Datasheet BYD17M, BYD17K, BYD17J-DE, BYD17J, BYD17G Datasheet (Philips)

DATA SH EET

Product specification
Supersedes data of 1996 Sep 26

1999 Nov 11

DISCRETE SEMICONDUCTORS

BYD17 series

General purpose
controlled avalanche rectifiers

b

ook, halfpage

M3D121

1999 Nov 11 2

Philips Semiconductors Product specification

General purpose
controlled avalanche rectifiers

BYD17 series

FEATURES

• Glass passivated

• High maximum operating

temperature

• Low leakage current

• Excellent stability

• Guaranteed avalanche energy

absorption capability

• Shipped in 8 mm embossed tape

• Smallest surface mount rectifier

outline.

DESCRIPTION

Cavity free cylindrical glass package
through Implotec

(1)

technology.

This package is hermetically sealed
and fatigue free as coefficients of
expansion of all used parts are
matched.

(1) Implotec is a trademark of Philips.

MARKING

TYPE NUMBER MARKING CODE

BYD17D 17D PH
BYD17G 17G PH
BYD17J 17J PH
BYD17K 17K PH
BYD17M 17M PH

handbook, 4 columns

MAM061

ka

Fig.1 Simplified outline (SOD87) and symbol.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

RRM

repetitive peak reverse voltage

BYD17D − 200 V
BYD17G − 400 V
BYD17J − 600 V
BYD17K − 800 V
BYD17M − 1000 V

V

RWM

crest working reverse voltage

BYD17D − 200 V
BYD17G − 400 V
BYD17J − 600 V
BYD17K − 800 V
BYD17M − 1000 V

V

R

continuous reverse voltage

BYD17D − 200 V
BYD17G − 400 V
BYD17J − 600 V
BYD17K − 800 V
BYD17M − 1000 V

1999 Nov 11 3

Philips Semiconductors Product specification

General purpose
controlled avalanche rectifiers

BYD17 series

ELECTRICAL CHARACTERISTICS

Tj=25°C; unless otherwise specified.

THERMAL CHARACTERISTICS

Note

1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥40 µm, see Fig.9.
For more information please refer to the

“General Part of associated Handbook”

.

I

F(AV)

average forward current Ttp= 105 °C;

averaged over any 20 ms period;
see Figs 2 and 4

− 1.5 A

T

amb

=65°C; PCB mounting (see
Fig.9);
averaged over any 20 ms period;
see Figs 3 and 4

− 0.6 A

I

FSM

non-repetitive peak forward current t = 10 ms half sinewave;

Tj=T

j max

prior to surge;

VR=V

RRMmax

− 20 A

E

RSM

non-repetitive peak reverse avalanche
energy

L = 120 mH; Tj=T

j max

prior to

surge; inductive load switched off

− 7mJ

T

stg

storage temperature −65 +175 °C

T

j

junction temperature see Fig.5 −65 +175 °C

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

F

forward voltage IF= 1 A; Tj=T

j max;

see Fig.6 −−0.93 V

I

F

= 1 A; see Fig.6 −−1.05 V

V

(BR)R

reverse avalanche
breakdown voltage

IR= 0.1 mA

BYD17D 225 −−V
BYD17G 450 −−V
BYD17J 650 −−V
BYD17K 900 −−V
BYD17M 1100 −−V

I

R

reverse current VR=V

RRMmax

; see Fig.7 −−1µA

V

R=VRRMmax

; Tj= 165 °C; see Fig.7 −−100 µA

t

rr

reverse recovery time when switched from IF= 0.5 A to IR=1A;

measured at IR= 0.25 A; see Fig.10

− 3 −µs

C

d

diode capacitance VR= 0 V; f = 1 MHz; see Fig.8 − 21 − pF

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th j-tp

thermal resistance from junction to tie-point 30 K/W

R

th j-a

thermal resistance from junction to ambient note 1 150 K/W

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

1999 Nov 11 4

Philips Semiconductors Product specification

General purpose
controlled avalanche rectifiers

BYD17 series

GRAPHICAL DATA

Fig.2 Maximum permissible average forward

current as a function of tie-point
temperature (including losses due to
reverse leakage).

