Datasheet BYT60P-1000, BYT261PIV-1000 Datasheet (SGS Thomson Microelectronics)

Page 1
BYT60P-1000
FAST RECOVERY RECTIFIERDIODES
MAJORPRODUCT CHARACTERISTICS
I
F(AV)
V
RRM
(max) 1.8 V
V
F
trr(max) 70 ns
FEATURESAND BENEFITS
VERYLOWREVERSERECOVERYTIME VERYLOWSWITCHINGLOSSES LOWNOISETURN-OFF SWITCHING INSULATEDPACKAGE: ISOTOP
Insulationvoltage:2500V Capacitance= 45pF Inductance< 5 nH
DESCRIPTION
2 x 60 A
1000 V
RMS
BYT261PIV-1000
K2 A2
A1K1
BYT261PIV-1000
ISOTOP
(Plastic)
TM
Dual or highsinglevoltage rectifier devices suited for Switch Mode Power Supplies and other power converters.
A
K
SOD93
(Plastic)
ABSOLUTE RATINGS
(limitingvalues,per diode)
Symbol Parameter Value Unit
V
RRM
I
FRM
I
F(RMS)
I
F(AV)
I
FSM
T
stg
Tj
Repetitivepeak reversevoltage Repetitivepeak forwardcurrent tp=5µs F=1kHz RMSforward current ISOTOP
SOD93
Averageforwardcurrent δ =0.5 Tc= 50°C ISOTOP
Tc= 60°C SOD93 Surgenon repetitiveforwardcurrent tp = 10ms Sinusoidal Storagetemperaturerange Maximumoperating junctiontemperature
1000 V 1000 A
140 A 100
60 A 60
400 A
- 40 to + 150 °C 150 °C
TM: ISOTOP is a registeredtrademark of STMicroelectronics.
October 1999 - Ed: 4B
1/7
Page 2
BYT60P-1000 / BYT261PIV-1000
THERMAL RESISTANCES
Symbol Parameter Value Unit
R
R
th(j-c)
th(c)
Junctionto case ISOTOP Per diode
Total
SOD93 Total
Coupling
0.8
0.45
0.7
0.1 °C/W
Whenthe diodes1 and 2 are usedsimultaneously: Tj(diode1) = P(diode)x R
(Perdiode) + P(diode2) x R
th(j-c)
th(c)
STATICELECTRICAL CHARACTERISTICS(per diode)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
*
F
I
R
Forward voltagedrop Tj = 25°CI
**
Reverseleakage current
Pulse test : * tp = 380µs,δ<2%
** tp = 5 ms,δ<2%
=60A
F
Tj = 100°C Tj = 25°CV
R=VRRM
Tj = 100°C
1.9 V
1.8
100 µA
°C/W
6mA
To evaluatethe conductionlossesuse the following equation: P = 1.47 x I
F(AV)
+0.005 I
F2(RMS)
RECOVERYCHARACTERISTICS(per diode)
Symbol Test Conditions Min. Typ. Max. Unit
t
rr
Tj=25°CIF=1A VR=30V dIF/dt = - 15A/µs
I
= 0.5A IR=1A Irr=0.25A
F
170 ns
70
TURN-OFFSWITCHINGCHARACTERISTICS
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
C=
IRM
I
RM
V
V
Max imu m rev er se reco ve ry time
Max imu m rev er se reco ve ry curr ent
Turn-off overvoltage
RP
coefficient
CC
dIF/dt = - 240 A/µsV
/dt = - 480 A/µs
dI
F
dIF/dt = - 240 A/µs dI
/dt = - 480 A/µs
F
= 200V
CC
I
=60A
F
0.05 µH
L
p
Tj = 100°C (seefig. 13)
Tj = 100°CVCC= 200V IF=I dIF/dt = - 60A/µsLp= 2.5µH (see fig. 14)
F(AV)
200 ns
120
40 A
44
3.3 4.5 /
2/7
Page 3
BYT60P-1000 / BYT261PIV-1000
Fig. 1-1: Average forward power dissipation
versus average forward current (per diode, ISOTOP).
