Page 1
A2
A1
A2
D²PAK
TO-220AB
TO-220AB Ins.
DPAK
IPAK
A2
A1
G
G
A1
A2
G
A2
A1
G
A2
A2
A2
A2
A1
G
A2
A1
G
BTA08, BTB08, T810
T835, T850
Datasheet
Snubberless™, logic level and standard 8 A Triacs
Features
• On-state rms current, I
• Repetitive peak off-state voltage, V
• Triggering gate current, IGT 5 to 50 mA
Description
Available either in through-hole and surface-mount packages, these devices are
suitable for general purpose AC switching. They can be used as an ON/OFF function
in applications such as static relays, heating regulation, induction motor starting
circuits or for phase control operation in light dimmers and motor speed controllers,
etc.
The Snubberless versions (BTA, BTB08_xxxxW and T8 series) are specially
recommended for use on inductive loads, thanks to their high commutation
performance.
Logic level versions are designed to interface directly with low power drivers such as
Microcontrollers.
By using an internal ceramic pad, the BTA series provide voltage insulated tab (rated
at 2500 V
) in compliance with UL standards (file ref.: E81734).
RMS
T(RMS)
8 A
DRM
/ V
RRM
600 V to 800 V
Product status link
BTA08
BTB08
T810
T835
T850
DS2114 - Rev 15 - August 2018
For further information contact your local STMicroelectronics sales office.
www.st.com
Page 2
1 Characteristics
Table 1. Absolute maximum ratings (Tj = 25 °C unless otherwise stated)
Symbol Parameter Value Unit
I
T(RMS)
P
RMS on-state current (full sine wave)
Non repetitive surge peak on-state current (full
I
TSM
cycle, Tj initial = 25 °C)
I2t I2t value for fusing
Critical rate of rise of on-state current IG = 2 x
dl/dt
IGT, tr ≤ 100 ns
I
Peak gate current
GM
Average gate power dissipation
G(AV)
T
Storage junction temperature range -40 to +150 °C
stg
T
Operating junction temperature range -40 to +125 °C
j
BTA08, BTB08, T810, T835, T850
Characteristics
IPAK, DPAK,TO-220AB, D²PAK
TO-220AB Ins.
f = 50 Hz t = 20 ms 80
f = 60 Hz
f = 120 Hz
tp = 20 µs Tj = 125 °C
Tc = 110 °C
Tc = 100 °C
tp = 16.7 ms
tp = 10 ms
Tj = 125 °C
Tj = 125 °C
84
36
50 A/µs
8 A
A
A2s
4 A
1 W
Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified) Snubberless and logic level (3
quadrants)
Symbol
(1)
IGT
Parameter Quadrant
VD = 12 V, RL = 30 Ω
V
GT
V
IH
dV/dt
GD
I
L
(2)
(2)
VD = V
DRM
IT = 100 mA
IG = 1.2 x I
VD = 67% V
, RL = 3.3 kΩ, Tj = 125 °C
GT
, gate open, Tj = 125 °C
DRM
(dV/dt)c = 0.1 V/µs, Tj = 125 °C
(2)
(dl/dt)c
(dV/dt)c = 10 V/µs, Tj = 125 °C
Without snubber, Tj = 125 °C
1. Minimum IGT is guaranteed at 5 % of IGT max.
2. For both polarities of A2 referenced to A1
I - II - III Max. 10 35 50 5 10 35 50 mA
I - II - III Max. 1.2 V
I - II - III Min. 0.2 V
I - II - III Max. 15 35 75 10 15 35 50 mA
I - III Max. 25 50 70 10 25 50 70
II Max. 30 60 110 15 30 60 80
Max. 40 400 1000 20 40 400 1000 V/µs
Min. 5.4 3.5 5.4
Min. 2.8 1.5 2.98
Min. 4.5 7 4.5 7
T8 BTA08/BTB08
10 35 50 TW SW CW BW
Unit
mA
A/ms
DS2114 - Rev 15
page 2/21
Page 3
BTA08, BTB08, T810, T835, T850
Table 3. Standard (4 quadrants)
Characteristics
Symbol Parameter Quadrant
BTA08/BTB08
C B
(dV/dt)c
IGT
V
GT
V
GD
IH
I
dV/dt
(1)
VD = 12 V, RL = 33 Ω
I - II - III
IV 50 100
Max.
All Max. 1.3 V
VD = V
(2)
L
IT = 500 mA
IG = 1.2 I
(2)
VD = 67 % V
(2)
(dI/dt)c = 3.5 A/ms, Tj = 125 °C
, RL = 33 kΩ, Tj = 125 °C
DRM
GT
gate open, Tj = 125 °C
DRM
All Min. 0.2 V
I - II - III Max. 25 50 mA
I - III - IV
II 80 100
Max.
