Datasheet BTA24-600BWRG, BTA24-800BWRG, BTB24-600BRG Specification

Page 1
BTA/BTB24, BTA25, BTA26
®
and T25 Series
SNUBBERLESS™ & STANDARD 25A TRIACS
Symbol Value Unit
I
T(RMS)
V
DRM/VRRM
I
GT (Q1)
25 A
600 and 800 V
35 to 50 mA
DESCRIPTION
Available either in through-hole of surface and T25 mount packages, the BTA/BTB24-25-26 triac series is suitable for general purpose AC power switching. They can be used as an ON/OFF function in applications such as static relays, heating regulation, water heat ers, ind uction m otor
A1
A2
G
TO-220AB
Insulated
(BTA24)
A1
G
A2
A1
A2
G
A1
A2
G
D2PAK (T25G)
A2
A1
A2
G
A2
TO-220AB
(BTB24)
starting circuits...or for phase co ntrol operation in high power motor speed controllers, soft start circuits...The snubberless versions (BTA/BTB...W and T25 series) are specially recommended for use on inductive loads, thanks to their high commutation performances. By using an internal ceramic pad, the BTA series
RD91
(BTA25)
A1
A2
Insulated
(BTA26)
G
TOP3
provides voltage insulated tab (rated at 2500V RMS) complying with UL s tandards (Fi le r ef.: E81734).
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
I
T(RMS)
RMS on-state current (full sine wave) D²PAK
TO-220AB
RD91
TOP3 Ins.
Tc = 100°C
Tc = 90°C
25
TO-220AB Ins. Tc = 75°C
I
TSM
²
tI
I
dI/dt
V
DSM/VRSM
I
GM
P
G(AV)
T
stg
T
j
Non repetitive surge peak on-state current (full cycle, Tj initial = 25°C)
²
t Value for fusing
Critical rate of rise of on-state current
= 2 x IGT , tr 100 ns
I
G
Non repetitive surge peak off-state voltage
Peak gate current tp = 20 µs Tj = 125°C 4 A Average gate power dissipation Tj = 125°C 1 W Storage junction temperature range
Operating junction temperature range
F = 60 Hz t = 16.7 ms 260 A F = 50 Hz t = 20 ms 250
tp = 10 ms 340
F = 120 Hz Tj = 125°C 50 A/µs
V
tp = 10 ms Tj = 25°C
DRM/VRRM
+ 100
- 40 to + 150
- 40 to + 125
September 2002 - Ed: 6A
A
A
V
°C
²
s
1/9
Page 2
BTA/BTB24, BTA25, BT A26 and T25 Series
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)
SNUBBERLESS™ (3 Quadrants) T25-G, BTA/BTB24...W, BTA25...W, BTA26...W
Symbol Test Conditions Quadrant T25 BTA/BTB
T2535 CW B W
(1)
I
GT
V V
I
H
GT GD
(2) I
L
V
= 12 V RL = 33
D
VD = V
= 500 mA
I
T
IG = 1.2 I
RL = 3.3 k Tj = 125°C
DRM
GT
I - II - III MAX. 35 35 50 I - II - III MAX. 1.3 V
I - II - III MIN. 0.2
MAX. 50 50 75 mA
I - III MAX. 70 70 80 mA
II 80 80 100
dV/dt (2) V
= 67 % V
D
gate open Tj = 125°C
DRM
MIN. 500 500 1000 V/µs
(dI/dt)c (2) Without snubber Tj = 125°C MIN. 13 13 22 A/ms
STANDARD (4 Quadrants): BTB24...B, BTA25...B, BTA26...B
Symbol Test Conditions Quadrant Value Unit
I
GT
V
V
I
H
(1)
GT GD
(2)
I
L
= 12 V RL = 33
V
D
VD = V
= 500 mA
I
T
IG = 1.2 I
RL = 3.3 k Tj = 125°C
DRM
GT
I - II - III
IV
MAX.
