Datasheet BTA204W-600F, BTA204W-600E, BTA204W-600D Datasheet (Philips)

Page 1
DATA SH EET
Product specification December 1998
DISCRETE SEMICONDUCTORS
BTA204W series D, E and F
Three quadrant triacs guaranteed commutation
Page 2
December 1998 2 Rev1.000
Three quadrant triacs guaranteed commutation
BTA204W series D, E and F
GENERAL DESCRIPTION QUICK REFERENCE DATA
Passivated guaranteed commutation SYMBOL PARAMETER MAX. MAX. MAX. UNIT triacsin a plasticenvelopesuitable for surface mounting, intended for use in BTA204W- 500D 600D - motor control circuits or with other BTA204W- 500E 600E 800E highly inductive loads. These devices BTA204W- 500F 600F 800F balance the requirements of V
DRM
Repetitive peak 500 600 800 V commutation performance and gate off-state voltages sensitivity. The "sensitive gate" E I
T(RMS)
RMS on-state current 1 1 1 A series and "logic level" D series are I
TSM
Non-repetitive peak on-state 10 10 10 A intendedfor interfacingwith lowpower current drivers, including micro controllers.
PINNING - SOT223 PIN CONFIGURATION SYMBOL
PIN DESCRIPTION
1 main terminal 1 2 main terminal 2 3 gate
tab main terminal 2
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
-500 -600 -800
V
DRM
Repetitive peak off-state - 500
1
600
1
800 V
voltages
I
T(RMS)
RMS on-state current full sine wave; - 1 A
T
sp
108 ˚C
I
TSM
Non-repetitive peak full sine wave; on-state current T
j
= 25 ˚C prior to surge t = 20 ms - 10 A t = 16.7 ms - 11 A
I
2
tI
2
t for fusing t = 10 ms - 0.5 A2s
dI
T
/dt Repetitive rate of rise of ITM = 1.5 A; 100 A/µs
on-state current after I
G
= 0.2 A;
triggering dI
G
/dt = 0.2 A/µs
I
GM
Peak gate current - 2 A
V
GM
Peak gate voltage - 5 V
P
GM
Peak gate power - 5 W
P
G(AV)
Average gate power over any 20 ms - 0.5 W
period
T
stg
Storage temperature -40 150 ˚C
T
j
Operating junction - 125 ˚C temperature
T1T2
G
4
1
23
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may
switch to the on-state. The rate of rise of current should not exceed 6 A/µs.
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December 1998 3 Rev1.000
Three quadrant triacs guaranteed commutation
BTA204W series D, E and F
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R
th j-sp
Thermal resistance full or half cycle - - 15 K/W junction to solder point
R
th j-a
Thermal resistance pcb mounted; minimum footprint - 156 - K/W junction to ambient pcb mounted; pad area as in fig:2 - 70 - K/W
STATIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
BTA204W- ...D ...E ...F
I
GT
Gate trigger current
2
VD = 12 V; IT = 0.1 A
T2+ G+ - - 5 10 25 mA T2+ G- - - 5 10 25 mA T2- G- - - 5 10 25 mA
I
L
Latching current VD = 12 V; IGT = 0.1 A
T2+ G+ - - 6 12 20 mA T2+ G- - - 9 18 30 mA T2- G- - - 6 12 20 mA
I
H
Holding current VD = 12 V; IGT = 0.1 A - - 6 12 20 mA
V
T
On-state voltage IT = 2 A - 1.2 1.5 V
V
GT
Gate trigger voltage VD = 12 V; IT = 0.1 A - 0.7 1.5 V
V
D
= 400 V; IT = 0.1 A; 0.25 0.4 - V
T
j
= 125 ˚C
I
D
Off-state leakage current VD = V
DRM(max)
; - 0.1 0.5 mA
T
j
= 125 ˚C
DYNAMIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
BTA204W- ...D ...E ...F
dV
D
/dt Critical rate of rise of VDM = 67% V
DRM(max)
;20 3050- -V/µs
off-state voltage T
j
= 125 ˚C; exponential waveform; gate open circuit
dI
com
/dt Critical rate of change of VDM = 400 V; Tj = 125 ˚C; 1.0 2.0 2.5 - - A/ms
commutating current I
T(RMS)
= 1 A;
dV
com
/dt = 20V/µs; gate
open circuit
dI
com
/dt Critical rate of change of VDM = 400 V; Tj = 125 ˚C; 5.0 - - - - A/ms
commutating current I
T(RMS)
= 1 A;
dV
com
/dt = 0.1V/µs; gate
open circuit
t
gt
Gate controlled turn-on ITM = 12 A; VD = V
DRM(max)
;- - - 2 - µs
time I
G
= 0.1 A; dIG/dt = 5 A/µs
2 Device does not trigger in the T2-, G+ quadrant.
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December 1998 4 Rev1.000
Three quadrant triacs guaranteed commutation
BTA204W series D, E and F
Fig.1. Maximum on-state dissipation, P
tot
, versus rms
on-state current, I
T(RMS)
, where α = conduction angle.