Min. 200 400 V/µs
Min. 5 10 V/µs
25 50
40 50
1. Minimum IGT is guaranteed at 5 % of IGT max.
2. For both polarities of A2 referenced to A1
Table 4. Static electrical characteristics
Symbol Test conditions Value Unit
(1)
VTM
(1)
VTO
(1)
RD
I
DRM IRRM
1. For both polarities of A2 referenced to A1
ITM = 11 A, tp = 380 µs Tj = 25 °C
threshold on-state voltage
Dynamic resistance
Tj = 125 °C
Tj = 125 °C
Tj = 25 °C
V
= V
DRM
RRM
Tj = 125 °C
Max. 1.55 V
Max. 0.85 V
Max. 50 mΩ
Max. 5 µA
Max. 1 mA
Unit
mA
mA
Symbol
R
Max. junction to case thermal resistance (AC)
th(j-c)
Junction to ambient (typ.)
R
th(j-a)
Junction to ambient (typ.)
1. S = Copper surface under tab.
Table 5. Thermal resistance
Parameter Value Unit
IPAK / D2PAK / DPAK / TO-220AB 1.6
TO-220AB Insulated 2.5
S = 2 cm²
S = 1 cm²
(1)
(1)
D²PAK 45
DPAK 70
TO-220AB / TO-220AB Insulated 60
IPAK 100
°C/W
°C/W
DS2114 - Rev 15
page 3/21
Page 4
1.1 Characteristics (curves)
0 1 2 3 4 5 6 7 8
0
1
2
3
4
5
6
7
8
9
10
P(W)
I
T(RMS)
(A)
0 25 50 75 100 125
0
1
2
3
4
5
6
7
8
9
10
I
T(RMS)
(A)
T
c
(°C)
BTB/T8
BTA
0 2 5 50 75 100 125
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
I
T(RMS)
(A)
T
c
(°C)
Printed circuit board FR4, copper thickness: 35 µm
D²PAK
(S = 1 cm²)
DPAK
(S = 0.5 cm²)
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
1E-3
1E-2
1E-1
1E+0
K = [Zth/Rth]
t
p
(s)
Z
th(j-c)
DPAK/IPAK
Z
th(j-a)
TO-220AB/D²PAK
Z
th(j-a)
BTA08, BTB08, T810, T835, T850
Characteristics (curves)
Figure 1. Maximum power dissipation versus on-state
RMS current (full cycle)
Figure 3. RMS on-state current versus ambient
temperature (full cycle)
Figure 2. RMS on-state current versus temperature (full
cycle)
Figure 4. Relative variation of thermal impedance versus
pulse duration
DS2114 - Rev 15
page 4/21
Page 5
0.5 1.0 1.5 2 .0 2.5 3.0 3.5 4 .0 4.5 5.0
1
10
100
ITM(A)
VTM(V)
Tj max.
Vto = 0.85 V
Rd = 50 mΩ
Tj = Tj max.
Tj = 25 °C
0
10
20
30
40
50
60
70
80
90
1 10 100 1000
Number of cycles
I
TSM
(A)
Non repetitive
Tjinitial = 25 °C
Repetitive
TC = 110 °C
One cycle
t = 16.66 ms
0.01 0.10 1.00 10.00
10
100
1000
t (ms)
p
T initial=25°C
j
I
TSM
dI/dt limitation:
50A/µs
360°
α
I
TSM
(A)
-40 -20 0 2 0 4 0 60 80 100 120 140
0.0
0.5
1.0
1.5
2.0
2.5
IGT,IH,IL[Tj] / IGT,IH,IL[Tj = 25 °C]
Tj (°C)
IH and I
L
I
GT
Holding current and latching current versus junction temperature (typical values)
0.1 1.0 10.0 100.0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
(dl/dt)c [(dV/dt)c / specified (dl/dt)c
(dV/dt)c (V/µs)
T810/SW
TW
T835/T850/CW/SW/BW
Snubberless and logic level types
0.1 1.0 10.0 100.0
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
(dl/dt)c [(dV/dt)c] / specified (dl/dt)c
(dV/dt)c (V/µs)
C
Standard types
B
BTA08, BTB08, T810, T835, T850
Characteristics (curves)
Figure 5. On-state characteristics (maximum values)
Figure 7. Non repetitive surge peak on-state current for a
sinusoidal pulse (tp < 10 ms)
Figure 6. Surge peak on-state current versus number of
cycles
Figure 8. Relative variation of gate trigger current
Figure 9. Relative variation of critical rate of decrease of
main current versus (dV/dt)c (typical values)
DS2114 - Rev 15
Figure 10. Relative variation of critical rate of decrease of
main current versus (dV/dt)c (typical values)
page 5/21
Page 6
0 25 50 75 100 125
0
1
2
3
4
5
6
(dl/dt)c [Tj] / [T
j specified
]
Tj(°C)
0 4 8 1 2 16 20 24 28 32 3 6 40
0
10
20
30
40
50
60
70
80
90
100
R
th(j-a)
(°C/W)
S(cm²)
Printed circuit board FR4, copper thickness: 35 µm
DPAK
D²PAK
BTA08, BTB08, T810, T835, T850
Characteristics (curves)
Figure 11. Relative variation of critical rate of decrease of
main current versus junction temperature
Figure 12. DPAK and D2PAK thermal resistance junction
to ambient versus copper surface under tab
DS2114 - Rev 15
page 6/21
Page 7
2 Package information
BTA08, BTB08, T810, T835, T850
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.
