Datasheet BYD77F, BYD77D, BYD77C, BYD77B, BYD77A Datasheet (Philips)

Page 1
DATA SH EET
Product specification Supersedes data of 1996 May 24
1999 Nov 15
DISCRETE SEMICONDUCTORS
BYD77 series
Ultra fast low-loss controlled avalanche rectifiers
b
ook, halfpage
M3D121
Page 2
1999 Nov 15 2
Philips Semiconductors Product specification
Ultra fast low-loss controlled avalanche rectifiers
BYD77 series
FEATURES
Glass passivated
High maximum operating
temperature
Low leakage current
Excellent stability
Guaranteed avalanche energy
absorption capability
Shipped in 8 mm embossed tape
Smallest surface mount
rectifier outline.
DESCRIPTION
Cavity free cylindrical glass SOD87 package through Implotec
(1)
technology. This package is
hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
(1) Implotec is a trademark of Philips.
handbook, 4 columns
MAM061
ka
Fig.1 Simplified outline (SOD87) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
RRM
repetitive peak reverse voltage
BYD77A 50 V BYD77B 100 V BYD77C 150 V BYD77D 200 V BYD77E 250 V BYD77F 300 V BYD77G 400 V
V
R
continuous reverse voltage
BYD77A 50 V BYD77B 100 V BYD77C 150 V BYD77D 200 V BYD77E 250 V BYD77F 300 V BYD77G 400 V
I
F(AV)
average forward current Ttp= 105 °C; see Figs 2 and 3;
averaged over any 20 ms period; see also Figs 10 and 11
BYD77A to D 2.00 A BYD77E to G 1.85 A
I
F(AV)
average forward current T
amb
=60°C; PCB mounting (see Fig.16); see Figs 4 and 5; averaged over any 20 ms period; see also Figs 10 and 11
BYD77A to D 0.85 A BYD77E to G 0.80 A
Page 3
1999 Nov 15 3
Philips Semiconductors Product specification
Ultra fast low-loss controlled avalanche rectifiers
BYD77 series
ELECTRICAL CHARACTERISTICS
Tj=25°C unless otherwise specified.
I
FRM
repetitive peak forward current Ttp= 105 °C; see Figs 6 and 7
BYD77A to D 15 A BYD77E to G 13 A
I
FRM
repetitive peak forward current T
amb
=60°C; see Figs 8 and 9
BYD77A to D 8.5 A BYD77E to G 8.0 A
I
FSM
non-repetitive peak forward current t = 10 ms half sine wave; Tj=T
j max
prior to surge; VR=V
RRMmax
25 A
E
RSM
non-repetitive peak reverse avalanche energy
L = 120 mH; Tj=25°C prior to surge; inductive load switched off
10 mJ
T
stg
storage temperature 65 +175 °C
T
j
junction temperature 65 +175 °C
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
F
forward voltage IF= 1 A; Tj=T
j max
;
see Figs 12 and 13
BYD77A to D −−0.75 V BYD77E to G −−0.83 V
V
F
forward voltage IF=1A;
see Figs 12 and 13
BYD77A to D −−0.98 V BYD77E to G −−1.05 V
V
(BR)R
reverse avalanche breakdown voltage
IR= 0.1 mA
BYD77A 55 −−V BYD77B 110 −−V BYD77C 165 −−V BYD77D 220 −−V BYD77E 275 −−V BYD77F 330 −−V BYD77G 440 −−V
I
R
reverse current VR=V
RRMmax
;
see Fig.14
−− 1µA
V
R=VRRMmax
;
Tj= 165 °C; see Fig.14
−−100 µA
t
rr
reverse recovery time when switched from
IF= 0.5 A to IR=1A; measured at IR= 0.25 A; see Fig.18
BYD77A to D −−25 ns BYD77E to G −−50 ns
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Page 4
1999 Nov 15 4
Philips Semiconductors Product specification
Ultra fast low-loss controlled avalanche rectifiers
BYD77 series
THERMAL CHARACTERISTICS
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 µm, see Fig.16. For more information please refer to the
“General Part of associated Handbook”
.
