97 series
100
T ( C)
amb
MBD420
o
Fig.2Maximum permissible average forward
current as a function of tie-point temperature
(including losses due to reverse leakage).
16
I
FRM
(A)
12
8
4
0
2
10
1
10
= 0.05
δ
0.1
0.2
0.5
1
11010
Fig.3Maximum permissible average forward
current as a function of ambient temperature
(including losses due to reverse leakage).
MBD448
2103
t (ms)
p
10
4
Ttp=65°C; R
V
during 1 −δ; curves include derating for T
RRMmax
th j-tp
= 46 K/W.
j max
at V
RRM
= 1400 V.
Fig.4 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
1996 Jun 074
Page 5
Philips SemiconductorsProduct specification
Fast soft-recovery
controlled avalanche rectifiers
10
I
FRM
(A)
8
6
4
2
0
2
10
1
10
δ
0.1
0.2
0.5
11010
= 0.05
1
2103
BYV97 series
MBD442
4
t (ms)
p
10
T
=65°C; R
amb
V
during 1 −δ; curves include derating for T
RRMmax
th j-a
= 100 K/W.
j max
at V
RRM
= 1400 V.
Fig.5 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
handbook, halfpage
3
I (A)
F(AV)
1.57
1.42
RRMmax
a = 32.52
1
; δ = 0.5.
P
(W)
2
1
0
02
a=I
F(RMS)/IF(AV)
; VR=V
Fig.6Maximum steady state power dissipation
MBD428
200
handbook, halfpage
T
j
o
( C)
100
0
02000
Solid line = VR.
Dotted line = V
RRM
; δ = 0.5.
BYV97FBYV97G
1000
V (V)
R
(forward plus leakage current losses,
excluding switching losses) as a function
of average forward current.
Fig.7Maximum permissible junction temperature
as a function of reverse voltage.
MBD433
1996 Jun 075
Page 6
Philips SemiconductorsProduct specification
Fast soft-recovery
controlled avalanche rectifiers
10
handbook, halfpage
I
F
(A)
8
6
4
2
0
012
V
(V)
F
MGD316
BYV97 series
o
Tj ( C)
MGC574
2000
3
10
handbook, halfpage
I
R
(µA)
2
10
10
1
1
3
10
100
Dotted line: Tj= 175 °C.
Solid line: Tj=25°C.
Fig.8Forward current as a function of forward
voltage; maximum values.
10
handbook, full pagewidth
t
rr
(µs)
1
VR=V
RRMmax
.
Fig.9Reverse current as a function of junction
temperature; maximum values.
MBD439
I =
F
5 A
1 A
1
10
1
Tj=25°C.
For definitions see Fig. 13.
Fig.10 Maximum reverse recovery time as a function of the rate of fall of forward current.
Fig.14 Test circuit and reverse recovery time waveform and definition.
1996 Jun 078
Page 9
Philips SemiconductorsProduct specification
Fast soft-recovery
controlled avalanche rectifiers
PACKAGE OUTLINE
handbook, full pagewidth
3.81
max
Dimensions in mm.
The marking band indicates the cathode.
BYV97 series
ka
4.57
max
28 min28 min
Fig.15 SOD57.
0.81
max
MBC880
DEFINITIONS
Data Sheet Status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Jun 079
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