Page 1
DISCRETE SEMICONDUCTORS
DATA SH EET
, halfpage
M3D119
BYD43 series
Fast soft-recovery rectifiers
Product specification
Supersedes data of February 1995
1996 Jun 05
Page 2
Philips Semiconductors Product specification
Fast soft-recovery rectifiers BYD43 series
FEATURES
• Glass passivated
• High maximum operating
temperature
DESCRIPTION
Cavity free cylindrical glass package
through Implotec
(1)
technology.
This package is hermetically sealed
and fatigue free as coefficients of
expansion of all used parts are
matched.
(1) Implotec is a trademark of Philips.
• Low leakage current
• Excellent stability
• Available in ammo-pack.
handbook, 4 columns
ak
MAM123
Fig.1 Simplified outline (SOD81) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
RSM
non-repetitive peak reverse voltage
BYD43U − 1300 V
BYD43V − 1500 V
BYD43-16 − 1700 V
BYD43-18 − 1900 V
BYD43-20 − 2100 V
V
RRM
repetitive peak reverse voltage
BYD43U − 1200 V
BYD43V − 1400 V
BYD43-16 − 1600 V
BYD43-18 − 1800 V
BYD43-20 − 2000 V
I
F(AV)
I
F(AV)
I
FRM
average forward current Ttp=55°C; lead length = 10 mm;
BYD43U and V − 1.20 A
BYD43-16 to 20 − 0.68 A
average forward current T
BYD43U and V − 0.65 A
BYD43-16 to 20 − 0.30 A
see Figs 2 and 3;
averaged over any 20 ms period;
see also Figs 10 and 11
=65°C; PCB mounting (see
amb
Fig.20); see Figs 4 and 5;
averaged over any 20 ms period;
see also Figs 10 and 11
repetitive peak forward current Ttp=55°C; see Figs 6 and 7
BYD43U and V − 11 A
BYD43-16 to 20 − 6A
I
FRM
repetitive peak forward current T
=65°C; see Figs 8 and 9
amb
BYD43U and V − 6.0 A
BYD43-16 to 20 − 3.2 A
1996 Jun 05 2
Page 3
Philips Semiconductors Product specification
Fast soft-recovery rectifiers BYD43 series
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
I
FSM
T
stg
T
j
ELECTRICAL CHARACTERISTICS
T
=25°C unless otherwise specified.
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
F
V
F
I
R
I
R
t
rr
C
d
dI
R
-------dt
non-repetitive peak forward current t = 10 ms half sinewave; Tj=T
BYD43U and V − 6A
prior to surge; VR=V
RRMmax
j max
BYD43-16 to 20 − 6A
storage temperature −65 +175 °C
junction temperature see Figs 12 and 13 −65 +175 °C
forward voltage IF= 1 A; Tj=T
BYD43U and V −−1.20 V
see Figs 14 and 15
j max
;
BYD43-16 to 20 −−2.05 V
forward voltage IF=1A;
BYD43U and V −−1.5 V
see Figs 14 and 15
BYD43-16 to 20 −−2.4 V
reverse current VR=V
BYD43U and V −− 1µA
see Figs 16 and 17
RRMmax
;
BYD43-16 to 20 −− 5µA
reverse current VR=V
RRMmax
BYD43U and V Tj= 165 °C; see Fig 16 −−100 µA
BYD43-16 to 20 T
= 125 °C; see Fig 17 −− 50 µA
j
reverse recovery time when switched from
BYD43U and V −−250 ns
BYD43-16 to 20 −−300 ns
IF= 0.5 A to IR=1A;
measured at IR= 0.25 A;
see Fig 22
diode capacitance f = 1 MHz; VR=0V;
BYD43U and V − 20 − pF
see Figs 18 and 19
BYD43-16 to 20 − 15 − pF
maximum slope of reverse recovery
current
BYD43U and V −− 5A/µs
BYD43-16 to 20 −− 5A/µs
when switched from
I
= 1 A to VR≥ 30 V
F
and dIF/dt = −1A/µs;
see Fig.21
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
R
th j-tp
th j-a
thermal resistance from junction to tie-point lead length = 10 mm 60 K/W
thermal resistance from junction to ambient note 1 120 K/W
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.20.
For more information please refer to the
“General Part of associated Handbook”
.