®
DS2114 - Rev 15
page 7/21
Page 8
2.1 DPAK package information
A
E
b4
2L
D
4L
e
e1
b
c
A1
H
c2
L
V2
A2
E1
D1
• Epoxy meets UL94, V0
• Lead-free package
• Recommended torque: 0.4 to 0.6 N·m
BTA08, BTB08, T810, T835, T850
DPAK package information
Figure 13. DPAK package outline
DS2114 - Rev 15
page 8/21
Page 9
6.7
6.7
3.03.0
1.6
4.572
A
B
The device must be positioned within
0.05 A B
12.7
BTA08, BTB08, T810, T835, T850
DPAK package information
Table 6. DPAK package mechanical data
Dimensions
Ref.
Millimeters
Min. Typ. Max. Min. Typ. Max.
A 2.18 2.40 0.0858 0.0945
A1 0.90 1.10 0.0354 0.0433
A2 0.03 0.23 0.0012 0.0091
b 0.64 0.90 0.0252 0.354
b4 4.95 5.46 0.1949 0.2150
c 0.46 0.61 0.0181 0.0240
c2 0.46 0.60 0.0181 0.0236
D 5.97 6.22 0.2350 0.2449
D1 5.10 0.2008
E 6.35 6.73 0.2500 0.2650
E1 4.32 0.1701
e 2.29 0.0900
e1 4.57 0.1800
H 9.35 10.40 0.3681 0.4094
L 1.00 1.78 0.0394 0.0701
L2 1.27 0.0500
L4 0.60 1.02 0.0236 0.0402
V2 0° +8° 0° +8°
1. Dimensions in inches are given for reference only
Inches
(1)
Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are
guaranteed.
Figure 14. DPAK recommended footprint (dimensions are in mm)
DS2114 - Rev 15
page 9/21
Page 10
2.2 IPAK package information
D
V1
A
c2
H
L
b2
A1
e1
e
b
c
L2
L1
E
b4
B5
BTA08, BTB08, T810, T835, T850
IPAK package information
Figure 15. IPAK package outline
Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are
guaranteed.
page 10/21
DS2114 - Rev 15
Page 11
BTA08, BTB08, T810, T835, T850
IPAK package information
Table 7. IPAK package mechanical data
Dimensions
Ref.
Millimeters
Min. Typ. Max. Min. Typ. Max.
A 2.20 2.40 0.0866 0.0945
A1 0.90 1.10 0.0354 0.0433
b 0.64 0.90 0.0252 0.0354
b2 0.95 0.0374
b4 5.20 5.43 0.2047 0.2138
B5 0.30 0.0118
c 0.45 0.60 0.0177 0.0236
c2 0.46 0.60 0.0181 0.0236
D 6.00 6.20 0.2362 0.2441
E 6.40 6.65 0.2520 0.2618
e 2.28 0.0898
e1 4.40 4.60 0.1732 0.1811
H 16.10 0.6339
L 9.00 9.60 0.3545 0.3780
L1 0.80 1.20 0.0315 0.0472
L2 0.80 1.25 0.0315 0.0492
V1 10° 10°
1. Inch dimensions are for reference only.
Inches
(1)
DS2114 - Rev 15
page 11/21
Page 12
2.3 TO-220AB insulated package information
C
b2
c2
F
L
A
a1
a2
B
e
b1
I4
l3
l2
c1
M
Resin gate 0.5 mm
max. protusion
(1)
Resin gate 0.5 mm
max. protusion
(1)
(1)Resin gate position accepted in one of the two positions or in the symmetrical opposites.
