Rugged glass package, using a high temperature alloyed construction. This
package is hermetically sealed and fatigue free as coefficients of expansion
of all used parts are matched.
ka
2/3 page (Datasheet)
MAM047
Fig.1 Simplified outline (SOD57) and symbol.
−1.5A
see Fig 2;
averaged over any 20 ms period;
see also Fig 6
T
=55°C; PCB mounting (see
amb
−0.8A
Fig.11); see Fig 3;
averaged over any 20 ms period;
see also Fig 6
=55°C; see Fig 5−9A
T
amb
−35A
Tj=T
VR=V
L = 120 mH; Tj=T
prior to surge;
j max
RRMmax
j max
prior to
−10mJ
surge; inductive load switched off
1996 Jun 072
Page 3
Philips SemiconductorsProduct specification
Fast soft-recovery
BYV96 series
controlled avalanche rectifiers
ELECTRICAL CHARACTERISTICS
T
=25°C unless otherwise specified.
j
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
F
V
(BR)R
I
R
t
rr
C
d
dI
R
-------dt
forward voltageIF= 3 A; Tj=T
= 3 A; see Fig 8−−1.60V
I
F
reverse avalanche
IR= 0.1 mA
; see Fig 8−−1.35V
j max
breakdown voltage
BYV96D900−−V
BYV96E1100−−V
reverse currentVR=V
RRMmax
;
−−1µA
see Fig 9
V
R=VRRMmax
; Tj= 165 °C;
−−150µA
see Fig 9
reverse recovery timewhen switched from IF= 0.5 A
−−300ns
to IR= 1 A; measured at
IR= 0.25 A; see Fig 12
diode capacitancef = 1 MHz; VR= 0 V; see Fig 10−40−pF
maximum slope of
reverse recovery current
when switched from I
VR≥ 30 V and dIF/dt = −1A/µs;
= 1 A to
F
−−6A/µs
see Fig.13
THERMAL CHARACTERISTICS
SYMBOLPARAMETERCONDITIONSVALUEUNIT
R
R
th j-tp
th j-a
thermal resistance from junction to tie-pointlead length = 10 mm46K/W
thermal resistance from junction to ambientnote 1100K/W
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.11.
For more information please refer to the
‘General Part of Handbook SC01’
1996 Jun 073
Page 4
Philips SemiconductorsProduct specification
Fast soft-recovery
controlled avalanche rectifiers
GRAPHICAL DATA
2.0
handbook, halfpage
I
F(AV)
(A)
1.6
1.2
0.8
0.4
0
0200
a =1.57; VR=V
lead length 10 mm
; δ= 0.5.
RRMmax
100
o
Ttp ( C)
MGC588
1.2
handbook, halfpage
I
F(AV)
(A)
0.8
0.4
0
0
a =1.57; VR=V
Device mounted as shown in Fig.11.
RRMmax
; δ= 0.5.
BYV96 series
100
T
( C)
amb
MGC587
200
o
Fig.2Maximum permissible average forward
current as a function of tie-point temperature
(including losses due to reverse leakage).
20
handbook, full pagewidth
I
FRM
(A)
16
12
8
4
0
2
10
δ =
0.05
0.1
0.2
0.5
1
1
10
11010
Fig.3Maximum permissible average forward
current as a function of ambient temperature
(including losses due to reverse leakage).
MGC585
2
3
10
tp (ms)
10
4
Ttp=55°C; R
V
during 1 −δ; curves include derating for T
RRMmax
th j-tp
= 46 K/W.
j max
at V
RRM
= 1000 V.
Fig.4 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
1996 Jun 074
Page 5
Philips SemiconductorsProduct specification
Fast soft-recovery
controlled avalanche rectifiers
10
handbook, full pagewidth
I
FRM
(A)
8
6
4
2
0
2
10
δ =
0.05
0.1
0.2
0.5
1
1
10
11010
2
BYV96 series
MGC586
3
10
tp (ms)
4
10
T
=55°C; R
amb
V
during 1 −δ; curves include derating for T
RRMmax
th j-a
= 100 K/W.
j max
at V
RRM
= 1000 V.
Fig.5 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
1.57
1.42
(A)
MGC576
200
handbook, halfpage
T
j
o
( C)
100
0
01000
500
VR (V)
P
(W)
3
2
1
0
0
handbook, halfpage
2
2.5
a = 3
12
I
F(AV)
MGC583
DE
a=I
F(RMS)/IF(AV)
; VR=V
RRMmax
; δ = 0.5.
Fig.6Maximum steady state power dissipation
(forward plus leakage current losses,
excluding switching losses) as a function
of average forward current.
1996 Jun 075
Solid line = VR.
Dotted line = V
RRM
; δ = 0.5.
Fig.7Maximum permissible junction temperature
as a function of reverse voltage.
Page 6
Philips SemiconductorsProduct specification
Fast soft-recovery
controlled avalanche rectifiers
handbook, halfpage
8
I
F
(A)
6
4
2
0
0123
V
F
MGC577
(V)
3
10
handbook, halfpage
I
R
(µA)
2
10
10
1
1
10
BYV96 series
100
Tj ( C)
MGC574
o
2000
Dotted line: Tj= 175 °C.
Solid line: Tj=25°C.
Fig.8Forward current as a function of forward
voltage; maximum values.
2
10
handbook, halfpage
C
d
(pF)
10
1
1
1010
2
MGC584
VR (V)
VR=V
RRMmax
.
Fig.9Reverse current as a function of junction
temperature; maximum values.
handbook, halfpage
3
10
50
25
7
50
2
3
MGA200
f = 1 MHz; Tj=25°C.
Fig.10 Diode capacitance as a function of reverse
voltage; typical values.
1996 Jun 076
Dimensions in mm.
Fig.11 Device mounted on a printed-circuit board.
Page 7
Philips SemiconductorsProduct specification
Fast soft-recovery
controlled avalanche rectifiers
handbook, full pagewidth
10 Ω
25 V
DUT
+
1 Ω
50 Ω
(A)
I
0.25
R
I
(A)
0.5
0.5
BYV96 series
F
t
rr
0
1
t
MAM057
Input impedance oscilloscope: 1 MΩ, 22 pF; tr≤ 7 ns.
Source impedance: 50 Ω; tr≤ 15 ns.
Fig.12 Test circuit and reverse recovery time waveform and definition.
I
ndbook, halfpage
F
dI
F
dt
t
rr
dI
R
dt
I
R
10%
100%
t
MGC499
Fig.13 Reverse recovery definitions.
1996 Jun 077
Page 8
Philips SemiconductorsProduct specification
Fast soft-recovery
controlled avalanche rectifiers
PACKAGE OUTLINE
handbook, full pagewidth
3.81
max
Dimensions in mm.
The marking band indicates the cathode.
BYV96 series
ka
4.57
max
28 min28 min
Fig.14 SOD57.
0.81
max
MBC880
DEFINITIONS
Data Sheet Status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Jun 078
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