Datasheet BY329X-1200, BY329X-1000, BY329F-800, BY329F-1200, BY329F-1000 Datasheet (Philips)

Philips Semiconductors Product specification

Rectifier diodes BY329F, BY329X series
fast, soft-recovery

FEATURES SYMBOL QUICK REFERENCE DATA

• Low forward volt drop V

= 800 V/ 1000 V/ 1200 V

R

• Fast switching

• Soft recovery characteristic I

• High thermal cycling performance

• Isolated mounting tab I

k a
12

F(AV)

FSM

= 8 A

≤ 65 A

trr ≤ 145 ns

GENERAL DESCRIPTION

Glass-passivated double diffused rectifier diodes featuring low forward voltage drop, fast reverse recovery and soft
recoverycharacteristic. The devices areintended for usein TV receivers,monitors and switchedmodepower supplies.

The BY329F series is supplied in the conventional leaded SOD100 package.
The BY329X series is supplied in the conventional leaded SOD113 package.

PINNING SOD100 SOD113

PIN DESCRIPTION

1 cathode
2 anode

tab isolated

case

12

case

12

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

BY329F / BY329X -800 -1000 -1200

V

RSM

V

RRM

V

RWM

I

F(AV)

I

F(RMS)

I

FRM

I

FSM

I2tI
T

stg

T

j

1. Neglecting switching and reverse current losses.

Peak non-repetitive reverse - 800 1000 1200 V
voltage
Peak repetitive reverse voltage - 800 1000 1200 V
Crest working reverse voltage - 600 800 1000 V

Average forward current

1

square wave; δ = 0.5; - 8 A
Ths ≤ 83 ˚C
sinusoidal; a = 1.57; - 7 A

Ths ≤ 90 ˚C
RMS forward current - 11 A
Peak repetitive forward current t = 25 µs; δ = 0.5; - 16 A

Ths ≤ 83 ˚C
Peak non-repetitive forward t = 10 ms - 65 A
current. t = 8.3 ms - 71 A

sinusoidal; Tj = 150 ˚C prior

to surge; with reapplied

V

2

t for fusing t = 10 ms - 28 A2s

RWM(max)

Storage temperature -40 150 ˚C
Operating junction temperature - 150 ˚C

September 1998 1 Rev 1.100

Philips Semiconductors Product specification

Rectifier diodes BY329F, BY329X series
fast, soft-recovery

ISOLATION LIMITING VALUE & CHARACTERISTIC

Ths = 25 ˚C unless otherwise specified

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

isol

V

isol

C

isol

THERMAL RESISTANCES

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

R

th j-hs

R

th j-a

Peak isolation voltage from SOD100 package; R.H. ≤ 65%; clean and - - 1500 V
both terminals to external dustfree
heatsink

R.M.S. isolation voltage from SOD113 package; f = 50-60 Hz; - - 2500 V
both terminals to external sinusoidal waveform; R.H. ≤ 65%; clean
heatsink and dustfree

Capacitance from pin 1 to f = 1 MHz - 10 - pF
external heatsink

Thermal resistance junction to with heatsink compound - - 4.8 K/W
heatsink without heatsink compound - - 5.9 K/W
Thermal resistance junction to in free air. - 55 - K/W
ambient

STATIC CHARACTERISTICS

Tj = 25 ˚C unless otherwise stated

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

F

I

R

Forward voltage IF = 20 A - 1.5 1.85 V
Reverse current VR = V

; Tj = 125 ˚C - 0.1 1.0 mA

RWM

DYNAMIC CHARACTERISTICS

Tj = 25 ˚C unless otherwise stated

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

t

rr

Q

s

dIR/dt Maximum slope of the reverse IF = 2 A; -dIF/dt = 20 A/µs - 50 60 A/µs

Reverse recovery time IF = 1 A; VR > 30 V; -dIF/dt = 50 A/µs - 125 145 ns
Reverse recovery charge IF = 2 A; VR > 30 V; -dIF/dt = 20 A/µs - 0.5 0.7 µC

recovery current

September 1998 2 Rev 1.100

Philips Semiconductors Product specification

Rectifier diodes BY329F, BY329X series
fast, soft-recovery

I

F

dI

F

dt

trr

time

Qs

I

R

I

rrm

Fig.1. Definition of trr, Qs and I

PF / W

20

Vo = 1.25 V
Rs = 0.03 Ohms

15

10

5

0

0 2 4 6 8 10 12

0.1

BY329

0.5

0.2

I

IF(AV) / A

25%

Ths(max) / C

t

p

T

rrm

D = 1.0

D =

Fig.2. Maximum forward dissipation, PF = f(I

square wave current waveform; parameter D = duty

cycle = tp/T

.