ALL MAX. 1.3 V ALL MIN.
MAX. 80 mA
I - III - IV MAX. 70 mA
50
100
0.2 V
II 160
dV/dt (2) V
= 67 % V
D
gate open Tj = 125°C
DRM
MIN. 500 V/µs
(dV/dt)c (2) (dI/dt)c = 13.3 A/ms Tj = 125°C MIN. 10 V/µs
Unit
mA
mA
V
STATIC CHARACTERISTICS
Symbol Test Conditions Value Unit
= 35 A tp = 380 µs
V
TM
V
(2)
to
(2)
R
d
I
DRM
I
RRM
Note 1: minimum IGT is guaranted at 5% of IGT max. Note 2: for both polarities of A2 referenced to A1
TM
Threshold voltage Tj = 125°C MAX. 0.85 V Dynamic resistance Tj = 125°C MAX. 16 m V
= V
DRM
RRM
I
(2)
Tj = 25°C MAX. 1.55 V
Tj = 25°C
Tj = 125°C 3 mA
MAX.
A
2/9
Page 3
BTA/BTB24, BTA25, BT A26 and T25 Series
THERMAL RESISTANCES
Symbol Parameter Value Unit
R
th(j-c)
Junction to case (AC)
TO-220AB Insulated 1.7
R
th(j-a)
Junction to ambient
S = 1 cm
²
TO-220AB Insulated
S: Copper surface under tab
PRODUCT SELECTOR
Voltage (xxx)
Part Number
600 V 800 V
BTB24-xxxB X X 50 mA Standard TO-220AB BTA/BTB24-xxxBW X X 50 mA Snubberle ss TO-220AB BTA/BTB24-xxxCW X X 35 mA Snubbe rle ss TO-220AB BTA25-xxxB X X 50 mA Standard RD-91 BTA25-xxxBW X X 50 mA Snubberle ss RD-91 BTA25-xxxCW X X 35 mA Snubbe rle ss RD-91 BTA26-xxxB X X 50 mA Standard TOP3 Ins. BTA26-xxxBW X X 50 mA Snubberle ss TOP3 Ins. BTA26-xxxCW X X 35 mA Snubbe rle ss TOP3 Ins.
T2535-xxxG X X 35 mA Snubberle ss
Sensitivity Type
²
PAK
D
TO-220AB
RD91 (Insulated)
TOP3 Insulated
D²PAK
TOP3 Insulated 50
TO-220AB
0.8
1.1
45
60
Package
²
D
PAK
°C/W
°C/W
BTB: Non insulated TO-220AB package
ORDERING INFORMA T IO N
BT A 24 - 600 BW (RG)
TRIAC SERIES
INSULATION: A: insulated B: non insulated
CURRENT: 24: 25A inTO-220AB 25: 25A in Rd91 26: 25A inTOP3
VOLTAGE: 600: 600V 800: 800V
SENSITIVITY &TYPE B: 50mA STANDARD BW: 50mA SNUBBERLESS CW: 35mA SNUBBERLESS
PACKING MODE Blank: Bulk RG:Tube
3/9
Page 4
BTA/BTB24, BTA25, BT A26 and T25 Series
T 25 35 - 600 G (-TR)
TRIAC SERIES
CURRENT:25A
SENSITIVITY: 35: 35mA
OTHER INFORMATION
VOLTAGE: 600: 600V 800: 800V
PACKAGE:
2
G: D PAK
PACKING MODE: Blank:Tube
-TR:Tape & Reel
Part Number Marking Weight
Base
quantity
Packing
mode
BTA/BTB24-xxxyz BTA/BTB24xxxyz 2.3 g 250 Bulk BTA/BTB24-xxxyzRG BTA/BTB24-xxxyz 2.3 g 50 Tube BTA25-xxxyz BTA25xxxyz 20 g 25 Bulk BTA26-xxxyz BTA26xxxyz 4.5 g 120 Bulk T2535-xxxG T2535xxxG 1.5 g 50 Tube T2535-xxxG-TR T2535xxxG 1.5 g 1000 Tape & reel
Note: xxx= v ol t age, y = sensitivit y, z = type
4/9
Page 5
BTA/BTB24, BTA25, BT A26 and T25 Series
2
Fig. 1: Maximum power dissipation versus RMS on-state current (full cycle).
