Datasheet BYG50J, BYG50G, BYG50D, BYG50M, BYG50K Datasheet (Philips)

Page 1
DISCRETE SEMICONDUCTORS
DATA SH EET
k, halfpage
M3D168
BYG50 series
Controlled avalanche rectifiers
Preliminary specification File under Discrete Semiconductors, SC01
1996 May 24
Page 2
Philips Semiconductors Preliminary specification
Controlled avalanche rectifiers BYG50 series
FEATURES
Glass passivated
High maximum operating
temperature
DESCRIPTION
DO-214AC; SOD106 surface mountable package with glass passivated chip.
The well-defined void-free case is of a transfer-moulded thermo-setting plastic.
Low leakage current
Excellent stability
Guaranteed avalanche energy
absorption capability
handbook, 4 columns
ka
cathode band
UL 94V-O classified plastic package
Shipped in 12 mm embossed tape.
Top view Side view
MSA474
Fig.1 Simplified outline (DO-214AC; SOD106) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
RRM
repetitive peak reverse voltage
BYG50D 200 V BYG50G 400 V BYG50J 600 V BYG50K 800 V BYG50M 1000 V
V
R
continuous reverse voltage
BYG50D 200 V BYG50G 400 V BYG50J 600 V BYG50K 800 V BYG50M 1000 V
I
F(AV)
average forward current averaged over any 20 ms
2.1 A
period; Ttp= 100 °C; see Fig.2 averaged over any 20 ms
period; Al Fig.7); T
PCB mounting (see
2O3
=60°C; see Fig.3
amb
averaged over any 20 ms
1.0 A
0.7 A
period; epoxy PCB mounting (see Fig.7); T
amb
=60°C;
see Fig.3
I
FSM
non-repetitive peak forward current t = 10 ms half sinewave;
Tj=T VR=V
prior to surge;
j max
RRMmax
30 A
1996 May 24 2
Page 3
Philips Semiconductors Preliminary specification
Controlled avalanche rectifiers BYG50 series
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
E
RSM
non-repetitive peak reverse avalanche energy
BYG50D to J 10 BYG50K and M 7
T
stg
T
j
storage temperature 65 +175 °C junction temperature
ELECTRICAL CHARACTERISTICS
T
=25°C; unless otherwise specified.
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
V
F
(BR)R
forward voltage IF= 1 A; Tj=T
= 1 A; see Fig.5 −−1.00 V
I
F
reverse avalanche
IR= 0.1 mA
breakdown voltage
BYG50D 300 −−V BYG50G 500 −−V BYG50J 700 −−V BYG50K 900 −−V BYG50M 1100 −−V
I
R
t
rr
reverse current VR=V
RRMmax
V
R=VRRMmax
reverse recovery time when switched from IF= 0.5 A to
IR= 1 A; measured at IR= 0.25 A; see Fig.8
L = 120 mH; Tj=T
j max
prior to
surge; inductive load switched off
mJ mJ
see Fig.4
see Fig.5 −−0.85 V
j max;
65 +175 °C
; see Fig.6 −−1µA ; Tj= 165 °C; see Fig.6 −−100 µA
2
µs
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R R
th j-tp th j-a
thermal resistance from junction to tie-point 25 K/W thermal resistance from junction to ambient note 1 100 K/W
note 2 150 K/W
Notes
1. Device mounted on Al
printed-circuit board, 0.7 mm thick; thickness of copper 35 µm, see Fig.7.
2O3
2. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper 40 µm, see Fig.7.
For more information please refer to the
“General Part of Handbook SC01”
.
1996 May 24 3
Page 4
Philips Semiconductors Preliminary specification
Controlled avalanche rectifiers BYG50 series
GRAPHICAL DATA
MBH396
Ttp (°C)
I
F(AV)
(A)
VR=V
4
3
2
1
0
0 160 200
RRMmax
handbook, halfpage
80 12040
; δ= 0.5; a = 1.57.
Fig.2 Maximum permissible average forward
current as a function of tie-point temperature (including losses due to reverse leakage).
T
MBH397
amb
2.0
handbook, halfpage
I
F(AV)
(A)
1.6
1.2
0.8
0.4
0
0 160 200
VR=V Device mounted as shown in Fig.7 Solid line: Al2O3 PCB; dotted line: epoxy PCB.
; δ = 0.5; a = 1.57.
RRMmax
80 12040
Fig.3 Maximum permissible average forward
current as a function of ambient temperature (including losses due to reverse leakage).
(°C)
200
handbook, halfpage
T
j
(°C)
160
120
80
DG JKM
40
0
0 400 1200
Device mounted as shown in Fig.7. Solid line: Al2O3 PCB. Dotted line: epoxy PCB.
800
MGD483
VR (V)
Fig.4 Maximum permissible junction temperature
as a function of reverse voltage.
10
handbook, halfpage
I
F
(A)
8
6
4
2
0
0 1.6 2.0
Solid line: Tj=25°C. Dotted line: Tj= 175 °C.
0.8 1.20.4
MBH398
VF (V)
Fig.5 Forward current as a function of forward
voltage; maximum values.
1996 May 24 4
Page 5
Philips Semiconductors Preliminary specification
Controlled avalanche rectifiers BYG50 series
3
10
handbook, halfpage
I
R
(µA)
2
10
10
VR=V
1
RMMmax
.
16012040 80
Tj (
Fig.6 Reverse current as a function of junction
temperature; maximum values.
MGC739
2000
o
C)
50
4.5
50
2.5
1.25
Dimensions in mm.
MSB213
Fig.7 Printed-circuit board for surface mounting.
handbook, full pagewidth
10
Input impedance oscilloscope: 1 M, 22 pF; tr≤ 7 ns. Source impedance: 50 ; tr≤ 15 ns.
25 V
DUT
+
1
50
Fig.8 Test circuit and reverse recovery time waveform and definition.
1996 May 24 5
I
(A)
0.25
R
(A)
0.5
0.5
I
F
t
rr
0
1
t
MAM057
Page 6
Philips Semiconductors Preliminary specification
Controlled avalanche rectifiers BYG50 series
PACKAGE OUTLINE
5.5
handbook, full pagewidth
2.3
2.0
0.05
5.1
4.5
4.3
0.2
MSA414
Dimensions in mm.
2.8
2.4
1.6
1.4
3.3
2.7
Fig.9 SOD106.
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1996 May 24 6
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