Glass passivated, sensitive gateSYMBOLPARAMETERMAX. MAX. MAX. UNIT
thyristors in a plastic envelope,
intended for use in general purposeBT150-500R600R800R
switchingandphasecontrolV
applications.These devicesareV
intended to be interfaced directly toI
microcontrollers,logicintegratedI
circuits and other low power gateI
trigger circuits.current
PINNING - TO220ABPIN CONFIGURATIONSYMBOL
,Repetitive peak off-state500600800V
DRM
RRM
T(AV)
T(RMS)
TSM
voltages
Average on-state current2.52.52.5A
RMS on-state current444A
Non-repetitive peak on-state353535A
PINDESCRIPTION
1cathode
tab
ak
2anode
3gate
tabanode
123
g
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
-500R -600R -800R
V
DRM
I
T(AV)
I
T(RMS)
I
TSM
, V
Repetitive peak off-state-5001600
RRM
voltages
Average on-state currenthalf sine wave; Tmb ≤ 113 ˚C-2.5A
RMS on-state currentall conduction angles-4A
Non-repetitive peakhalf sine wave; Tj = 25 ˚C prior to
on-state currentsurge
Peak gate current-2A
Peak gate voltage-5V
Peak reverse gate voltage-5V
Peak gate power-5W
Average gate powerover any 20 ms period-0.5W
Storage temperature-40150˚C
Operating junction-125
temperature
1
2
800V
˚C
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the thyristor may
switch to the on-state. The rate of rise of current should not exceed 15 A/µs.
2 Note: Operation above 110˚C may require the use of a gate to cathode resistor of 1kΩ or less.
October 19971Rev 1.300
Page 2
Philips SemiconductorsProduct specification
ThyristorsBT150 series
logic level
THERMAL RESISTANCES
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
R
th j-mb
R
th j-a
STATIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
I
GT
I
L
I
H
V
T
V
GT
ID, I
R
Thermal resistance--2.5K/W
junction to mounting base
Thermal resistancein free air-60-K/W
junction to ambient
Fig.4. Maximum permissible non-repetitive peak
on-state current I
sinusoidal currents, f = 50 Hz.
IT(RMS) / A
12
10
8
6
, versus number of cycles, for
TSM
BT150
I
I
10
10us100us1ms
TSM
T
time
T
Tj initial = 25 C max
T / s
10ms
Fig.2. Maximum permissible non-repetitive peak
on-state current I
, versus pulse width tp, for
TSM
sinusoidal currents, tp ≤ 10ms.
IT(RMS) / A
5
4
3
2
1
0
-50050100150
Fig.3. Maximum permissible rms current I
versus mounting base temperature Tmb.
BT148
Tmb / C
113 C
T(RMS)
,
4
2
0
0.010.1110
surge duration / s
Fig.5. Maximum permissible repetitive rms on-state
current I
, versus surge duration, for sinusoidal
T(RMS)
currents, f = 50 Hz; Tmb ≤ 113˚C.
VGT(Tj)
VGT(25 C)
1.6
1.4
1.2
1
0.8
0.6
0.4
-50050100150
BT151
Tj / C
Fig.6. Normalised gate trigger voltage
VGT(Tj)/ VGT(25˚C), versus junction temperature Tj.
October 19973Rev 1.300
Page 4
Philips SemiconductorsProduct specification
ThyristorsBT150 series
logic level
IGT(Tj)
IGT(25 C)
3
2.5
2
1.5
1
0.5
0
-50050100150
BT148
Tj / C
Fig.7. Normalised gate trigger current
IGT(Tj)/ IGT(25˚C), versus junction temperature T
IL(Tj)
2.5
1.5
IL(25 C)
3
2
1
BT145
IT / A
12
Tj = 125 C
Tj = 25 C
10
Vo = 1.26 V
Rs = 0.099 ohms
8
6
4
2
0
00.511.522.53
BT148
VT / V
typ
max
Fig.10. Typical and maximum on-state characteristic.
.
j
Zth j-mb (K/W)
10
1
0.1
BT148
t
P
p
D
0.5
0
-50050100150
Tj / C
Fig.8. Normalised latching current IL(Tj)/ IL(25˚C),
versus junction temperature T
IH(Tj)
IH(25 C)
3
2.5
2
1.5
1
0.5
0
-50050100150
BT145
Tj / C
.
j
Fig.9. Normalised holding current IH(Tj)/ IH(25˚C),
versus junction temperature T
.
j
t
0.01
10us0.1ms1ms10ms0.1s1s10s
tp / s
Fig.11. Transient thermal impedance Z
pulse width tp.
dVD/dt (V/us)
1000
100
10
1
050100150
Tj / C
RGK = 100 ohms
th j-mb
, versus
Fig.12. Typical, critical rate of rise of off-state voltage,
dVD/dt versus junction temperature Tj.
October 19974Rev 1.300
Page 5
Philips SemiconductorsProduct specification
ThyristorsBT150 series
logic level
MECHANICAL DATA
Dimensions in mm
Net Mass: 2 g
10,3
max
1,3
3,7
4,5
max
3,0 max
not tinned
1,3
max
(2x)
123
2,54 2,54
2,8
3,0
13,5
min
0,9 max (3x)
5,9
min
15,8
max
0,6
2,4
Fig.13. TO220AB; pin 2 connected to mounting base.
Notes
1. Refer to mounting instructions for TO220 envelopes.
2. Epoxy meets UL94 V0 at 1/8".
October 19975Rev 1.300
Page 6
Philips SemiconductorsProduct specification
ThyristorsBT150 series
logic level
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 1997
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
October 19976Rev 1.300
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