P (W)
30 25 20 15 10
5 0
0 5 10 15 20 25
IT(RMS) (A)
Fig. 2-2: D²PAK RMS on-state current versus ambient temperature (pr inted circuit board FR4, copper thickness: 35 µm), full cycle.
IT(RMS) (A)
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0 0 25 50 75 100 125
Tamb(°C)
2
DPAK
(S=1cm )
2
Fig. 2-1: RMS on-state current versus case temperature (full cycle).
IT(RMS) (A)
30 25 20 15
BTA24
BTA25/26
BTB/T25
10
5 0
0 25 50 75 100 125
Tc(°C)
Fig. 3: Relative variation of thermal impedance versus pulse duration.
K=[Zth/Rth]
1E+0
Zth(j-c)
1E-1
1E-2
1E-3
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+
Zth(j-a)
BTA/BTB24/T25
Zth(j-a) BTA26
tp (s)
Fig. 4: On-state characteristics (maximum values).
ITM (A)
300
100
10
1
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
Tj max
Tj=25°C
VTM (V)
Tj max. Vto = 0.85V Rd = 16 m
Fig. 5: Surge peak on-state current versus number of cycles.
ITSM (A)
300 250 200
Non repetitive Tj initial=25°C
150
Repetitive
100
50
0
1 10 100 1000
Tc=75°C
Number of cycles
t=20ms
One cycle
5/9
Page 6
BTA/BTB24, BTA25, BT A26 and T25 Series
0
0
2
2
2
5
0
Fig. 6: Non-repetitive surge peak on-state current for a sinusoidal pulse with width
tp < 10ms, and corresponding value of I²t.
ITSM (A), I²t (A²s)
3000
dI/dt limitation:
1000
100
50A/µs
tp (ms)
0.01 0.10 1.00 10.00
Tj initial=25°C
ITSM
I²t
Fig. 8: Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values).
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
.4 .2 .0
1.8
1.6
1.4
B
1.2
1.0
0.8
0.6
0.4
0.1 1.0 10.0 100.
(dV/dt)c (V/µs)
BW/CW/T2535
Fig. 7: Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values).
IGT,IH,IL[Tj] / IGT,IH,IL [Tj=25°C]
2.5
2.0
IGT
1.5
1.0
IH & IL
0.5
Tj(°C)
0.0
-40 -20 0 20 40 60 80 100 120 14
Fig. 9: Relative variation of critical rate of decrease of main current versus junction temperature.
(dI/dt)c [Tj] / (dI/dt)c [Tj specified]
6 5 4 3 2 1 0
0 25 50 75 100 12
Tj (°C)
Fig. 10: D²PAK Thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 µ m).
Rth(j-a) (°C/W)
0 0 0 0 0 0 0
10
0
0 4 8 12 16 20 24 28 32 36 4
6/9
S(cm²)
D²PAK
Page 7
PACKAGE MECHANICAL DATA
D²PAK (Plastic)
BTA/BTB24, BTA25, BT A26 and T25 Series
DIMENSIONS
A
L2
L
L3
E
B2 B
G
2.0 MIN. FLAT ZONE
C2
A1
C
A2
FOOTPRINT DIMENSIO NS (in millimeters) D²PAK (Plastic)
V2
REF .
