Page 1
BSS 84 P
SIPMOS Small-Signal-Transistor
Feature
·
P-Channel
·
Enhancement mode
·
Logic Level
·
Avalanche rated
·
dv /dt rated
Type
BSS84P - E6327
BSS84P - L6327
Package
PG-SOT-23
PG-SOT-23
Maximum Ratings , at
T
= 25 °C, unless otherwise specified
Ordering Code
Q67041-S1417
SP000082879
Marking
YBs
YBs
Product Summary
V
R
I
DS
PG-SOT-23
-60 V
8
-0.17 A
3
1
Gate
pin1
Source
pin 2
W
2
VPS05161
Drain
pin 3
Parameter
Continuous drain current
TA=25°C
=70°C
T
A
Pulsed drain current
TA=25°C
Avalanche energy, single pulse
ID=-0.17 A , VDD=-25V, RGS=25
W
Avalanche energy, periodic limited by T
Reverse diode dv /dt
IS=-0.17A, V DS=-48V, d i/dt =-200A/µs, T
jmax
=150°C
Gate source voltage V
Power dissipation
TA=25°C
Operating and storage temperature
Symbol
I
D
Value Unit
A
-0.17
-0.14
I
D puls
E
AS
E
AR
-0.68
2.6 mJ
0.036
dv /dt -6 kV/µs
V
°C
P
T
GS
tot
,
±20
0.36 W
T
-55... +150
IEC climatic category; DIN IEC 68-1 55/150/56
Rev 2.3 Page 1
2005-07-21
Page 2
Thermal Characteristics
BSS 84 P
Parameter
Symbol Values Unit
min. typ. max.
Characteristics
Thermal resistance, junction - soldering point
R
thJS
- - 200 K/W
(Pin 3)
SMD version, device on PCB:
@ min. footprint
@ 6 cm
2
cooling area
1)
R
thJA
-
-
-
-
350
300
Electrical Characteristics, at T A = 25 °C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
Static Characteristics
Drain-source breakdown voltage
VGS=0, ID=-250µA
V
(BR)DSS
-60 - - V
Gate threshold voltage, V GS = V
=-20µA
I
D
Zero gate voltage drain current
VDS=-60V, VGS=0, TA=25°C
V
=-60V, V GS=0, T A=125°C
DS
Gate-source leakage current
VGS=-20V, VDS=0
Drain-source on-state resistance
VGS=-4.5V, ID=-0.14A
Drain-source on-state resistance
VGS=-10V, ID=-0.17A
DS
V
GS(th)
I
DSS
I
GSS
R
DS(on)
R
DS(on)
-1 -1.5 -2
-
-
-0.1
-10
-1
-100
- -10 -100 nA
- 8 12
- 5.8 8
µA
W
1
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
Rev 2.3 Page 2
2005-07-21
Page 3
Inv. diode direct current, pulsed
Electrical Characteristics, at T A = 25 °C, unless otherwise specified
BSS 84 P
Parameter
Symbol Conditions Values Unit
Dynamic Characteristics
Transconductance g
Input capacitance C
Output capacitance C
Reverse transfer capacitance C
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
Gate Charge Characteristics
Gate to source charge Q
Gate to drain charge Q
Gate charge total Q
fs
iss
oss
rss
d(on)
r
d(off)
f
gs
gd
g
min. typ. max.
V
£
2*I D*R
DS
I
=-0.14A
D
VGS=0, VDS=-25V,
f=1MHz
DS(on)max
,
0.065 0.13 - S
- 15 19 pF
- 6 8
- 2 3
VDD=-30V, VGS=-4.5V,
I
=-0.14A, R G=25
D
W
- 6.7 10 ns
- 16.2 24.3
- 8.6 12.9
- 20.5 30.8
VDD=-48V, ID=-0.17A - 0.25 0.37 nC
- 0.3 0.45
VDD=-48V, ID=-0.17A,
V
=0 to -10V
GS
- 1 1.5
Gate plateau voltage V
Reverse Diode
Inverse diode continuous
I
forward current
I
Inverse diode forward voltage V
Reverse recovery time t
Reverse recovery charge Q
S
SM
rr
rr
VDD=-48V, ID=-0.17A - -3.42 - V
TA=25°C - - -0.17 A
- - -0.68
VGS=0, IF=-0.17A - -0.93 -1.24 V
VR=-30V, I
di
/dt =100A/µs
F
F=l S
,
- 23 34 ns
- 10 15 nC
Rev 2.3 Page 3
2005-07-21
Page 4
BSS 84 P
1 Power dissipation
P
= f (T A)
tot
BSS 84 P
0.38
W
0.32
0.28
tot
0.24
P
0.2
0.16
0.12
0.08
0.04
0
0 20 40 60 80 100 120
°C
2 Drain current
I
= f (T A)
D
parameter: V
