Page 1
Philips Semiconductors Product specification
Three quadrant triacs BTA208S series B
high commutation
GENERAL DESCRIPTION QUICK REFERENCE DATA
Glass passivated high commutation SYMBOL PARAMETER MAX. MAX. MAX. UNIT
triacs in a plastic envelope, suitable
forsurfacemounting,intendedforuse BTA208S (or BTA208M)- 500B 600B 800B
in circuits where high static and V
DRM
dynamic dV/dt and high dI/dt can voltages
occur. These devices will commutate I
the full rated rms current at the I
T(RMS)
TSM
maximumratedjunction temperature, current
without the aid of a snubber.
PINNING - SOT428 PIN CONFIGURATION SYMBOL
Repetitive peak off-state 500 600 800 V
RMS on-state current 8 8 8 A
Non-repetitive peak on-state 65 65 65 A
BTA208M series B
PIN Standard Alternative
tab
NUMBER S M
1 MT1 gate
T1T2
2 MT2 MT2
3 gate MT1
tab MT2 MT2
2
1
3
G
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
-500 -600 -800
V
DRM
I
T(RMS)
Repetitive peak off-state - 500
voltages
RMS on-state current full sine wave; - 8 A
1
Tmb ≤ 102 ˚C
I
TSM
Non-repetitive peak full sine wave;
on-state current Tj = 25 ˚C prior to
surge
t = 20 ms - 65 A
I2tI
2
t for fusing t = 10 ms - 21 A2s
t = 16.7 ms - 71 A
dIT/dt Repetitive rate of rise of ITM = 12 A; IG = 0.2 A; 100 A/µs
on-state current after dIG/dt = 0.2 A/µs
triggering
I
V
P
P
T
T
GM
GM
GM
G(AV)
stg
j
Peak gate current - 2 A
Peak gate voltage - 5 V
Peak gate power - 5 W
Average gate power over any 20 ms - 0.5 W
period
Storage temperature -40 150 ˚C
Operating junction - 125 ˚C
temperature
600
1
800 V
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may
switch to the on-state. The rate of rise of current should not exceed 6 A/µs.
September 1997 1 Rev 1.200
Page 2
Philips Semiconductors Product specification
Three quadrant triacs BTA208S series B
high commutation
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R
th j-mb
R
th j-a
STATIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
GT
I
L
I
H
V
T
V
GT
I
D
Thermal resistance full cycle - - 2.0 K/W
junction to mounting base half cycle - - 2.4 K/W
Thermal resistance pcb (FR4) mounted; footprint as in Fig.14 - 75 - K/W
junction to ambient
Gate trigger current
2
VD = 12 V; IT = 0.1 A
T2+ G+ 2 18 50 mA
T2+ G- 2 21 50 mA
T2- G- 2 34 50 mA
Latching current VD = 12 V; IGT = 0.1 A
T2+ G+ - 31 60 mA
T2+ G- - 34 90 mA
T2- G- - 30 60 mA
Holding current VD = 12 V; IGT = 0.1 A - 31 60 mA
On-state voltage IT = 10 A - 1.3 1.65 V
Gate trigger voltage VD = 12 V; IT = 0.1 A - 0.7 1.5 V
VD = 400 V; IT = 0.1 A; Tj = 125 ˚C 0.25 0.4 - V
Off-state leakage current VD = V
; Tj = 125 ˚C - 0.1 0.5 mA
DRM(max)
BTA208M series B
DYNAMIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
dVD/dt Critical rate of rise of VDM = 67% V
off-state voltage exponential waveform; gate open circuit
dI
/dt Critical rate of change of VDM = 400 V; Tj = 125 ˚C; I
com
t
gt
commutating current without snubber; gate open circuit
Gate controlled turn-on ITM = 12 A; VD = V
time dIG/dt = 5 A/µs
; Tj = 125 ˚C; 1000 4000 - V/µs
DRM(max)
= 8 A; - 14 - A/ms
T(RMS)
; IG = 0.1 A; - 2 - µs
DRM(max)
2 Device does not trigger in the T2-, G+ quadrant.
September 1997 2 Rev 1.200
Page 3
Philips Semiconductors Product specification
Three quadrant triacs BTA208S series B
high commutation
BTA208M series B
Ptot / W
12
10
8
6
4
2
0
0246810
BT137
1
IT(RMS) / A
Fig.1. Maximum on-state dissipation, P
on-state current, I
ITSM / A
1000
dI /dt limit
T
100
10
10us 100us 1ms 10ms 100ms
, where α = conduction angle.
