Datasheet BYT3400B-TR Datasheet (SGS Thomson Microelectronics)

Page 1
BYT3400B(-TR)
®
October 1999 - Ed : 1C
FAST RECOV ERY REC T IFI ER DIO D E
I
F(AV)
3 A
RRM
400 V
F
(max) 1.4 V
MAIN PRODUCT CHARACTERISTIC S
VERY LOW REVERS E RECOVERY TIME VERY LOW SWITCHING LOSSES LOW NOISE TURN-OFF SWITCHING SURFACE M OUNT P A CKAG E TAPE AND REEL OPTION : -TR
FEATURES AND BENEFITS
Single high voltage rectifier suited to Switch Mode Power Supplies and other power converters.
DESCR IPT ION
DPAK
(Plastic)
4
3
2
1 (nc)
Symbol Parameter Value Unit
RRM
Repetitive peak reverse voltage 400 V
I
F(RMS)
RMS forward current 10 A
I
F(AV)
Average forward current Tcase = ° C δ = 0.5 3 A
I
FSM
Surge non repetitive forward current tp = 10 ms Sinusoidal 60 A
Tstg Storage temperature range - 40 to + 150
°
C
Tj Maximum junction temperature 150 °C
ABSOLUTE MAXIMUM RATINGS
3
2, 4 (Tab)
Symbol Parameter Value Unit
R
TH (j-c)
Junction to case TBD
°
C/W
THERMAL RE SISTA NC ES
Symbol Tests Conditions Tests Conditions Min. Typ. Max. Unit
I
R
* Reverse leakage current Tj = 25°CV
R
= V
RRM
20
µ
Tj = 100°C0.5mA
V
F
** Forward voltage drop Tj = 25°CI
F
= 3 A 1.5 V
Tj = 100°CI
F
= 3 A 1.4
STATIC ELECTRICAL CHARACTER ISTICS
Pulse test : * tp = 5 ms, δ < 2 %
** tp = 380 µs, δ < 2%
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Symbol Test Conditions Min. Typ. Max. Unit
t
rr
Tj = 25°C IF = 0.5A
I
R
= 1A
Irr = 0.25A 25 ns
I
F
= 1A
V
R
= 30V
dI
F
/dt = -15 A/µs60ns
RECOVERY CHARACTE RISTICS
Symbol Test Conditions Min. Typ. Max. Unit
t
IRM
Vcc = 200V Tj = 100°C
IF = 3A dI
F
/dt = -50 A/µs
Lp ≤ 0.05µH3550ns
I
RM
1.5 2 A
To evaluate the maximum conduction losses use the following equation : P = 1.1 x I
F(AV)
+ 0.08 I
F2(RMS)
TURN-OFF SWITCHING CHARACTERISTICS
BYT3400B(- TR)
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwi se under any pat ent or pat ent rights of STMi croelec tronics. Specificat ions ment ioned in this publicati on are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroele ctroni cs products are not authoriz ed for use as critical compone nts in lif e support devices or system s without express writte n ap ­proval of STMicroelectronics.
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FOOT PRINT
(in millimeters)
PACKAGE ME CHANICAL D AT A
DPAK
REF.
DIMENSIONS
Millimeters Inches
Min. Max Min. Max.
A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0. 035 0.043 A2 0.03 0.23 0. 001 0.009
B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0. 204 0.212
C 0. 45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023
D 6. 00 6.20 0.236 0.244
E 6.40 6.60 0.251 0.259
G 4.40 4.60 0. 173 0.181
H 9. 35 10.10 0.368 0.397 L2 0.80 typ. 0.031 typ. L4 0.60 1.00 0.023 0.039 V2
6.7
6.7
3
3
1.61.6
2.32.3
BYT3400B(-TR)
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