Datasheet BULD118D-1 Datasheet (SGS Thomson Microelectronics)

Page 1
HIGH VOLTAGE FAST-SWITCHING
INTEGRATED ANTIPARALLEL
COLLECTOR- EMITTER DIODE
HIGH VOLTAGECAPABILITY
LOW SPREADOFDYNAMIC PARAMETERS
MINIMUMLOT-TO-LOT SPREADFOR
VERYHIGH SWITCHINGSPEED
APPLICATIONS:
ELECTRONICBALLASTSFOR
FLUORESCENTLIGHTING
FLYBACKAND FORWARDSINGLE
TRANSISTOR LOWPOWER CONVERTERS
DESCRIPTION
The device is manufactured using high voltage Multi Epitaxial Planar technology for high switchingspeeds andmediumvoltage capability.
It uses a Cellular Emitter structure with planar edge termination to enhance switching speeds while maintainingthe wide RBSOA.
The device is designed for use in lighting applications and low cost switch-mode power supplies.
BULD118D-1
NPN POWER TRANSISTOR
3
2
1
IPAK
(TO-251)
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symb o l Parame t er Val u e Uni t
V V V
I
I P
T
June 1998
Collector-Emitter V oltage (VBE= 0) 700 V
CES
Collector-Emitter V oltage (IB= 0) 400 V
CEO
Emitter-Base V oltage (IC=0) 9 V
EBO
Collect or Current 2 A
I
C
Collect or Peak Cu rr ent (tp<5ms) 4 A
CM
Base Current 1 A
I
B
Base Peak Current (tp<5ms) 2 A
BM
Total Dis sipation at Tc=25oC20W
tot
Stora ge Temperat u re -65 t o 150
stg
Max. O perating Junc t i on Temperat u r e 150
T
j
o
C
o
C
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Page 2
BULD118D-1
THERMAL DATA
R
thj-case
R
thj-amb
Ther mal Res istance Junctio n-Cas e Max Thermal Resistance Junction-Ambient Max
6.25 100
o
C/W
o
C/W
ELECTRICAL CHARACTERISTICS (T
=25oC unless otherwise specified)
case
Symbol Parameter Test Cond itions Min. Typ. Max. Unit
I
CES
V
EBO
V
CEO(sus)
Collector C ut-off Current (V
BE
=0)
=700V
V
CE
V
=700V Tj=125oC
CE
100 500
µA µA
Emitt er-Base Voltage IE=10mA 9 V Collector-Emit t er
IC= 100 mA L = 25 mH 400 V
Sust aining Volt ag e
I
CEO
Collector-Emit t er
VCE=400V 250 µA
Leakage Current
V
Collector-Emit t er
CE(sat)
Saturation Voltage
V
Base-Emitt er
BE(sat)
Saturation Voltage
h
DC Cur rent Gain IC=10mA VCE=5V
FE
IC=0.5A IB=0.1A
=1A IB=0.2A
I
C
=2A IB=0.4A
I
C
IC=0.5A IB=0.1A
=1A IB=0.2A
I
C
I
=2A IB=0.4A
C
=0.5A VCE=5V
I
C
=2A VCE=5V
I
C
10 10
0.5 1
1.5
1.0
1.2
1.3
50
8
V V V
V V V
RESI STIVE LO AD
t
Rise Time
r
t
Fall Time
f
t
s
St orage Time group A group B
INDUCTIVE LOAD
t
V
Pulsed: Pulse duration = 300 µs, duty cycle 1.5 % Note : Productis pre-selected in storage time(GROUP A and GROUP B).SGS-THOMSON reserves the right to ship either groups according to production availability. Please contact your nearest SGS THOMSON MICROELECTRONICS sales office for delivery details.
St orage Time
s
t
Fall Time
f
Diode Forward Volt age IC = 1 A 2.5 V
F
VCC = 125 V I
=0.4A IB2=-0.2A
I
B1
=30µs
t
p
=2A
C
IC=1A IB1=0.2A
=-5V L=50mH
V
BE
V
clamp
= 300 V
1.4 2
0.7
0.3 0.5
2.1
2.75
0.8
0.10
µs µs
µs µs
µs µs
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Page 3
BULD118D-1
Safe OperatingAreas
DCCurrent Gain
DeratingCurve
DC Current Gain
CollectorEmitter Saturation Voltage
BaseEmitter Saturation Voltage
3/7
Page 4
BULD118D-1
InductiveFall Time InductiveStorage Time
ResistiveFall Time Resistive Load Storage Time
ReverseBiased SOA
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Page 5
Figure1: Inductive LoadSwitching TestCircuit.
1) Fast electronic switch
2) Non- indu c t ive Resistor
3) Fast r ecovery rectifi er
Figure2: Resistive LoadSwitching Test Circuit.
BULD118D-1
1) Fast electronic switch
2) Non- indu c t ive Resistor
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Page 6
BULD118D-1
TO-251 (IPAK) MECHANICAL DATA
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 2.2 2.4 0.086 0.094 A1 0.9 1.1 0.035 0.043 A3 0.7 1.3 0.027 0.051
B 0.64 0.9 0.025 0.031 B2 5.2 5.4 0.204 0.212 B3 0.85 0.033 B5 0.3 0.012 B6 0.95 0.037
C 0.45 0.6 0.017 0.023 C2 0.48 0.6 0.019 0.023
D 6 6.2 0.236 0.244
E 6.4 6.6 0.252 0.260
G 4.4 4.6 0.173 0.181
H 15.9 16.3 0.626 0.641
L 9 9.4 0.354 0.370
L1 0.8 1.2 0.031 0.047 L2 0.8 1 0.031 0.039
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A
E
==
C2
L2
B2
==
H
C
A3
A1
B6
L
B
B5
G
==
D
B3
2
13
L1
0068771-E
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BULD118D-1
Information furnished is believed tobe accurate and reliable. However,STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject tochange without notice. This publication supersedes and replaces allinformation previously supplied.STMicroelectronics products are not authorized foruse as critical components in life support devices or systems without express written approval of STMicroelectronics.
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