Datasheet BYV4100 Datasheet (Philips)

Page 1
DISCRETE SEMICONDUCTORS
DATA SH EET
handbook, 2 columns
BYV4100
Fast soft-recovery controlled avalanche rectifier
Product specification
1996 Oct 07
Page 2
Philips Semiconductors Product specification
Fast soft-recovery
BYV4100
controlled avalanche rectifier
FEATURES
Glass passivated
High maximum operating
temperature
DESCRIPTION
Rugged glass SOD64 package, using a high temperature alloyed construction.
Low leakage current
Excellent stability
Guaranteed avalanche energy
ka
absorption capability
2/3 page (Datasheet)
Available in ammo-pack
Also available with preformed leads
for easy insertion.
Fig.1 Simplified outline (SOD64) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
RRM
V
R
I
F(AV)
repetitive peak reverse voltage 100 V continuous reverse voltage 100 V average forward current Ttp=65°C; lead length = 10 mm;
averaged over any 20 ms period; see Fig.2; see also Fig.4
T
=60°C; PCB mounting
amb
(see Fig.12); averaged over any 20 ms period; see Fig.3; see also Fig.4
I
FRM
I
FSM
E
T T
RSM
stg j
repetitive peak forward current Ttp=65°C; see Fig.6 34 A
T
=60°C; see Fig.7 17 A
amb
non-repetitive peak forward current t = 10 ms half sine wave;
non-repetitive peak reverse avalanche energy
Tj=T VR=V
L = 120 mH; Tj=T surge; inductive load switched off
prior to surge;
j max
RRMmax
j max
storage temperature 65 +175 °C junction temperature 65 +175 °C
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
MAM104
4.0 A
1.9 A
90 A
prior to
20 mJ
1996 Oct 07 2
Page 3
Philips Semiconductors Product specification
Fast soft-recovery
BYV4100
controlled avalanche rectifier
ELECTRICAL CHARACTERISTICS
T
=25°C unless otherwise specified.
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
F
V
(BR)R
I
R
t
rr
C
d
dI
R
-------­dt
forward voltage IF= 3.5 A; Tj=T
I
= 3.5 A; see Fig.5 −−0.98 V
F
reverse avalanche
IR= 0.1 mA 120 −−V
; see Fig.5 −−0.78 V
j max
breakdown voltage reverse current VR=V
RRMmax
;
−− 5µA
see Fig.8 V
R=VRRMmax
; Tj= 165 °C;
−−150 µA
see Fig.8
reverse recovery time when switched from IF= 0.5 A
−− 15 ns to IR= 1 A; measured at IR= 0.25 A; see Fig.10
diode capacitance f = 1 MHz; VR= 0 V; see Fig.9 245 pF maximum slope of reverse
recovery current
when switched from I VR≥ 30 V and dIF/dt = 1A/µs;
= 1 A to
F
−− 2A/µs
see Fig.11
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R R
th j-tp th j-a
thermal resistance from junction to tie-point lead length = 10 mm 25 K/W thermal resistance from junction to ambient note 1 75 K/W
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 µm, see Fig.12. For more information please refer to the
“General Part of associated Handbook”
.
1996 Oct 07 3
Page 4
Philips Semiconductors Product specification
Fast soft-recovery controlled avalanche rectifier
GRAPHICAL DATA
handbook, halfpage
5
I
F(AV)
(A)
4
3
2
1
0
0 200
Switched mode application. a =1.42; δ = 0.5; VR=V
RRMmax
100
.
Ttp (°C)
MGD747
handbook, halfpage
3
I
F(AV)
(A)
2
1
0
0
Switched mode application. a = 1.42; δ = 0.5; VR=V Device mounted as shown in Fig.12.
RRMmax
BYV4100
MGD748
100
.
T
amb
(°C)
200
Fig.2 Maximum permissible average forward
current as a function of tie-point temperature (including losses due to reverse leakage).
handbook, halfpage
6
P
(W)
5
4
3
2
1
0
04
a=I
F(RMS)/IF(AV)
; δ = 0.5; VR=V
a = 3
2
I
F(AV)
.
RRMmax
MGD749
22.5
1.57
1.42
(A)
Fig.4 Maximum steady state power dissipation
(forward plus leakage current losses, excluding switching losses) as a function of average forward current.
Fig.3 Maximum permissible average forward
current as a function of ambient temperature (including losses due to reverse leakage).
10
handbook, halfpage
I
F
(A)
8
6
4
2
0
02
Dotted line: Tj= 175 °C. Solid line: Tj=25°C.
1
MGD750
VF (V)
Fig.5 Maximum forward voltage as a function of
forward current.
1996 Oct 07 4
Page 5
Philips Semiconductors Product specification
Fast soft-recovery controlled avalanche rectifier
40
handbook, full pagewidth
I
FRM
(A)
30
20
10
0
2
10
1
10
BYV4100
δ = 0.05
0.1
0.2
0.5 1
110
10
2
3
10
tp (ms)
MGD751
4
10
Ttp=65°C; R
= 25 K/W; VR=V
th j-tp
RRMmax
during 1 −δ.
Fig.6 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
20
handbook, full pagewidth
I
FRM
(A)
15
10
5
0
2
10
1
10
δ = 0.05
0.1
0.2
0.5 1
110
10
2
3
10
tp (ms)
MGD752
4
10
T
=60°C; R
amb
= 75 K/W; VR=V
th j-a
RRMmax
during 1 −δ.
Fig.7 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
1996 Oct 07 5
Page 6
Philips Semiconductors Product specification
Fast soft-recovery controlled avalanche rectifier
3
10
handbook, halfpage
I
R
(µA)
2
10
10
1
0 100 200
Tj (°C)
MGC550
3
10
handbook, halfpage
C
d
(pF)
2
10
10
11010
BYV4100
MGD753
V
(V)
R
2
VR=V
RRMmax
.
Fig.8 Reverse current as a function of junction
temperature; maximum values.
handbook, full pagewidth
DUT
0.5 A
50
f = 1 MHz; Tj=25°C.
Fig.9 Diode capacitance as a function of reverse
voltage; typical values.
I
F
(A)
0.5
0.25
0.5
I
R
(A)
1.0
0
t
rr
MAM282
t
Rise time oscilloscope: tr≤ 2 ns. Turn-on time switch: t 3 ns.
Fig.10 Test circuit and reverse recovery time waveform and definition.
1996 Oct 07 6
Page 7
Philips Semiconductors Product specification
Fast soft-recovery controlled avalanche rectifier
I
ndbook, halfpage
F
dI
F
dt
t
rr
dI
R
dt
I
R
10%
100%
t
MGC499
handbook, halfpage
BYV4100
50 25
7
50
2
3
MGA200
Fig.11 Reverse recovery definitions.
Dimensions in mm.
Fig.12 Device mounted on a printed-circuit board.
1996 Oct 07 7
Page 8
Philips Semiconductors Product specification
Fast soft-recovery controlled avalanche rectifier
PACKAGE OUTLINE
handbook, full pagewidth
4.5
max
Dimensions in mm. The marking band indicates the cathode.
BYV4100
ka
28 min28 min 5.0 max
Fig.13 SOD64.
1.35 max
MBC049
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1996 Oct 07 8
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