I
Figure 16. TO-220AB insulated package outline
BTA08, BTB08, T810, T835, T850
TO-220AB insulated package information
DS2114 - Rev 15
page 12/21
Page 13
BTA08, BTB08, T810, T835, T850
TO-220AB insulated package information
Table 8. TO-220AB insulated package mechanical data
Dimensions
Ref.
Min. Typ. Max. Min. Typ. Max.
A 15.20 15.90 0.5984 0.6260
a1 3.75 0.1476
a2 13.00 14.00 0.5118 0.5512
B 10.00 10.40 0.3937 0.4094
b1 0.61 0.88 0.0240 0.0346
b2 1.23 1.32 0.0484 0.0520
C 4.40 4.60 0.1732 0.1811
c1 0.49 0.70 0.0193 0.0276
c2 2.40 2.72 0.0945 0.1071
e 2.40 2.70 0.0945 0.1063
F 6.20 6.60 0.2441 0.2598
I 3.73 3.88 0.1469 0.1528
L 2.65 2.95 0.1043 0.1161
I2 1.14 1.70 0.0449 0.0669
I3 1.14 1.70 0.0449 0.0669
I4 15.80 16.40 16.80 0.6220 0.6457 0.6614
M 2.6 0.1024
1. Inch dimensions are for reference only.
Millimeters Inches
DS2114 - Rev 15
page 13/21
Page 14
2.4 D²PAK package information
(1) Resin gate position accepted in one of the two positions or in the symmetrical opposites
e
G
E1
E2
c2
A
D2
D1
b
b2
H
E
L2
L3
D
V2
c
A1
A2
A3
L
R
Gauge Plane
Resin gate
0.5 mm max.
protrusion(1)
BTA08, BTB08, T810, T835, T850
D²PAK package information
Figure 17. D²PAK package outline
DS2114 - Rev 15
page 14/21
Page 15
BTA08, BTB08, T810, T835, T850
D²PAK package information
Table 9. D²PAK package mechanical data
Dimensions
Ref.
Min. Typ. Max. Min. Typ. Max.
A 4.30 4.60 0.1693 0.1811
A1 2.49 2.69 0.0980 0.1059
A2 0.03 0.23 0.0012 0.0091
A3 0.25 0.0098
b 0.70 0.93 0.0276 0.0366
b2 1.25 1.7 0.0492 0.0669
c 0.45 0.60 0.0177 0.0236
c2 1.21 1.36 0.0476 0.0535
D 8.95 9.35 0.3524 0.3681
D1 7.50 8.00 0.2953 0.3150
D2 1.30 1.70 0.0512 0.0669
e 2.54 0.1
E 10.00 10.28 0.3937 0.4047
E1 8.30 8.70 0.3268 0.3425
E2 6.85 7.25 0.2697 0.2854
G 4.88 5.28 0.1921 0.2079
H 15 15.85 0.5906 0.6240
L 1.78 2.28 0.0701 0.0898
L2 1.27 1.40 0.0500 0.0551
L3 1.40 1.75 0.0551 0.0689
R 0.40 0.0157
V2 0° 8° 0° 8°
1. Dimensions in inches are given for reference only
Millimeters Inches
DS2114 - Rev 15
page 15/21
Page 16
16.90
10.30
3.70
5.08
1.30
8.90
BTA08, BTB08, T810, T835, T850
D²PAK package information
Figure 18. D²PAK recommended footprint (dimensions are in mm)
DS2114 - Rev 15
page 16/21
Page 17
3 Ordering information
BT A 08 - 600 BW (RG)
Triac
Insulation
A = Insulated
B = Non-insulated
Current
Voltage
Sensit ivity and type
Packing mode
RG = Tube
08 = 8A
600 = 600 V
800 = 800 V
B = 50 mA
C = 25 mA standard
SW = 10 mA logic level
BW = 50 mA Snubberless™
CW = 35 mA Snubberless™
TW = 5 mA logic level
T 8 10 - 600 B (-TR)
Triac series
Package
B = DPAK
H = IPAK
G = D²PAK
Current
Voltage
Sensitivit y
Packing mode
Blank = Tube
TR = Tape and reel
08 = 8A
600 = 600 V
800 = 800 V
10 = 10 mA
35 = 35 mA
50 = 50 mA
Figure 19. Ordering information scheme (BTA08 and BTB08 series)
BTA08, BTB08, T810, T835, T850
Ordering information
DS2114 - Rev 15
Figure 20. Ordering information scheme (T8 series)
page 17/21
Page 18
BTA08, BTB08, T810, T835, T850
Table 10. Product selector
Ordering information
Part Number
T810-xxxB X X 10 mA Logic Level DPAK
T835-xxxH X 35 mA Snubberless™ IPAK
T810-xxxG X 10 mA Logic Level
T835-xxxG X X 35 mA Snubberless™
T850-xxxG X X 50 mA Snubberless™
BTA08-xxxS X 10 mA Logic Level TO-220AB Ins.