PF(av)(W)
130 120 110
δ = 0.05
δ = 0.2δ = 0.1
δ= 0.5
100
90
δ =1
80 70 60 50 40 30 20 10
0
0 10203040506070
Fig. 2-1:
Peak current versus form factor (per
IF(av)(A)
δ
=tp/T
T
tp
diode,ISOTOP).
IM(A)
500 450 400 350
P=70W
300 250 200 150
P=40W
P=100W
100
P=20W
50
0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
δ
δ
=tp/T
T
tp
Fig. 1-2: Average forward power dissipation versusaverageforward current(SOD93).
PF(av)(W)
130 120 110
δ = 0.1
δ = 0.2
100
90 80
δ = 0.05
70 60 50 40 30 20 10
0
0 10203040506070
Fig.2-2:
500 450 400 350 300 250 200 150 100
50
0
Peakcurrentversusformfactor(SOD93).
IM(A)
P=70W
P=40W
P=20W
δ
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
IF(av)(A)
P=100W
δ= 0.5
δ
δ
=tp/T
=tp/T
δ =1
T
tp
T
tp
Fig. 3:
Average forward current versus ambient
temperature(δ=0.5, per diodefor ISOTOP).
IF(av)(A)
70
Rth(j-a)=Rth(j-c)
60 50
ISOTOP
40 30 20 10
=tp/T
δ
0
0 25 50 75 100 125 150
Rth(j-a)=2.5°C/W
T
tp
SOD93
Tamb(°C)
3/7
Page 4
BYT60P-1000 / BYT261PIV-1000
Fig. 4-1:
Nonrepetitivesurgepeak forwardcurrent
versusoverloadduration (SOD93).
IM(A)
400 350 300 250 200
Tc=25°C
150 100
IM
50
0
1E-3 1E-2 1E-1 1E+0
δ=0.5
t
t(s)
Tc=60°C
Fig. 5-1: Relative variation of thermal impedance junction to case versus pulse duration (per diode, ISOTOP).
K=[Zth(j-c)/Rth(j-c)]
1.0
Fig.4-2:
Nonrepetitivesurgepeak forwardcurrent
versusoverloadduration (per diode,ISOTOP).
IM(A)
400 350 300 250 200
Tc=25°C
150 100
IM
50
0
1E-3 1E-2 1E-1 1E+0
δ=0.5
t
t(s)
Tc=50°C
Fig. 5-2: Relative variation of thermal impedance junctionto caseversus pulseduration(SOD93).
K=[Zth(j-c)/Rth(j-c)]
1.0
δ = 0.5
0.5
δ = 0.2
δ
=tp/T
T
tp
δ = 0.1
0.2
Single pulse
0.1 1E-3 1E-2 1E-1 1E+0
tp(s)
Fig. 6: Forward voltage drop versus forward
current(maximum values,per diodefor ISOTOP).
IFM(A)
500
Typicalvalues
100
10
1
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
Tj=100°C
Tj=25°C
Tj=100°C
VFM(V)
δ = 0.5
0.5
δ = 0.2
δ= 0.1
0.2
Single pulse
tp(s)
0.1 1E-3 1E-2 1E-1 1E+0
δ
=tp/T
T
tp
Fig.7: Junctioncapacitanceversusreversevoltage applied(typicalvalues,perdiodeforISOTOP).
C(pF)
100
80
60
40
20
VR(V)
0
1 10 100 200
F=1MHz
Tj=25°C
4/7
Page 5
BYT60P-1000 / BYT261PIV-1000
Fig. 8:
Recoverycharges versus dI
/dt (per diode
F
forISOTOP).
Qrr(µC)
10
8
IF=IF(av)
90% confidence
Tj=100°C
6
4
2
dIF/dt(A/µs)
0
10 20 50 100 200 500
Fig. 10: Transient peak forward voltage versus dI
/dt (perdiode for ISOTOP).
F
VFP(V)
45
IF=IF(av)
90% confidence
40
Tj=100°C
35 30 25 20 15 10
5 0
0 100 200 300 400 500
dIF/dt(A/µs)
Fig. 9:
Recovery current versus dI
/dt (per diode
F
for ISOTOP).