C
d
diode capacitance f = 1 MHz; VR=0V;
see Fig.15
BYD77A to D 50 pF BYD77E to G 40 pF
maximum slope of reverse recovery current
when switched from I
F
=1AtoVR≥30 V and dIF/dt = 1A/µs; see Fig.17
BYD77A to D −− 4A/µs BYD77E to G −− 5A/µs
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-tp
thermal resistance from junction to tie-point 30 K/W
R
th j-a
thermal resistance from junction to ambient note 1 150 K/W
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
dI
R
dt
--------
Page 5
1999 Nov 15 5
Philips Semiconductors Product specification
Ultra fast low-loss controlled avalanche rectifiers
BYD77 series
GRAPHICAL DATA
BYD77A toD
a = 1.42; VR=V
RRMmax
; δ = 0.5.
Switched mode application.
Fig.2 Maximum permissible average forward
current asa functionoftie-point temperature (including losses due to reverse leakage).
handbook, halfpage
0 100 200
4
3
1
0
2
MCD598
Ttp ( C)
o
I
F(AV)
(A)
BYD77E to G
a = 1.42; VR=V
RRMmax
; δ = 0.5.
Switched mode application.
Fig.3 Maximum permissible average forward
current asa functionof tie-pointtemperature (including losses due to reverse leakage).
handbook, halfpage
0
3
2
1
0
100 200
MCD596
o
tp
TC)(
I
F(AV)
(A)
BYD77A to D
a = 1.42; VR=V
RRMmax
; δ = 0.5. Device mounted as shown in Fig.16. Switched mode application.
Fig.4 Maximum permissible average forward
currentas afunction ofambienttemperature (including losses due to reverse leakage).
handbook, halfpage
0
1.2
0.8
0.4
0
100 200
MCD597
I
F(AV)
(A)
T ( C)
o
amb
Fig.5 Maximum permissible average forward
currentas afunction ofambient temperature (including losses due to reverse leakage).
BYD77E to G
a = 1.42; VR=V
RRMmax
; δ = 0.5. Device mounted as shown in Fig.16. Switched mode application.
handbook, halfpage
0 100 200
1.0
0
MCD595
0.5
I
F(AV)
(A)
T ( C)
o
amb
Page 6
1999 Nov 15 6
Philips Semiconductors Product specification
Ultra fast low-loss controlled avalanche rectifiers
BYD77 series
handbook, full pagewidth
MCD593
10
-1
10
0
10
1
10
2
10
3
10
4
t
p
(ms)
10
-2
20
0
10
(A)
I
FRM
0.5
1
δ =
0.05
0.1
0.2
BYD77A to D
Ttp= 105 °C; R
th j-tp
= 30 K/W.
V
RRMmax
during 1 −δ; curves include derating for T
j max
at V
RRM
= 200 V.
Fig.6 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
handbook, full pagewidth
MCD591
10
-1
10
0
10
1
10
2
10
3
10
4
t
p
(ms)
10
-2
20
0
10
(A)
I
FRM
0.5 1
0.2
0.1
δ =
0.05
BYD77E to G
Ttp= 105°C; R
th j-tp
= 30 K/W.
V
RRMmax
during 1 −δ; curves include derating for T
j max
at V
RRM
= 400 V.
Fig.7 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
Page 7
1999 Nov 15 7
Philips Semiconductors Product specification
Ultra fast low-loss controlled avalanche rectifiers
BYD77 series
handbook, full pagewidth
MCD592
10
-1
10
0
10
1
10
2
10
3
10
4
t
p
(ms)
10
-2
10
0
5
(A)
I
FRM
0.1
0.2
1
δ =
0.05
0.5
BYD77A to D
T
amb
=60°C; R
th j-a
= 150 K/W.
V
RRMmax
during 1 −δ; curves include derating for T
j max
at V
RRM
= 200 V.
Fig.8 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
handbook, full pagewidth
MCD590
10
-1
10
0
10
1
10
2
10
3
10
4
t
p
(ms)
10
-2
10
0
5
(A)
I
FRM
0.1
0.2
1
δ =
0.05
0.5
BYD77E to G
T
amb
=60°C; R
th j-a
= 150 K/W.
V
RRMmax
during 1 −δ; curves include derating for T
j max
at V
RRM
= 400 V.
