Page 1
Philips Semiconductors Product specification
Damper-Modulator BYM357X
fast, high-voltage
FEATURES SYMBOL QUICK REFERENCE DATA
• Low forward volt drop DAMPER MODULATOR
• Fast switching
• Soft recovery characteristic VR=1500 V VR=600 V
• High thermal cycling
performance VF ≤ 1.3 V VF ≤ 1.03 V
• Isolated mounting tab
GENERAL DESCRIPTION PINNING SOT186A
damper modulator
1
2
3
I
=7 A I
F(peak)
I
≤ 60 A I
FSM
F(peak)
FSM
= 7 A
≤ 70 A
trr ≤ 300 ns trr ≤ 60 ns
Combined damper and modulator PIN DESCRIPTION
diodes in an isolated plastic
case
envelopeforhorizontaldeflectionin 1 damper cathode
colour TV and PC monitors.
The BYM357X contains diodes 2 common anode/cathode
with performance characteristics
designed specifically for 3 modulator anode.
applications from 16kHz to 70kHz
The BYM357X series is suppliedin
123
the conventional leaded SOT186A
package.
LIMITING VALUES
Tj = 25 ˚C unless otherwise stated
DAMPER MODULATOR
SYMBOL PARAMETER CONDITIONS MIN MAX MIN MAX UNIT
V
RSM
V
RRM
V
RWM
I
F(peak)
I
F(RMS)
Peak non-repetitive reverse - 1500 - 600 V
voltage.
Peak repetitive reverse voltage - 1500 - 600 V
Crest working reverse voltage - 1300 - 600 V
Peak forward current 31-70 kHz monitor. - 7 - 7 A
RMS forward current sinusoidal;a=1.57 - 15.7 - 14.1 A
I
FSM
Peak non-repetitive forward t = 10 ms - 60 - 70 A
current t = 8.3 ms - 66 - 77 A
sinusoidal;with
reapplied
V
RWM(MAX)
T
stg
T
J
Storage temperature -40 150 -40 150 ˚C
Operating junction temperature - 150 - 150 ˚C
February 2000 1 Rev 1.100
Page 2
Philips Semiconductors Product specification
Damper-Modulator BYM357X
fast, high-voltage
ISOLATION LIMITING VALUE & CHARACTERISTIC
Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
isol
C
isol
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS TYP. MAX. TYP. MAX. UNIT
R
th j-hs
R.M.S. isolation voltage from all f = 50-60 Hz; sinusoidal - - 2500 V
three terminals to external waveform;
heatsink R.H. ≤ 65% ; clean and dustfree
Capacitance from T2 to external f = 1 MHz - 10 - pF
heatsink
DAMPER MODULATOR
Thermal resistance junction to with heatsink - 4.8 - 5.5 K/W
heatsink compound
R
th j-a
Thermal resistance junction to in free air. 55 - 55 - K/W
ambient
STATIC CHARACTERISTICS OF DAMPER
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS TYP MAX. UNIT
V
F
Forward voltage IF = 6.5 A 1.1 1.45 V
IF = 6.5 A; Tj = 125˚C 1.05 1.3 V
I
R
Reverse current VR = V
VR = V
RWM
RWM
10 250 µA
50 500 µA
Tj = 100 ˚C
STATIC CHARACTERISTICS OF MODULATOR
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS TYP MAX. UNIT
V
F
I
R
Forward voltage IF = 8 A 1.05 1.25 V
IF = 8 A; Tj = 125˚C 0.9 1.03 V
IF = 20 A 1.3 1.45 V
Reverse current. VR = V
VR = V
Tj = 100 ˚C
RWM
RWM
10 50 µA
100 350 µA
February 2000 2 Rev 1.100
Page 3
Philips Semiconductors Product specification
Damper-Modulator BYM357X
fast, high-voltage
ELECTRICAL CHARACTERISTICS OF DAMPER
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
t
rr
Q
s
V
fr
ELECTRICAL CHARACTERISTICS OF MODULATOR
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
