Datasheet BUK555-60B, BUK555-60A Datasheet (Philips)

Philips Semiconductors Product Specification

PowerMOS transistor BUK555-60A/B
Logic level FET

GENERAL DESCRIPTION QUICK REFERENCE DATA

N-channel enhancement mode SYMBOL PARAMETER MAX. MAX. UNIT
logic level field-effect power
transistor in a plastic envelope. BUK555 -60A -60B
The device is intended for use in V
Switched Mode Power Supplies I
(SMPS), motor control, welding, P
DC/DC and AC/DC converters, and T
in automotive and general purpose R
switching applications. resistance; VGS = 5 V

DS

D

tot
j

DS(ON)

PINNING - TO220AB PIN CONFIGURATION SYMBOL

Drain-source voltage 60 60 V
Drain current (DC) 39 35 A
Total power dissipation 125 125 W
Junction temperature 175 175 ˚C
Drain-source on-state 0.042 0.055 Ω

PIN DESCRIPTION

tab

d

1 gate
2 drain
3 source

tab drain

123

g

s

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134)

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

DS

V

DGR

±V

GS

±V

GSM

I

D

I

D

I

DM

P

tot

T

stg

T

j

Drain-source voltage - - 60 V
Drain-gate voltage RGS = 20 kΩ -60V
Gate-source voltage - - 15 V
Non-repetitive gate-source voltage tp ≤ 50 µs - 20 V

-60A -60B

Drain current (DC) Tmb = 25 ˚C - 39 35 A
Drain current (DC) Tmb = 100 ˚C - 28 25 A
Drain current (pulse peak value) Tmb = 25 ˚C - 156 140 A

Total power dissipation Tmb = 25 ˚C - 125 W
Storage temperature - - 55 175 ˚C
Junction Temperature - - 175 ˚C

THERMAL RESISTANCES

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

R

th j-mb

R

th j-a

April 1993 1 Rev 1.100

Thermal resistance junction to - - 1.2 K/W
mounting base
Thermal resistance junction to - 60 - K/W
ambient

Philips Semiconductors Product Specification

PowerMOS transistor BUK555-60A/B
Logic level FET

STATIC CHARACTERISTICS

Tmb = 25 ˚C unless otherwise specified

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

(BR)DSS

V

GS(TO)

I

DSS

I

DSS

I

GSS

R

DS(ON)

DYNAMIC CHARACTERISTICS

Tmb = 25 ˚C unless otherwise specified

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

g

fs

C

iss

C

oss

C

rss

t

d on

t

r

t

d off

t

f

L

d

L

d

L

s

Drain-source breakdown VGS = 0 V; ID = 0.25 mA 60 - - V
voltage
Gate threshold voltage VDS = VGS; ID = 1 mA 1.0 1.5 2.0 V
Zero gate voltage drain current VDS = 60 V; VGS = 0 V; Tj = 25 ˚C - 1 10 µA
Zero gate voltage drain current VDS = 60 V; VGS = 0 V; Tj =125 ˚C - 0.1 1.0 mA
Gate source leakage current VGS = ±15 V; VDS = 0 V - 10 100 nA
Drain-source on-state VGS = 5 V; BUK555-60A - 0.035 0.042 Ω
resistance ID = 20 A BUK555-60B - 0.045 0.055 Ω

Forward transconductance VDS = 25 V; ID = 20 A 11 20 - S
Input capacitance VGS = 0 V; VDS = 25 V; f = 1 MHz - 1450 1750 pF

Output capacitance - 500 600 pF
Feedback capacitance - 220 275 pF

Turn-on delay time VDD = 30 V; ID = 3 A; - 25 40 ns
Turn-on rise time VGS = 5 V; RGS = 50 Ω; - 120 150 ns
Turn-off delay time R
Turn-off fall time - 110 145 ns

= 50 Ω - 160 220 ns

gen

Internal drain inductance Measured from contact screw on - 3.5 - nH

tab to centre of die

Internal drain inductance Measured from drain lead 6 mm - 4.5 - nH

from package to centre of die

Internal source inductance Measured from source lead 6 mm - 7.5 - nH

from package to source bond pad

REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS

Tmb = 25 ˚C unless otherwise specified

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

DR

I

DRM

V
t

rr

Q

SD

rr

Continuous reverse drain - - - 39 A
current
Pulsed reverse drain current - - - 156 A
Diode forward voltage IF = 39 A ; VGS = 0 V - 1.4 2.0 V

Reverse recovery time IF = 39 A; -dIF/dt = 100 A/µs; - 60 - ns
Reverse recovery charge VGS = 0 V; VR = 30 V - 0.30 - µC

AVALANCHE LIMITING VALUE

Tmb = 25 ˚C unless otherwise specified

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

W

DSS

April 1993 2 Rev 1.100

Drain-source non-repetitive ID = 39 A ; VDD ≤ 25 V ; - - 90 mJ
unclamped inductive turn-off VGS = 5 V ; RGS = 50 Ω
energy

Philips Semiconductors Product Specification

PowerMOS transistor BUK555-60A/B
Logic level FET

PD%

120
110
100

90
80
70
60
50
40
30
20
10

0

0 20 40 60 80 100 120 140 160 180

Normalised Power Derating

Tmb / C

Fig.1. Normalised power dissipation.

PD% = 100⋅PD/P

ID%

120
110
100

90
80
70
60
50
40
30
20
10

0

0 20 40 60 80 100 120 140 160 180

Tmb / C

= f(Tmb)

D 25 ˚C

Normalised Current Derating

Fig.2. Normalised continuous drain current.

