Datasheet BYV42E-100 Datasheet (Philips)

Page 1
Philips Semiconductors Product specification
Rectifier diodes BYV42E series ultrafast, rugged
GENERAL DESCRIPTION QUICK REFERENCE DATA
Glass passivated high efficiency SYMBOL PARAMETER MAX. MAX. MAX. UNIT rugged dual rectifier diodes in a plastic envelope, featuring low BYV42E- 100 150 200 forward voltage drop, ultra-fast V
recovery times and soft recovery voltage characteristic. These devices can V withstand reverse voltage transients I
F
O(AV)
and have guaranteed reverse surge diodes conducting) and ESD capability. They are t intended for use in switched mode I
rr RRM
power supplies and high frequency current per diode circuits in general where low conduction and switching losses are essential.
PINNING - TO220AB PIN CONFIGURATION SYMBOL
Repetitive peak reverse 100 150 200 V Forward voltage 0.85 0.85 0.85 V
Output current (both 30 30 30 A Reverse recovery time 28 28 28 ns
Repetitive peak reverse 0.2 0.2 0.2 A
PIN DESCRIPTION
1 anode 1 (a)
tab
a1
a2
2 cathode (k) 3 anode 2 (a)
tab cathode (k)
1 2 3
k
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
-100 -150 -200
V
V
RWM
V
R
I
O(AV)
I
O(RMS)
I
FRM
I
FSM
I2t I2t for fusing t = 10 ms - 112 A2s I
I
RSM
T
stg
T
j
1 Tmb 144˚C for thermal stability. 2 Neglecting switching and reverse current losses. For output currents in excess of 20 A, connection should be made to the exposed metal mounting base.
Repetitive peak reverse voltage - 100 150 200 V Crest working reverse voltage - 100 150 200 V Continuous reverse voltage
Output current (both diodes square wave - 30 A conducting)
2
1
δ = 0.5; Tmb 108 ˚C
- 100 150 200 V
sinusoidal - 27 A
a = 1.57; Tmb 111 ˚C RMS forward current - 43 A Repetitive peak forward current t = 25 µs; δ = 0.5; - 30 A per diode Tmb 108 ˚C Non-repetitive peak forward t = 10 ms - 150 A current per diode t = 8.3 ms - 160 A
sinusoidal; with reapplied
V
RWM(max)
Repetitive peak reverse current tp = 2 µs; δ = 0.001 - 0.2 A per diode Non-repetitive peak reverse tp = 100 µs - 0.2 A current per diode Storage temperature -40 150 ˚C Operating junction temperature - 150 ˚C
October 1994 1 Rev 1.100
Page 2
Philips Semiconductors Product specification
Rectifier diodes BYV42E series ultrafast, rugged
ESD LIMITING VALUE
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
C
Electrostatic discharge Human body model; - 8 kV capacitor voltage C = 250 pF; R = 1.5 k
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R
th j-mb
Thermal resistance junction to per diode - - 2.4 K/W mounting base both diodes conducting - - 1.4 K/W
R
th j-a
Thermal resistance junction to in free air - 60 - K/W ambient
STATIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
F
Forward voltage (per diode) IF = 15 A; Tj = 150˚C - 0.78 0.85 V
IF = 15 A - 0.95 1.05 V
IF = 30 A - 1.00 1.20 V
I
R
Reverse current (per diode) VR = V
VR = V
; Tj = 100 ˚C - 0.5 1 mA
RWM RWM
- 10 100 µA
DYNAMIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Q
s
t
rr1
t
rr2
V
fr
Reverse recovery charge (per IF = 2 A; VR 30 V; -dIF/dt = 20 A/µs - 6 15 nC diode) Reverse recovery time (per IF = 1 A; VR 30 V; - 20 28 ns diode) -dIF/dt = 100 A/µs Reverse recovery time (per IF = 0.5 A to IR = 1 A; I diode)
= 0.25 A - 13 22 ns
rec
Forward recovery voltage (per IF = 1 A; dIF/dt = 10 A/µs - 1 - V diode)
October 1994 2 Rev 1.100
Page 3
Philips Semiconductors Product specification
Rectifier diodes BYV42E series ultrafast, rugged
I
F
dI
F
dt
t
rr
time
Q
s
I
R
I
F
I
rrm
Fig.1. Definition of t
, Qs and I
rr1
10%
100%
rrm
time
V
F
V
fr
V
F
time
Fig.2. Definition of V
fr
0.5A
IF
0A
I = 0.25A
rec
IR
trr2
I = 1A
R
Fig.4. Definition of t
PF / W
20
Vo = 0.705 V Rs = 0.0097 Ohms
15
10
5
0
0 5 10 15 20 25
0.1
BYV42
0.2
IF(AV) / A
rr2
Tmb(max) / C
D = 1.0
0.5
p
t
I
D =
T
Fig.5. Maximum forward dissipation PF = f(I
diode; square current waveform where
I
F(AV)
=I
F(RMS)
x √D.
t T
p
t
F(AV)
102
114
126
138
150
) per
R
Voltage Pulse Source
Current
shunt
Fig.3. Circuit schematic for t
D.U.T.
to ’scope
rr2
PF / W
15
Vo = 0.705 V Rs = 0.0097 Ohms
10
5
0
0 5 10 15
BYV42
2.2
2.8
4
IF(AV) / A
Fig.6. Maximum forward dissipation PF = f(I
Tmb(max) / C
a = 1.57
1.9
F(AV)
114
126
138
150
) per
diode; sinusoidal current waveform where a = form
factor = I
F(RMS)
/ I
F(AV)
.
October 1994 3 Rev 1.100
Page 4
Philips Semiconductors Product specification
Rectifier diodes BYV42E series ultrafast, rugged
trr / ns
1000
IF=20A
100
IF=1A
10
1
1 10 100
dIF/dt (A/us)
Fig.7. Maximum trr at Tj = 25 ˚C; per diode
Irrm / A
10
IF=20A
1
IF=1A
Qs / nC
100
IF=20A
10A
5A 2A 1A
10
1.0
1.0 10 100
-dIF/dt (A/us)
Fig.10. Maximum Qs at Tj = 25 ˚C; per diode
Zth (K/W)
10
1
0.1
0.01 1
Fig.8. Maximum I
IF / A
50
Tj = 150 C
40
Tj = 25 C
30
20
10
0
0
10 100
-dIF/dt (A/us)
at Tj = 25 ˚C; per diode
rrm
typ
max
0.5 1.51.0 VF / V
Fig.9. Typical and maximum forward characteristic
IF = f(VF); parameter T
j
0.1
0.01 tp / s
P
t
p
D
t
10 s0.11 ms10 us
Fig.11. Transient thermal impedance; per diode;
Z
= f(tp).
th j-mb
October 1994 4 Rev 1.100
Page 5
Philips Semiconductors Product specification
Rectifier diodes BYV42E series ultrafast, rugged
MECHANICAL DATA
Dimensions in mm Net Mass: 2 g
3,0 max
not tinned
1,3
max
10,3 max
3,7
1 2 3
2,8
3,0
4,5 max
1,3
5,9
min
15,8
max
13,5
min
(2x)
2,54 2,54
Fig.12. TO220AB; pin 2 connected to mounting base.
Notes
1. Accessories supplied on request: refer to mounting instructions for TO220 envelopes.
2. Epoxy meets UL94 V0 at 1/8".
0,9 max (3x)
0,6
2,4
October 1994 5 Rev 1.100
Page 6
Philips Semiconductors Product specification
Rectifier diodes BYV42E series ultrafast, rugged
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 1994
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
October 1994 6 Rev 1.100
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