100%

54

78

102

t

p

T

126

t

150

);

F(AV)

IFS (RMS) / A

100

90
80
70
60
50
40
30
20
10

0

1ms 10ms 0.1s 1s 10s

IFSM

tp / s

BY329

Fig.4. Maximum non-repetitive rms forward current.

IF = f(tp); sinusoidal current waveform; Tj = 150˚C prior

to surge with reapplied V

IF / A

30

Tj = 150 C
Tj = 25 C

20

10

typ

0

0 1

0.5
VF / V

1.5

RWM

max

.

BY229F

2

Fig.5. Typical and maximum forward characteristic;

IF = f(VF); parameter T

j

BY329

IF = 10 A

10 A

1 A

2 A
1 A

2.2

Ths(max) / C

a = 1.57

1.9

.

78

102

126

150

F(AV)

PF / W

15

Vo = 1.25 V

Rs = 0.03 Ohms

10

5

0

0 2 4 6 8

BY329

2.8

4

IF(AV) / A

Fig.3. Maximum forward dissipation, PF = f(I

sinusoidal current waveform; parameter a = form

factor = I

F(RMS)/IF(AV)

Qs / uC

10

Tj = 150 C
Tj = 25 C

2 A

1

0.1
1 100

);

Fig.6. Maximum Qs at Tj = 25˚C and 150˚C

10

-dIF/dt (A/us)

September 1998 3 Rev 1.100

Philips Semiconductors Product specification

Rectifier diodes BY329F, BY329X series
fast, soft-recovery

trr / ns

1000

IF = 10 A

100

Tj = 150 C
Tj = 25 C

10

1 10 100

-dIF/dt (A/us)

Fig.7. Maximum trr measured to 25% of I

and 150˚C

Cd / pF

100

10

BY329

10A

1 A

1A

; Tj = 25˚C

rrm

BY329

Transient thermal impedance, Zth j-hs (K/W)

10

1

0.1

p

D =

BY229F

t
T

t

p

t

0.01

0.001
1us 10us 100us 1ms 10ms 100ms 1s 10s

P

D

pulse width, tp (s)

T

Fig.9. Transient thermal impedance Zth = f(tp)

1

1 100

Fig.8. Typical junction capacitance Cd at f = 1 MHz

10 1000

VR / V

Tj = 25˚C

;

September 1998 4 Rev 1.100

Philips Semiconductors Product specification

Rectifier diodes BY329F, BY329X series
fast, soft-recovery

MECHANICAL DATA

Dimensions in mm
Net Mass: 2 g

3.5 max

not tinned

10.2
max

5.7

max

3.2

3.0

4.4

0.9

0.5

4.4

4.0

seating

plane

13.5
min

4.4

max

2.9 max

7.9

7.5
17

max

ka

M0.4

5.08

Fig.10. SOD100; The seating plane is electrically isolated from all terminals.

Notes

1. Refer to mounting instructions for F-pack envelopes.

2. Epoxy meets UL94 V0 at 1/8".

0.9

0.7

top view

0.55 max

1.3

September 1998 5 Rev 1.100

Philips Semiconductors Product specification

Rectifier diodes BY329F, BY329X series
fast, soft-recovery

MECHANICAL DATA

Dimensions in mm

10.3
max

Net Mass: 2 g

3.2

3.0

Recesses (2x)

2.5

0.8 max. depth

3 max.

not tinned

13.5
min.

0.4

12

M

5.08

2.8

2.54

15.8
max.

3

Fig.11. SOD113; The seating plane is electrically isolated from all terminals.

Notes

1. Refer to mounting instructions for F-pack envelopes.

2. Epoxy meets UL94 V0 at 1/8".

19

max.

seating

plane

0.5

2.5

4.6

max

2.9 max

6.4

0.6

2.5

15.8
max

1.0 (2x)

0.9

0.7

September 1998 6 Rev 1.100

Philips Semiconductors Product specification

Rectifier diodes BY329F, BY329X series
fast, soft-recovery

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

 Philips Electronics N.V. 1998

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.

The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.

September 1998 7 Rev 1.100