Fig.2. Maximum permissible non-repetitive peak
on-state current I
TSM
, versus pulse width tp, for
sinusoidal currents, t
p
≤ 20ms.
Fig.3. Maximum permissible non-repetitive peak
on-state current I
TSM
, versus number of cycles, for
sinusoidal currents, f = 50 Hz.
Fig.4. Maximum permissible rms current I
T(RMS)
,
versus solder point temperature T
sp
.
Fig.5. Maximum permissible repetitive rms on-state
current I
T(RMS)
, versus surge duration, for sinusoidal
currents, f = 50 Hz; T
sp
≤ 108˚C.
Fig.6. Normalised gate trigger voltage
V
GT(Tj
)/ VGT(25˚C), versus junction temperature Tj.
0 0.2 0.4 0.6 0.8 1 1.2
0
0.2
0.4
0.6
0.8
1
1.2
1.4
= 180
120 90
60 30
BT134W
IT(RMS) / A
Ptot / W
Tsp(max) / C
125
122
119
116
113
110
107
104
1
-50 0 50 100 150
0
0.2
0.4
0.6
0.8
1
1.2
BT134W
Tsp / C
IT(RMS) / A
108 C
1
10
100
1000
BT134W
T / s
ITSM / A
10us 100us 1ms 10ms 100ms
T
I
TSM
time
I
Tj initial = 25 C max
T
dI /dt limit
T
T2- G+ quadrant
0.01 0.1 1 10
0
0.5
1
1.5
2
BT134W
surge duration / s
IT(RMS) / A
1 10 100 1000
0
2
4
6
8
10
12
BT134W
Number of cycles at 50Hz
ITSM / A
T
I
TSM
time
I
Tj initial = 25 C max
T
-50 0 50 100 150
0.4
0.6
0.8
1
1.2
1.4
1.6
BT136
Tj / C
VGT(Tj)
VGT(25 C)
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December 1998 5 Rev1.000
Three quadrant triacs guaranteed commutation
BTA204W series D, E and F
Fig.7. Normalised gate trigger current
I
GT(Tj
)/ IGT(25˚C), versus junction temperature T
j
.
Fig.8. Normalised latching current IL(Tj)/ IL(25˚C),
versus junction temperature T
j
.
Fig.9. Normalised holding current IH(Tj)/ IH(25˚C),
versus junction temperature T
j
.
Fig.10. Typical and maximum on-state characteristic.
Fig.11. Transient thermal impedance Z
th j-sp
, versus
pulse width t
p
.
-50 0 50 100 150
0
0.5
1
1.5
2
2.5
3
BTA204
Tj / C
T2+ G+ T2+ G­T2- G-
IGT(Tj)
IGT(25 C)
0 0.5 1 1.5 2
0
0.5
1
1.5
2
BT134W
VT / V
IT / A
Tj = 125 C
typ
max
Tj = 25 C
Vo = 1.0 V Rs = 0.21 Ohms
-50 0 50 100 150
0
0.5
1
1.5
2
2.5
3
TRIAC
Tj / C
IL(Tj)
IL(25 C)
10us 0.1ms 1ms 10ms 0.1s 1s 10s
tp / s
0.01
0.1
1
10
Zth j-sp (K/W)
100
t
p
P
t
D
unidirectional
bidirectional
BT134W
-50 0 50 100 150
0
0.5
1
1.5
2
2.5
3
TRIAC
Tj / C
IH(Tj)
IH(25C)
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December 1998 6 Rev1.000
Three quadrant triacs guaranteed commutation
BTA204W series D, E and F
MOUNTING INSTRUCTIONS
Dimensions in mm.
Fig.12. soldering pattern for surface mounting SOT223.
MECHANICAL DATA
Dimensions in mm Net Mass: 0.11 g
Fig.13. SOT223 surface mounting package.
Notes
1. For further information, refer to Philips publication SC18 " SMD Footprint Design and Soldering Guidelines". Order code: 9397 750 00505.
2. Epoxy meets UL94 V0 at 1/8".
3.8
min
6.3
2.3
4.6
1.5
min
1.5 min
1.5
min (3x)
6.7
6.3
3.1
2.9
4
1
23
2.3
1.05
0.85
0.80
0.60
4.6
3.7
3.3
7.3
6.7
B
A
0.10
0.02
13
16
max
1.8
max
10 max
0.32
0.24
(4x)
B
M
0.1
AM0.2
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December 1998 7 Rev1.000
Three quadrant triacs guaranteed commutation
BTA204W series D, E and F
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 1998
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
Page 8
© Philips Electronics N.V. SCA All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document doesnot formpart of any quotation or contract, isbelieved tobe accurate and reliable and may bechanged without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
1999
68
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Printed in The Netherlands 135002/1160/03/pp8 Date of release: December 1998 Document order number: 9397 75006618
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