BSS 84 P
-0.18
A
-0.14
-0.12
D
I
-0.1
-0.08
-0.06
-0.04
-0.02
160
T
A
0
0 20 40 60 80 100 120
GS
³
10 V
°C
160
T
A
3 Safe operating area
= f ( VDS )
I
D
parameter : D = 0 , T A = 25 °C
1
BSS 84 P
-10
A
0
-10
o
(
n
-10
I
D
/
S
D
V
=
)
0
D
I
-1
-10
-10
-10
-2
-3
-10
-1
S
D
R
-10
4 Transient thermal impedance
= f (tp)
Z
thJA
parameter : D = t p/T
3
BSS 84 P
10
K/W
2
thJA
Z
10
10
10
10
1
0
-1
10
single pulse
-5
10
D = 0.50
0.20
0.10
0.05
0.02
0.01
-4
-3
-2
10
10
-1
10
10 0 10 1 10
2
t
4
10
s
p
t
= 170.0µs
p
1 ms
10 ms
DC
1
V
V
DS
-10
2
Rev 2.3 Page 4
2005-07-21
Page 5
BSS 84 P
5 Typ. output characteristic
I
= f (V DS)
D
parameter: T j = 25 °C
BSS 84 P
-0.4
P
= 0.36W
tot
A
-0.32
-0.28
D
I
-0.24
-0.2
-0.16
-0.12
-0.08
-0.04
0
0 -0.5 -1 -1.5 -2 -2.5 -3 -3.5 -4
l
j
k
h
i
VGS [V]
g
f
e
d
c
b
a
a -2.5
b -3.0
c -3.5
d -4.0
e -4.5
f -5.0
g -5.5
h -6.0
i -6.5
j -7.0
k -8.0
l -10.0
V
V
DS
6 Typ. drain-source on resistance
R
DS(on)
= f (I D)
parameter: V GS; T j = 25 °C
BSS 84 P
26
a
GS
-2.5
a
[V] =
b
-3.0
b
c
-3.5
W
22
20
18
DS(on)
16
R
14
12
10
8
6
4
V
2
-5
0
0 -0.04-0.08-0.12-0.16 -0.2 -0.24-0.28-0.32A-0.38
d
-4.0
e
-4.5
c
d
e
f
g
h
i
j
k
l
f
g
h
i
j
k
-5.0
-5.5
-6.0
-6.5
-7.0
l
-8.0
-10.0
I
D
7 Typ. transfer characteristics
= f ( V GS ); |V
I
D
DS
³
2 x |I
|
D
x R
|
DS(on)max
parameter: T j = 25 °C
0.4
A
0.3
D
0.25
- I
0.2
0.15
0.1
0.05
0
0 1 2 3 4
8 Typ. forward transconductance
= f( ID)
g
fs
parameter: T j = 25 °C
0.16
S
0.12
fs
0.1
g
0.08
0.06
0.04
0.02
V
- V
6
GS
0
0 0.04 0.08 0.12 0.16
A
0.22
-I
D
Rev 2.3 Page 5
2005-07-21
Page 6
BSS 84 P
9 Drain-source on-state resistance
R
DS(on)
= f (T j)
parameter : I D = -0.17 A, V GS = -10 V
BSS 84 P
21
W
18
16
14
DS(on)
R
12
10
8
6
4
2
0
-60 -20 20 60 100
98%
typ
°C
10 Typ. gate threshold voltage
V
parameter: V GS = V
180
T
A
= f (T j)
GS(th)
DS
2.4
V
2
1.8
GS(th)
- V
1.6
1.4
1.2
1
0.8
0.6
0.4
-60 -20 20 60 100
2%
typ.
98%
°C
160
T
A
11 Typ. capacitances
C = f (V
DS
)
parameter: V GS=0, f =1 MHz
2
10
pF
Ciss
C
1
10
0
10
0 5 10
Coss
Crss
12 Forward character. of reverse diode
= f (VSD)
I
F
parameter: T j , tp = 80 µs
0
BSS 84 P
-10
A
-1
-10
F
I
-2
-10
Tj = 25 °C typ
Tj = 150 °C typ
Tj = 25 °C (98%)
Tj = 150 °C (98%)
-3
V
- V
20
DS
-10
0 -0.4 -0.8 -1.2 -1.6 -2 -2.4
-3
V
V
SD
Rev 2.3 Page 6
2005-07-21
Page 7
BSS 84 P
13 Typ. avalanche energy
E
= f (T A), parameter:
AS
ID = -0.17 A , VDD = -25 V, RGS = 25
3
mJ
2
AS
E
1.5
1
0.5
0
25 45 65 85 105 125
°C
14 Typ. gate charge
V
= f (Q
GS
W
165
T
A
parameter: I D = -0.17 A pulsed; T j = 25 °C
BSS 84 P
-16
V
-12
GS
-10
V
-8
-6
-4
-2
0
0 0.2 0.4 0.6 0.8 1 1.2
Gate
)
V
0,2
DS max
0,8
V
DS max
nC
Q
1.5
Gate
15 Drain-source breakdown voltage
V
(BR)DSS
(BR)DSS
V
= f (T A)
BSS 84 P
-72
V
-68
-66
-64
-62
-60
-58
-56
-54
-60 -20 20 60 100
°C
180
T
A
Rev 2.3 Page 7
2005-07-21
Page 8
Published by
Infineon Technologies AG,
Bereichs Kommunikation
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,
regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).
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Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
or system Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.
BSS 84 P
Rev 2.3 Page 8
2005-07-21