ID% = 100⋅ID/I

= f(Tmb); conditions: VGS ≥ 5 V

D 25 ˚C

Zth j-mb / (K/W)

10

D =

1

0.5

0.2

0.1

0.1

0.05

0.02

0.01

0.001

0

1E-07 1E-05 1E-03 1E-01 1E+01

t / s

P

D

BUKx55-lv

p

p

t

t

D =

T

t

T

Fig.4. Transient thermal impedance.

Z

= f(t); parameter D = tp/T

th j-mb

ID / A

100

80

60

40

20

0

0 2 4 6 8 10

10

7

VDS / V

BUK555-50A

VGS / V =

5

4

3

Fig.5. Typical output characteristics, Tj = 25 ˚C

ID = f(VDS); parameter V

GS

.

ID / A

1000

100

RDS(ON) = VDS/ID

10

1

1 100

DC

10

A

B

VDS / V

BUK555-60

tp = 10 us

100 us

1 ms
10 ms

100 ms

Fig.3. Safe operating area. Tmb = 25 ˚C

ID & IDM = f(VDS); IDM single pulse; parameter t

p

RDS(ON) / Ohm

0.20

3.5

4

4.5

ID / A

3

0.15

0.10

0.05

0

0 20 40 60 80 100

BUK555-50A

5

VGS / V =

7

10

Fig.6. Typical on-state resistance, Tj = 25 ˚C

R

= f(ID); parameter V

DS(ON)

GS

.

April 1993 3 Rev 1.100

Philips Semiconductors Product Specification

PowerMOS transistor BUK555-60A/B
Logic level FET

ID / A

80
70
60
50
40
30
20
10

0

0 2 4 6 8

Tj / C =

25 150

VGS / V

BUK555-50A

Fig.7. Typical transfer characteristics.

ID = f(VGS) ; conditions: VDS = 25 V; parameter T

gfs / S

20

16

12

8

BUK555-50A

VGS(TO) / V

2

1

0

-60 -20 20 60 100 140 180

max.

typ.

min.

Tj / C

Fig.10. Gate threshold voltage.

V

j

= f(Tj); conditions: ID = 1 mA; VDS = V

GS(TO)

1E-01

1E-02

1E-03

1E-04

ID / A

SUB-THRESHOLD CONDUCTION

2 %

typ

GS

98 %

4

0

0 20 40 60 80

Fig.8. Typical transconductance, Tj = 25 ˚C

ID / A

.

gfs = f(ID); conditions: VDS = 25 V

a

2.0

1.5

1.0

0.5

0

-60 -20 20 60 100 140 180

Normalised RDS(ON) = f(Tj)

Tj / C

Fig.9. Normalised drain-source on-state resistance.

a = R

DS(ON)/RDS(ON)25 ˚C

= f(Tj); ID = 20 A; VGS = 5 V

1E-05

1E-06

0 0.4 0.8 1.2 1.6 2 2.4

VGS / V

Fig.11. Sub-threshold drain current.

ID = f(V

10000

1000

100

10

Fig.12. Typical capacitances, C

C = f(VDS); conditions: VGS = 0 V; f = 1 MHz

; conditions: Tj = 25 ˚C; VDS = V

GS)

C / pF

0 20 40

VDS / V

, C

iss

BUK5y5-50

Ciss

Coss
Crss

, C

oss

GS

rss

.

April 1993 4 Rev 1.100

Philips Semiconductors Product Specification

PowerMOS transistor BUK555-60A/B
Logic level FET

VGS / V

12

10

8

6

4

2

0

0 20 40

QG / nC

BUK555-50

VDS / V =10

40

Fig.13. Typical turn-on gate-charge characteristics.

V

= f(QG); conditions: ID = 39 A; parameter V

GS

100

50

IF / A

BUK555-50A

DS

WDSS%

120
110
100

90
80
70
60
50
40
30
20
10

0

20 40 60 80 100 120 140 160 180

Tmb / C

Fig.15. Normalised avalanche energy rating.

W

% = f(Tmb); conditions: ID = 39 A

DSS

+

L

VDS

VGS

0

T.U.T.

-

VDD

-ID/100

Tj / C = 150

0

0 1 2

25

VSDS / V

Fig.14. Typical reverse diode current.

IF = f(V

); conditions: V

SDS

= 0 V; parameter T

GS

RGS

Fig.16. Avalanche energy test circuit.

W

= 0.5 ⋅LI

j

DSS

2

D

⋅ BV

DSS

/(BV

R 01

shunt

DSS−VDD

)

April 1993 5 Rev 1.100

Philips Semiconductors Product Specification

PowerMOS transistor BUK555-60A/B
Logic level FET

MECHANICAL DATA

Dimensions in mm
Net Mass: 2 g

10,3
max

1,3

3,7

4,5
max

3,0 max

not tinned

1,3

max

(2x)

123

2,54 2,54

2,8

3,0

13,5

min

0,9 max (3x)

5,9

min

15,8

max

0,6

2,4

Fig.17. TO220AB; pin 2 connected to mounting base.

Notes

1. Observe the general handling precautions for electrostatic-discharge sensitive devices (ESDs) to prevent
damage to MOS gate oxide.

2. Refer to mounting instructions for TO220 envelopes.

3. Epoxy meets UL94 V0 at 1/8".

April 1993 6 Rev 1.100

Philips Semiconductors Product Specification

PowerMOS transistor BUK555-60A/B
Logic level FET

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

 Philips Electronics N.V. 1996

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.

The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.

April 1993 7 Rev 1.100