1996 Jun 05 3
Page 4
Philips Semiconductors Product specification
Fast soft-recovery rectifiers BYD43 series
GRAPHICAL DATA
1.6
handbook, halfpage
I
F(AV)
(A)
1.2
0.8
0.4
0
0 200
BYD43U andV
a =1.42; VR=V
Switched mode application.
RRMmax
lead length 10 mm
100
; δ= 0.5.
Ttp( C)
MLC311
o
Fig.2 Maximum permissible average forward
current as a function of tie-point temperature
(including losses due to reverse leakage).
0.8
handbook, halfpage
I
F(AV)
(A)
0.6
0.4
0.2
0
0 200
BYD43-16 to20
a =1.42; VR=V
Switched mode application.
RRMmax
lead length 10 mm
100
; δ= 0.5.
o
Ttp( C)
Fig.3 Maximum permissible average forward
current as a function of tie-point temperature
(including losses due to reverse leakage).
MLC315
amb
MLC312
o
1.0
handbook, halfpage
I
F(AV)
(A)
0.8
0.6
0.4
0.2
0
0 200
BYD43U andV
a =1.42; VR=V
Device mounted as shown in Fig.20.
Switched mode application.
RRMmax
; δ= 0.5.
100
T ( C)
Fig.4 Maximum permissible average forward
current as a function of ambient temperature
(including losses due to reverse leakage).
0.5
handbook, halfpage
I
F(AV)
(A)
0.4
0.3
0.2
0.1
0
0 200
BYD43-16 to20
a =1.42; VR=V
Device mounted as shown in Fig.20.
Switched mode application.
RRMmax
; δ= 0.5.
100
o
T ( C)
amb
Fig.5 Maximum permissible average forward
current as a function of ambient temperature
(including losses due to reverse leakage).
MLC316
1996 Jun 05 4
Page 5
Philips Semiconductors Product specification
Fast soft-recovery rectifiers BYD43 series
12
handbook, full pagewidth
I
FRM
(A)
10
δ = 0.05
8
0.1
6
0.2
4
0.5
2
1
0
2
10
1
10
11010
2103
BYD43U andV
Ttp=55°C; R
V
during 1 −δ; curves include derating for T
RRMmax
th j-tp
= 60 K/W.
j max
at V
RRM
= 1 400 V.
Fig.6 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
t (ms)
p
MLC320
4
10
I
FRM
8
handbook, full pagewidth
(A)
6
δ = 0.05
4
0.1
0.2
2
0.5
1
0
2
10
1
10
11010
2103
BYD43-16 to 20
Ttp=55°C; R
V
during 1 −δ; curves include derating for T
RRMmax
th j-tp
= 60 K/W.
j max
at V
RRM
= 2000 V.
Fig.7 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
t (ms)
p
MLC322
4
10
1996 Jun 05 5
Page 6
Philips Semiconductors Product specification
Fast soft-recovery rectifiers BYD43 series
I
FRM
8
handbook, full pagewidth
(A)
6
δ = 0.05
4
0.1
0.2
2
0.5
1
0
2
10
1
10
11010
2103
BYD43U and V
T
=65°C; R
amb
V
during 1 −δ; curves include derating for T
RRMmax
th j-a
= 120 K/W.
j max
at V
RRM
= 1400 V.
Fig.8 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
t (ms)
p
MLC321
4
10
I
FRM
4
handbook, full pagewidth
(A)
3
δ = 0.05
2
0.1
0.2
1
0.5
1
0
2
10
1
10
11010
2103
BYD43-16 to 20
T
=65°C; R
amb
V
during 1 −δ; curves include derating for T
RRMmax
th j-a
= 120 K/W.
j max
at V
RRM
= 2000 V.
Fig.9 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
t (ms)
p
MLC323
4
10
1996 Jun 05 6
Page 7
Philips Semiconductors Product specification
Fast soft-recovery rectifiers BYD43 series
handbook, halfpage
3
P
(W)
2
1
0
0
BYD43U and V
a=I
F(RMS)/IF(AV)
; VR=V
a = 3 2.5 2
; δ = 0.5.