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 4.30 4.60 0.169 0.181
A1 2.49 2.69 0.098 0.106
D
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
B2 1.25 1.40 0.048 0.055
C 0.45 0.60 0.017 0.024
C2 1.21 1.36 0.047 0.054
R
D 8.95 9.35 0.352 0.368 E 10.00 10.28 0.393 0.405
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069
R 0.40 0.016 V2
10.30
8.90
16.90
5.08
1.30
3.70
7/9
Page 8
BTA/BTB24, BTA25, BT A26 and T25 Series
PACKAGE MECHANICAL DATA
RD91 (Plastic)
L2 L1
B2
C
C2
N2
E3
A2
B1
C1
A1
N1
B
F
I
A
DIMENSIONS
REF .
Millimeters Inches
Min. Max. Min. Max.
A 40.00 1.575 A1 29.90 30.30 1.177 1.193 A2 22.00 0.867
B 27.00 1.063 B1 13.50 16.50 0.531 0.650 B2 24.00 0.945
C 14.00 0.551 C1 3.50 0.138 C2 1.95 3.00 0.077 0.118 E3 0.70 0.90 0.027 0.035
F 4.00 4.50 0.157 0.177
I 11.20 13.60 0.441 0.535 L1 3.10 3.50 0.122 0.138 L2 1.70 1.90 0.067 0.075
N1 33° 43° 33° 43°
N2 28° 38° 28° 38°
PACKAGE MECHANICAL DATA
TOP3 (Plastic)
DIMENSIONS
REF .
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 4.4 4.6 0.173 0.181 B 1.45 1.55 0.057 0.061 C 14.35 15.60 0.565 0.614 D 0.5 0.7 0.020 0.028 E 2.7 2.9 0.106 0.114 F 15.8 16.5 0.622 0.650
G 20.4 21.1 0.815 0.831
H 15.1 15.5 0.594 0.610 J 5.4 5.65 0.213 0.222 K 3.4 3.65 0.134 0.144 L 4.08 4.17 0.161 0.164 P 1.20 1.40 0.047 0.055 R 4.60 0.181
8/9
Page 9
PACKAGE MECHANICAL DATA
TO-220AB (Plastic)
BTA/BTB24, BTA25, BT A26 and T25 Series
DIMENSIONS
B
L
I
A
C
b2
F
REF.
A 15.20 15.90 0.598 0.625 a1 3.75 0.147 a2 13.00 14.00 0.511 0.551
B 10.00 10.40 0.393 0.409
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
b1 0.61 0.88 0.024 0.034
l4
b2 1.23 1.32 0.048 0.051
C 4.40 4.60 0.173 0.181
a1
l3
l2
a2
c2
c1 0.49 0.70 0. 019 0.027 c2 2.40 2.72 0. 094 0.107
e 2.40 2.70 0.094 0.106
F 6.20 6.60 0. 244 0.259
I 3.75 3.85 0. 147 0.151
I4 15.80 16 .40 16.80 0.622 0.646 0.661
b1
e
M
c1
L 2.65 2.95 0.104 0.116
l2 1.14 1.70 0. 044 0.066 l3 1.14 1.70 0. 044 0.066 M 2.60 0.102
Information furnished is believed to be ac curate and reli able. Howev er, STMicroel ectronic s assumes no res ponsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implic ation or otherwise under any patent or patent rights of STMi croelect ronics. Specifications mentioned in thi s publica tion are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authoriz ed for use as critical components in lif e support dev i ces or systems without express written approval of STMi croelectronics.
© The ST logo is a registered trade mark of STMicroelect ronics
© 2002 STMi croelectr oni cs - Printed i n It aly - All Right s Reserved
STMicroele ctronics GROUP OF COMPANIES
Australi a - Brazil - Canada - China - F i nl and - Franc e - Germany
Hong Kong - India - Isreal - Italy - J apan - Malays i a - Malta - Moro cco - Singap ore
Spain - Sweden - Switzerl and - United K i ngdom - Unit ed States.
http:// ww w.st.com
9/9
Loading...