BTA08-xxxC X X 35 mA Standard TO-220AB Ins.
BTA08-xxxB X 50 mA Standard TO-220AB Ins.
BTA08-xxxTW X 5 mA Logic Level TO-220AB Ins.
BTA08-xxxSW X 10 mA Logic Level TO-220AB Ins.
BTA08-xxxCW X 35 mA Snubberless™ TO-220AB Ins.
BTA08-xxxBW X X 50 mA Snubberless™ TO-220AB Ins.
BTB08-xxxS X 10 mA Logic Level TO-220AB
BTB08-xxxC X 35 mA Standard TO-220AB
BTB08-xxxB X 50 mA Standard TO-220AB
BTB08-xxxTW X X 5 mA Logic Level TO-220AB
BTB08-xxxSW X 10 mA Logic Level TO-220AB
BTB08-xxxCW X X 35 mA Snubberless™ TO-220AB
BTB08-xxxBW X 50 mA Snubberless™ TO-220AB
Voltage (xxx)
Sensitivity Type Package
600 800
D2PAK
D2PAK
D2PAK
DS2114 - Rev 15
page 18/21
Page 19
BTA08, BTB08, T810, T835, T850
Ordering information
Table 11. Ordering information
Order code Marking Package Weight Base qty. Delivery mode
T810-600B T8 1060
75 TubeT835-600B T8 3560
T835-800B T8 3580
T810-600B-TR T8 1060
T810-800B-TR T8 1080
T835-600B-TR T8 3560
T835-800B-TR T8 3580
T835-600H T8 3560 IPAK 0.40 75 Tube
T835-600G T835-600G
T835-8G T835-8G
T850-6G T850-6G
T850-8G T850-8G
T810-600G-TR T810-600G
T835-600G-TR T835-600G
T835-8G-TR T835-8G
T850-6G-TR T850-6G
T850-8G-TR T850-8G
BTA08-600SRG BTA08-600S
BTA08-600BRG BTA08-600B
BTA08-600CRG BTA08-600C
BTA08-800CRG BTA08-800C
BTA08-600BWRG BTA08-600BW
BTA08-600CWRG BTA08-600CW
BTA08-600SWRG BTA08-600SW
BTA08-600TWRG BTA08-600TW
BTA08-800BWRG BTA08-800BW
BTB08-600BRG BTB08-600B
BTB08-600CRG BTB08-600C
BTB08-600SRG BTB08-600S
BTB08-600BWRG BTB08-600BW
BTB08-600CWRG BTB08-600CW
BTB08-600SWRG BTB08-600SW
BTB08-600TWRG BTB08-600TW
BTB08-800CWRG BTB08-800CW
BTB08-800TWRG BTB08-800TW
DPAK 0.30
D2PAK
TO-220AB Ins.
TO-220AB
2500 Tape&Reel 13"
50 Tube
1.50
1000 Tape&Reel 13"
2.30 50 Tube
DS2114 - Rev 15
page 19/21
Page 20
BTA08, BTB08, T810, T835, T850
Table 12. Document revision history
Date Revision Changes
Apr-2002 5A Last update.
13-Feb-2006 6
10-Mar-2010 7 Updated ECOPACK statement and Figure 26
02-Jun-2014 8
07-Nov-2016 9 Updated Table 1 and reformatted to current standard.
06-Jan-2017 10
09-Feb-2017 11 Added T850 package information.
24-Apr-2017 12
14-Mar-2018 13
14-May-2018 14 Updated product status links.
09-Aug-2018 15 Updated Table 3. Standard (4 quadrants).
TO-220AB delivery mode changed from bulk to tube. ECOPACK statement
added.
Updated DPAK and IPAK package information and reformatted to current
standard.
Updated Figure 20: "Ordering information scheme (T8 series)", Table 10:
"Product selector" and Table 11: "Ordering information".
Updated Figure 6..
Minor text changes to improve readability.
Updated Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise
specified) Snubberless and logic level (3 quadrants), cover image, Figure
9. Relative variation of critical rate of decrease of main current versus (dV/dt)c
(typical values) and Figure 20. Ordering information scheme (T8 series).
DS2114 - Rev 15
page 20/21
Page 21
BTA08, BTB08, T810, T835, T850
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DS2114 - Rev 15
page 21/21
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