RRMmax
1.57
1.42
12
I (A)
F(AV)
MLC310
Fig.10 Maximum steady state power dissipation
(forward plus leakage current losses,
excluding switching losses) as a function of
average forward current.
handbook, halfpage
3
P
(W)
2
1
0
0
BYD43-16 to 20
a=I
F(RMS)/IF(AV)
; VR=V
a = 3 2.5 2
0.5 1.0
; δ = 0.5.
RRMmax
1.57
I (A)
F(AV)
MLC314
1.42
Fig.11 Maximum steady state power dissipation
(forward plus leakage current losses,
excluding switching losses) as a function of
average forward current.
V (V)
R
MLC265
200
handbook, halfpage
T
j
o
( C)
100
0
0 2000
BYD43U and V
V
; δ = 0.5.
RRM
BYD43U BYD43V
1000
Fig.12 Maximum permissible junction temperature
as a function of reverse voltage.
V (V)
R
MLC318
18 20BYD43-16
200
handbook, halfpage
T
j
o
( C)
100
0
0 2000
BYD43-16 to 20
Dotted line = V
Solid line = V
RRM
RRM
1000
; δ = 0.1.
; δ = 0.5.
Fig.13 Maximum permissible junction temperature
as a function of reverse voltage.
1996 Jun 05 7
Page 8
Philips Semiconductors Product specification
Fast soft-recovery rectifiers BYD43 series
handbook, halfpage
6
I
F
(A)
4
2
0
023
BYD43U and V
Dotted line: Tj= 175 °C.
Solid line: Tj=25°C.
1
V (V)
F
Fig.14 Forward current as a function of forward
voltage; maximum values.
MLC309
handbook, halfpage
3
I
F
(A)
2
1
0
04
BYD43-16 to 20
Dotted line: Tj= 175 °C.
Solid line: Tj=25°C.
2
V (V)
F
Fig.15 Forward current as a function of forward
voltage; maximum values.
MLC192
o
T ( C)
j
MLC313
3
10
handbook, halfpage
I
R
(µA)
2
10
10
1
0 200100
BYD43U and V
VR=V
RRMmax
.
Fig.16 Reverse current as a function of junction
temperature; maximum values.
3
10
handbook, halfpage
I
R
(µA)
2
10
10
1
0 200100
BYD43-16 to 20
VR=V
RRMmax
.
o
T ( C)
j
Fig.17 Reverse current as a function of junction
temperature; maximum values.
MLC319
1996 Jun 05 8
Page 9
Philips Semiconductors Product specification
Fast soft-recovery rectifiers BYD43 series
2
10
handbook, halfpage
C
d
(pF)
10
1
1
BYD43U and V
f = 1 MHz; Tj=25°C.
10
10
MLC305
2
V (V)
R
Fig.18 Diode capacitance as a function of reverse
voltage; typical values.
10
handbook, halfpage
C
d
(pF)
3
10
1
1
BYD43-16 to 20
f = 1 MHz; Tj=25°C.
10
10
MLC317
2
V (V)
R
3
10
Fig.19 Diode capacitance as a function of reverse
voltage; typical values.
handbook, halfpage
Dimensions in mm.
50
25
7
50
2
3
MGA200
Fig.20 Device mounted on a printed-circuit board.
1996 Jun 05 9
I
handbook, halfpage
F
I
R
Fig.21 Reverse recovery definitions.
dI
F
dt
t
rr
t
10%
dI
R
dt
100%
MGC499
Page 10
Philips Semiconductors Product specification
Fast soft-recovery rectifiers BYD43 series
handbook, full pagewidth
10 Ω
Input impedance oscilloscope: 1 MΩ, 22 pF; tr≤ 7 ns.
Source impedance: 50 Ω; tr≤ 15 ns.
25 V
DUT
+
1 Ω
50 Ω
Fig.22 Test circuit and reverse recovery time waveform and definition.
I
(A)
(A)
0.25
R
I
0.5
0.5
F
t
rr
0
1
t
MAM057
1996 Jun 05 10
Page 11
Philips Semiconductors Product specification
Fast soft-recovery rectifiers BYD43 series
PACKAGE OUTLINE
handbook, full pagewidth
2.15
max
Dimensions in mm.
The marking band indicates the cathode.
5 max
3.8 max28 min 28 min
MBC051
0.81
max
Fig.23 SOD81.
DEFINITIONS
Data Sheet Status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Jun 05 11
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