a =1.57; VR=V

RRMmax

; δ= 0.5.

handbook, halfpage

0 200160120

0

MBH394

1

2

3

8040

Ttp (°C)

I

F(AV)

(A)

0 200160120

0

MSC293

0.2

0.4

0.6

0.8

1.0

8040

T

amb

(°C)

I

F(AV)

(A)

Fig.3 Maximum permissible average forward

current as a function of ambient
temperature (including losses due to
reverse leakage).

a =1.57; VR=V

RRMmax

; δ= 0.5.

Device mounted as shown in Fig.9.

Fig.4 Maximum steady state power dissipation

(forward plus leakage current losses,
excluding switchinglosses) as a function of
average forward current.

a=I

F(RMS)/IF(AV)

; VR=V

RRMmax

; δ = 0.5.

handbook, halfpage

0 1.61.2

0

MBH395

0.5

1.0

1.5

2.0

2.5

0.80.4

P

(W)

I

F(AV)

(A)

a = 3

1.42

1.57

2.5

2

Solid line = VR.
Dotted line = V

RRM

; δ = 0.5.

Fig.5 Maximum permissible junction temperature

as a function of reverse voltage.

handbook, halfpage

0

DGJKM

400 800 1200

200

0

100

50

150

MGC736

T

j

VR, V

RRM

(V)

( C)

o

1999 Nov 11 5

Philips Semiconductors Product specification

General purpose
controlled avalanche rectifiers

BYD17 series

Solid line: Tj=25°C.
Dotted line: Tj= 175 °C.

Fig.6 Forward current as a function of forward

voltage; maximum values.

handbook, halfpage

0

6

4

2

0

21

MBG048

I

F

(A)

VF (V)

Fig.7 Reverse current as a function of junction

temperature; maximum values.

handbook, halfpage

2000

10

3

MGC739

10

2

10

1

16012040 80

(µA)

I

R

Tj (

o

C)

VR=V

RRMmax.

Fig.8 Diode capacitance as a function of reverse

voltage; typical values.

f = 1 MHz; Tj=25°C.

handbook, halfpage

1

MGC740

10 10

2

10

3

1

10

2

10

(pF)

C

d

VR (V)

MSB213

4.5

2.5

1.25

50

50

Fig.9 Printed-circuit board for surface mounting.

Dimensions in mm.

1999 Nov 11 6

Philips Semiconductors Product specification

General purpose
controlled avalanche rectifiers

BYD17 series

handbook, full pagewidth

10 Ω

1 Ω

50 Ω

25 V

DUT

MAM057

+

t

rr

0.5

0

0.5

1.0

I

F

(A)

I

R

(A)

t

0.25

Fig.10 Test circuit and reverse recovery time waveform and definition.

Input impedance oscilloscope: 1 MΩ, 22 pF; tr≤ 7 ns.
Source impedance: 50 Ω; tr≤ 15 ns.

1999 Nov 11 7

Philips Semiconductors Product specification

General purpose
controlled avalanche rectifiers

BYD17 series

PACKAGE OUTLINE

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

SOD87 100H03

99-03-31
99-06-04

Hermetically sealed glass surface mounted package;
Implotec

TM(1)

technology; 2 connectors

SOD87

UNIT

D

mm

2.1

2.0

2.0

1.8

3.7

3.3

0.3

D1

H

L

DIMENSIONS (mm are the original dimensions)

H

DD

1

LL

(2)

0 1 2 mm

scale

Notes

1. Implotec is a trademark of Philips.

2. The marking indicates the cathode.

ka

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

1999

68

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Printed in The Netherlands 135002/03/pp8 Date of release: 1999 Nov 11 Document order number: 9397 750 06275