t
rr
I
rrm
Q
s
V
fr
Reverse recovery time IF = 1 A; VR ≥ 30 V; 200 300 ns
-dIF/dt = 50 A/µs
Reverse recovery charge 2 A,30 V,20 A/µs 1.2 2.0 µC
Peak forward recovery voltage IF = 6.5 A; 27 - V
dIF/dt = 50 A/µs
Reverse recovery time IF = 1 A; VR ≥ 30 V; 35 60 ns
/dt = 100 A/µs
-dI
F
Peak reverse recovery current IF = 10 A to VR ≥ 30 V; 3.0 5.5 A
dIF/dt = 50 A/µs; Tj = 100˚C
Reverse recovery charge 2 A,30 V,20 A/µs4070nC
Peak forward recovery voltage IF = 10 A; 3.2 - V
dIF/dt = 10 A/µs
February 2000 3 Rev 1.100
Page 4
Philips Semiconductors Product specification
Damper-Modulator BYM357X
fast, high-voltage
I
F
time
V
F
V
fr
V
F
I
rrm
dI
F
dt
t
rr
time
Q
s
10%
100%
I
F
I
R
time
Fig.1. Definition of trr, Qs and I
Modulator
I
F
dI
F
dt
trr
rrm
time
1000
100
Qs / nC
Fig.4. Definition of V
10A
2A
fr
10A
IF=2A
Qs
I
R
I
rrm
Fig.2. Definition of trr, Qs and I
Damper
Irrm / A
10
1
0.1
0.01
1
-dIF/dt (A/us)
Fig.3. Modulator maximum I
25%
rrm
IF=10A
IF=1A
Tj = 25 C
Tj = 100 C
10 100
at Tj = 100˚C
rrm
100%
10
1
110100
-diF / dt
25 C
150 C
Fig.5. Modulator maximum Qs at Tj = 25˚C and 150˚C
Cd / pF
100
10
1
1 10 100 1000
VR / V
Fig.6. Modulator typical junction capacitance Cd at
f = 1 MHz; Tj = 25˚C
February 2000 4 Rev 1.100
Page 5
Philips Semiconductors Product specification
1
Damper-Modulator BYM357X
fast, high-voltage
Transient thermal impedance, Zth j-hs (K/W)
10
1
0.1
p
D =
BYV29F
t
T
t
p
t
0.01
0.001
1us 10us 100us 1ms 10ms 100ms 1s 10s
P
D
pulse width, tp (s)
T
Fig.7. Modulator transient thermal impedance
Zth = f(tp)
30
20
IF / A
Tj=150 C
Tj=25 C
BYW29
Transient thermal impedance, Zth j-hs (K/W)
10
1
0.1
p
D =
BY359F
t
T
t
p
t
0.01
0.001
1us 10us 100us 1ms 10ms 100ms 1s 10s
P
D
pulse width, tp (s)
T
Fig.10. Damper transient thermal impedance
Zth = f(tp)
IF / A
30
Tj=150C
Tj=25C
20
BY359
10
0
0 1 2
typ
0.5 1.5
VF / V
max
Fig.8. Modulator typical and maximum forward
characteristic; IF = f(VF); parameter T
trr / ns
1000
0A
100
1A
Tj = 25 C
Tj = 150 C
10
10 100
-diF/dt
j
Fig.9. Modulator maximum trr measured to 25% of I
Tj = 25˚C and 150˚C
rrm
10
0
0
typ
1.0 2.0
max
VF / V
Fig.11. Damper forward characteristic IF = f(VF);
parameter T
j
;
February 2000 5 Rev 1.100
Page 6
Philips Semiconductors Product specification
Damper-Modulator BYM357X
fast, high-voltage
MECHANICAL DATA
Dimensions in mm
Net Mass: 2 g
10.3
Recesses (2x)
2.5
0.8 max. depth
3 max.
not tinned
13.5
min.
0.4
M
max
3.2
3.0
123
5.08
2.8
2.54
15.8
max.
3
19
max.
seating
plane
0.5
2.5
4.6
max
2.9 max
6.4
0.6
2.5
15.8
max
Fig.12. SOT186A; The seating plane is electrically isolated from all terminals.
1.3
1.0 (2x)
0.9
0.7
Notes
1. Refer to mounting instructions for F-pack envelopes.
2. Epoxy meets UL94 V0 at 1/8".
February 2000 6 Rev 1.100
Page 7
Philips Semiconductors Product specification
Damper-Modulator BYM357X
fast, high-voltage
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 2000
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
February 2000 7 Rev 1.100
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