IRM(A)
80
IF=IF(av)
90% confidence
70
Tj=100°C
60 50 40 30 20 10
0
10 20 50 100 200 500
Fig. 11:
Forward recovery time versus dI
dIF/dt(A/µs)
/dt (per
F
diodefor ISOTOP).
tfr(µs)
1.50
1.25
1.00
0.75
0.50
0.25
dIF/dt(A/µs)
0.00
0 100 200 300 400 500
IF=IF(av)
90% confidence
Tj=100°C
Fig. 12: Dynamic parameters versus junction temperature.
Qrr;IRM[Tj] / Qrr;IRM[Tj=100°C]
1.50
1.25
1.00
0.75
0.50
0.25 0 25 50 75 100 125 150
IRM
Qrr
Tj(°C)
5/7
Page 6
BYT60P-1000 / BYT261PIV-1000
Fig.13: Turn-offswitching characteristics (without
serieinductance).
IF
LC
DUT
VCC
VF
IRM
diF/ dt
VCC
tIRM
PACKAGEMECHANICAL DATA
ISOTOP
Fig. 14: Turn-off switching characteristics (with serieinductance).
IF
LC
DUT
LP
VCC
VF
VRP
diF/dt
VCC
DIMENSIONS
REF.
Millimeters Inches
Min. Max. Min. Max.
A 11.80 12.20 0.465 0.480
A1 8.90 9.10 0.350 0.358
B 7.8 8.20 0.307 0.323
C 0.75 0.85 0.030 0.033
C2 1.95 2.05 0.077 0.081
D 37.80 38.20 1.488 1.504
D1 31.50 31.70 1.240 1.248
E 25.15 25.50 0.990 1.004 E1 23.85 24.15 0.939 0.951 E2 24.80typ. 0.976 typ.
G 14.90 15.10 0.587 0.594 G1 12.60 12.80 0.496 0.504 G2 3.50 4.30 0.138 0.169
F 4.10 4.30 0.161 0.169
F1 4.60 5.00 0.181 0.197
P 4.00 4.30 0.157 0.69
P1 4.00 4.40 0.157 0.173
S 30.10 30.30 1.185 1.193
6/7
Page 7
PACKAGEMECHANICAL DATA
SOD93Plastic
BYT60P-1000 / BYT261PIV-1000
DIMENSIONS
REF.
A 4.70 4.90 0.185 0.193 C 1.17 1.37 0.046 0.054 D 2.50 0.098
D1 1.27 0.050
E 0.50 0.78 0.020 0.031 F 1.10 1.30 0.043 0.051
F3 1.75 0.069
G 10.80 11.10 0.425 0.437 H 14.70 15.20 0.578 0.598
L 12.20 0.480 L2 16.20 0.638 L3 18.0 0.709 L5 3.95 4.15 0.156 0.163 L6 31.00 1.220
O 4.00 4.10 0.157 0.161
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
Orderingtype Marking Package Weight Base qty
Delivery
mode
BYT60P-1000 BYT60P-1000 SOD93 3.79g. 30 Tube
BYT261PIV-1000 BYT261PIV-1000 ISOTOP 28g. (without screws) 10 Tube
Coolingmethod: byconduction(C) Recommendedtorque value (ISOTOP): 1.3 N.m (MAX 1.5 N.m) for the 6 x M4 screws.(2 x M4 screws
recommendedfor mounting the package on the heatsink and the 4 screws given with the screw ver­sion).The screws supplied with the package are adapted for mounting on a board (or other types of terminals)with athicknessof 0.6 mm min and2.2 mm max.
Recommendedtorque value (SOD93):0.8 N.m. Maximumtorquevalue (SOD93): 1.0 N.m. Epoxymeets UL94,V0
Informationfurnishedis believed to beaccurateand reliable. However, STMicroelectronics assumes no responsibilityfor theconsequences of use of such informationnor forany infringementof patents or otherrights of thirdparties which may result fromits use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap­proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
1999 STMicroelectronics- Printed inItaly - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
Australia -Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia
Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.
http://www.st.com
7/7
Loading...