T(RMS)
BTA208
BTA208
I
T
T / s
Tmb(max) / C
= 180
120
90
60
30
, versus rms
tot
I
TSM
time
T
Tj initial = 25 C max
Fig.2. Maximum permissible non-repetitive peak
on-state current I
sinusoidal currents, tp ≤ 20ms.
, versus pulse width tp, for
TSM
101
105
109
113
117
121
125
IT(RMS) / A
10
8
6
4
2
0
-50 0 50 100 150
Fig.4. Maximum permissible rms current I
versus mounting base temperature Tmb.
IT(RMS) / A
25
20
15
10
5
0
0.01 0.1 1 10
BT137
Tmb / C
BT137
surge duration / s
102 C
T(RMS)
,
Fig.5. Maximum permissible repetitive rms on-state
current I
, versus surge duration, for sinusoidal
T(RMS)
currents, f = 50 Hz; Tmb ≤ 102˚C.
ITSM / A
70
60
50
40
30
20
10
0
1 10 100 1000
Number of half cycles at 50Hz
I
I
TSM
T
time
T
Tj initial = 25 C max
Fig.3. Maximum permissible non-repetitive peak
on-state current I
sinusoidal currents, f = 50 Hz.
, versus number of cycles, for
TSM
VGT(Tj)
VGT(25 C)
1.6
1.4
1.2
1
0.8
0.6
0.4
-50 0 50 100 150
BT136
Tj / C
Fig.6. Normalised gate trigger voltage
VGT(Tj)/ VGT(25˚C), versus junction temperature Tj.
September 1997 3 Rev 1.200
Page 4
Philips Semiconductors Product specification
Three quadrant triacs BTA208S series B
high commutation
BTA208M series B
IGT(Tj)
IGT(25 C)
3
2.5
2
1.5
1
0.5
0
-50 0 50 100 150
BTA212
T2+ G+
T2+ GT2- G-
Tj / C
Fig.7. Normalised gate trigger current
IGT(Tj)/ IGT(25˚C), versus junction temperature T
IL(Tj)
2.5
1.5
IL(25 C)
3
2
1
TRIAC
IT / A
25
Tj = 125 C
Tj = 25 C
20
Vo = 1.264 V
Rs = 0.0378 Ohms
15
10
5
0
0 0.5 1 1.5 2 2.5 3
BT137
typ
VT / V
max
Fig.10. Typical and maximum on-state characteristic.
.
j
Zth j-mb (K/W)
10
1
0.1
BT137
unidirectional
bidirectional
t
P
D
p
0.5
0
-50 0 50 100 150
Tj / C
Fig.8. Normalised latching current IL(Tj)/ IL(25˚C),
versus junction temperature T
IH(Tj)
IH(25C)
3
2.5
2
1.5
1
0.5
0
-50 0 50 100 150
TRIAC
Tj / C
.
j
Fig.9. Normalised holding current IH(Tj)/ IH(25˚C),
versus junction temperature T
.
j
t
0.01
10us 0.1ms 1ms 10ms 0.1s 1s 10s
tp / s
Fig.11. Transient thermal impedance Z
pulse width tp.
dIcom/dt (A/ms)
1000
100
10
1
20 40 60 80 100 120 140
BTA208
Tj / C
th j-mb
, versus
Fig.12. Typical, critical rate of change of commutating
current, dI
/dt versus junction temperature.
com
September 1997 4 Rev 1.200
Page 5
Philips Semiconductors Product specification
Three quadrant triacs BTA208S series B
high commutation
MECHANICAL DATA
BTA208M series B
Dimensions in mm
Net Mass: 1.1 g
2.285 (x2)
MOUNTING INSTRUCTIONS
Dimensions in mm
1
seating plane
6.73 max
tab
2
3
1.1
6.22 max
0.5 min
0.8 max
(x2)
2.38 max
0.93 max
10.4 max
0.3
0.5
Fig.13. SOT428 : centre pin connected to tab.
7.0
5.4
4 min
4.6
0.5
7.0
2.15
2.5
4.57
Fig.14. SOT428 : minimum pad sizes for surface mounting
1.5
.
Notes
1. Plastic meets UL94 V0 at 1/8".
September 1997 5 Rev 1.200
Page 6
Philips Semiconductors Product specification
Three quadrant triacs BTA208S series B
high commutation
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 1997
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
BTA208M series B
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
September 1997 6 Rev 1.200
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