Datasheet BT150S-800R, BT150S-600R, BT150S-500R, BT150M-800R, BT150M-600R Datasheet (Philips)

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Page 1
Philips Semiconductors Product specification
Thyristors BT150S series logic level
GENERAL DESCRIPTION QUICK REFERENCE DATA
Glass passivated, sensitive gate SYMBOL PARAMETER MAX. MAX. MAX. UNIT thyristors in a plastic envelope, suitable for surface mounting, BT150S (or BT150M)- 500R 600R 800R intended for use in general purpose V switching and phase control V applications. These devices are I intended to be interfaced directly to I microcontrollers, logic integrated I circuits and other low power gate current trigger circuits.
PINNING - SOT428 PIN CONFIGURATION SYMBOL
, Repetitive peak off-state 500 600 800 V
DRM
RRM
T(AV) T(RMS) TSM
voltages Average on-state current 2.5 2.5 2.5 A RMS on-state current 4 4 4 A Non-repetitive peak on-state 35 35 35 A
BT150M series
PIN Standard Alternative
tab
NUMBER S M
1 cathode gate
ak
2 anode anode 3 gate cathode
tab anode anode
2
1
3
g
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DRM
I
T(AV)
I
T(RMS)
I
TSM
, V
Repetitive peak off-state - 5001600
RRM
voltages Average on-state current half sine wave; Tmb 111 ˚C - 2.5 A
RMS on-state current all conduction angles - 4 A Non-repetitive peak half sine wave; Tj = 25 ˚C prior to on-state current surge
t = 10 ms - 35 A
-500R -600R -800R
I2tI
2
t for fusing t = 10 ms - 6.1 A2s
t = 8.3 ms - 38 A
dIT/dt Repetitive rate of rise of ITM = 10 A; IG = 50 mA; - 50 A/µs
on-state current after dIG/dt = 50 mA/µs
triggering I V V P P T T
GM
GM RGM GM G(AV) stg j
Peak gate current - 2 A
Peak gate voltage - 5 V
Peak reverse gate voltage - 5 V
Peak gate power - 5 W
Average gate power over any 20 ms period - 0.5 W
Storage temperature -40 150 ˚C
Operating junction - 125
temperature
1
2
800 V
˚C
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the thyristor may switch to the on-state. The rate of rise of current should not exceed 15 A/µs.
2 Note: Operation above 110˚C may require the use of a gate to cathode resistor of 1k or less.
October 1997 1 Rev 1.100
Page 2
Philips Semiconductors Product specification
Thyristors BT150S series logic level
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R
th j-mb
R
th j-a
STATIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
GT
I
L
I
H
V
T
V
GT
ID, I
R
Thermal resistance - - 3.0 K/W
junction to mounting base
Thermal resistance pcb (FR4) mounted; footprint as in Fig.14 - 75 - K/W
junction to ambient
Gate trigger current VD = 12 V; IT = 0.1 A - 15 200 µA
Latching current VD = 12 V; IGT = 0.1 A - 0.17 10 mA
Holding current VD = 12 V; IGT = 0.1 A - 0.10 6 mA
On-state voltage IT = 5 A - 1.23 1.8 V
Gate trigger voltage VD = 12 V; IT = 0.1 A - 0.4 1.5 V
VD = V
Off-state leakage current VD = V
; IT = 0.1 A; Tj = 110 ˚C 0.1 0.2 - V
DRM(max) DRM(max)
; VR = V
; Tj = 125 ˚C - 0.1 0.5 mA
RRM(max)
BT150M series
DYNAMIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
dVD/dt Critical rate of rise of VDM = 67% V
off-state voltage exponential waveform; RGK = 100 t
gt
t
q
Gate controlled turn-on ITM = 10 A; VD = V
time dIG/dt = 0.2 A/µs
Circuit commutated VD = 67% V
turn-off time VR = 10 V; dITM/dt = 10 A/µs;
dVD/dt = 2 V/µs; RGK = 1 k
DRM(max)
; Tj = 125 ˚C; - 50 - V/µs
DRM(max)
; IG = 5 mA; - 2 - µs
DRM(max)
; Tj = 125 ˚C; ITM = 8 A; - 100 - µs
October 1997 2 Rev 1.100
Page 3
Philips Semiconductors Product specification
Thyristors BT150S series logic level
BT150M series
1.9
T(AV)
/ I
T(AV)
Tmb(max) / C
a = 1.57
, versus
tot
, where
.