Fig.9 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
Page 8
1999 Nov 15 8
Philips Semiconductors Product specification
Ultra fast low-loss controlled avalanche rectifiers
BYD77 series
BYD77A to D
a=I
F(RMS)/IF(AV)
; VR=V
RRMmax
; δ = 0.5.
Fig.10 Maximum steadystate powerdissipation
(forward plus leakage current losses, excludingswitchinglosses) asa function of average forward current.
handbook, halfpage
02
2
0
MGC530
1
1
P
(W)
I
F(AV)
(A)
a=3 2
1.57 1.42
2.5
BYD77E to G
a=I
F(RMS)/IF(AV)
; VR=V
RRMmax
; δ = 0.5.
Fig.11 Maximum steadystate powerdissipation
(forward plus leakage current losses, excludingswitchinglosses) asa function of average forward current.
handbook, halfpage
02
2
0
MGC529
1
1
P
(W)
I
F(AV)
(A)
a=3 2
1.57 1.42
2.5
BYD77A to D
Dotted line: Tj= 175 °C. Solid line: Tj=25°C.
Fig.12 Forward current as a function of forward
voltage; maximum values.
handbook, halfpage
012
10
8
4
0
2
6
MCD594
VF (V)
I
F
(A)
BYD77E to G
Dotted line: Tj= 175 °C. Solid line: Tj=25°C.
Fig.13 Forward current as a function of forward
voltage; maximum values.
handbook, halfpage
0123
10
I
F
0
8
MGC531
6
4
2
(A)
VF (V)
Page 9
1999 Nov 15 9
Philips Semiconductors Product specification
Ultra fast low-loss controlled avalanche rectifiers
BYD77 series
Fig.14 Reverse current as a function of junction
temperature; maximum values.
handbook, halfpage
10
3
10
2
10
1
200
0
MGA853
100
T ( C)
j
o
I
R
( A)µ
VR=V
RRMmax
. f = 1 MHz; Tj=25°C.
Fig.15 Diode capacitanceas a functionof reverse
voltage; typical values.
handbook, halfpage
1
MCD608
10 10 10
1
10
10
V
R
(V)
C
d
(pF)
2
23
A, B, C, D
E, F, G
MSB213
4.5
2.5
1.25
50
50
Fig.16 Printed-circuit board for surface mounting.
Dimensions in mm.
Fig.17 Reverse recovery definitions.
dbook, halfpage
10%
100%
dI
dt
t
t
rr
I
F
I
R
MGC499
F
dI
dt
R
Page 10
1999 Nov 15 10
Philips Semiconductors Product specification
Ultra fast low-loss controlled avalanche rectifiers
BYD77 series
handbook, full pagewidth
10
1
50
25 V
DUT
MAM057
+
t
rr
0.5
0
0.5
1.0
I
F
(A)
I
R
(A)
t
0.25
Fig.18 Test circuit and reverse recovery time waveform and definition.
Input impedance oscilloscope: 1 M, 22 pF; tr≤ 7 ns. Source impedance: 50 ; tr≤ 15 ns.
Page 11
1999 Nov 15 11
Philips Semiconductors Product specification
Ultra fast low-loss controlled avalanche rectifiers
BYD77 series
PACKAGE OUTLINE
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in suchapplications do so at their ownrisk and agree to fullyindemnify Philips for any damages resultingfrom such improper use or sale.
Data Sheet Status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
SOD87 100H03
99-03-31 99-06-04
Hermetically sealed glass surface mounted package; Implotec
TM(1)
technology; 2 connectors
SOD87
UNIT
D
mm
2.1
2.0
2.0
1.8
3.7
3.3
0.3
D1
H
L
DIMENSIONS (mm are the original dimensions)
H
DD
1
LL
(2)
0 1 2 mm
scale
Notes
1. Implotec is a trademark of Philips.
2. The marking indicates the cathode.
ka
Page 12
© Philips Electronics N.V. SCA All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
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Internet: http://www.semiconductors.philips.com
1999
68
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Printed in The Netherlands 135002/03/pp12 Date of release:1999 Nov 15 Document order number: 9397 750 06272
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