Ptot / W
6
conduction
form
angle
factor
degrees
5
4
3
2
1
0
0 0.5 1 1.5 2 2.5 3
a
30
4
60
2.8
90
2.2
120
1.9
180
1.57
4
BT148
2.2
2.8
IF(AV) / A
Fig.1. Maximum on-state dissipation, P
average on-state current, I
1000
100
a = form factor = I
ITSM / A
dI /dt limit
T
T(RMS)
BT148
107
110
113
116
119
122
125
ITSM / A
40
I
TSM
I
T
30
20
10
0
1
10 100
Number of half cycles at 50Hz
time
T
Tj initial = 25 C max
1000
Fig.4. Maximum permissible non-repetitive peak on-state current I
sinusoidal currents, f = 50 Hz.
IT(RMS) / A
12
10
8
6
, versus number of cycles, for
TSM
BT150
I
I
10
10us 100us 1ms
TSM
T
time
T
Tj initial = 25 C max
T / s
10ms
Fig.2. Maximum permissible non-repetitive peak
on-state current I
, versus pulse width tp, for
TSM
sinusoidal currents, tp ≤ 10ms.
IT(RMS) / A
5
4
3
2
2
1
0
0
-50 0 50 100
Fig.3. Maximum permissible rms current I
versus mounting base temperature Tmb.
BT148Z
Tmb / C
111 C
T(RMS)
,
4
2
0
0.01 0.1 1 10 surge duration / s
Fig.5. Maximum permissible repetitive rms on-state
current I
, versus surge duration, for sinusoidal
T(RMS)
currents, f = 50 Hz; Tmb ≤ 111˚C.
VGT(Tj)
VGT(25 C)
1.6
1.4
1.2
1
0.8
0.6
0.4
-50 0 50 100 150
BT151
Tj / C
Fig.6. Normalised gate trigger voltage
VGT(Tj)/ VGT(25˚C), versus junction temperature Tj.
October 1997 3 Rev 1.100
Page 4
Philips Semiconductors Product specification
Thyristors BT150S series logic level
BT150M series
IGT(Tj)
IGT(25 C)
3
2.5
2
1.5
1
0.5
0
-50 0 50 100 150
BT148
Tj / C
Fig.7. Normalised gate trigger current
IGT(Tj)/ IGT(25˚C), versus junction temperature T
IL(Tj)
2.5
1.5
IL(25 C)
3
2
1
BT145
IT / A
12
Tj = 125 C
Tj = 25 C
10
Vo = 1.26 V
Rs = 0.099 ohms
8
6
4
2
0
0 0.5 1 1.5 2 2.5 3
BT148
VT / V
typ
max
Fig.10. Typical and maximum on-state characteristic.
.
j
Zth j-mb (K/W)
10
1
0.1
BT148
t
P
p
D
0.5
0
-50 0 50 100 150 Tj / C
Fig.8. Normalised latching current IL(Tj)/ IL(25˚C),
versus junction temperature T
IH(Tj)
IH(25 C)
3
2.5
2
1.5
1
0.5
0
-50 0 50 100 150
BT145
Tj / C
.
j
Fig.9. Normalised holding current IH(Tj)/ IH(25˚C),
versus junction temperature T
.
j
t
0.01 10us 0.1ms 1ms 10ms 0.1s 1s 10s
tp / s
Fig.11. Transient thermal impedance Z
pulse width tp.
dVD/dt (V/us)
1000
100
10
1
0 50 100 150
Tj / C
RGK = 100 ohms
th j-mb
, versus
Fig.12. Typical, critical rate of rise of off-state voltage,
dVD/dt versus junction temperature Tj.
October 1997 4 Rev 1.100
Page 5
Philips Semiconductors Product specification
Thyristors BT150S series logic level
MECHANICAL DATA
BT150M series
Dimensions in mm Net Mass: 1.1 g
2.285 (x2)
MOUNTING INSTRUCTIONS
Dimensions in mm
1
seating plane
6.73 max
tab
2
3
1.1
6.22 max
0.5 min
0.8 max (x2)
2.38 max
0.93 max
10.4 max
0.3
0.5
Fig.13. SOT428 : centre pin connected to tab.
7.0
5.4
4 min
4.6
0.5
7.0
2.15
2.5
4.57
Fig.14. SOT428 : minimum pad sizes for surface mounting
1.5
.
Notes
1. Plastic meets UL94 V0 at 1/8".
October 1997 5 Rev 1.100
Page 6
Philips Semiconductors Product specification
Thyristors BT150S series logic level
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 1997
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.
BT150M series
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
October 1997 6 Rev 1.100
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