Typical applications are DC−DC converters, power management in
portable and battery−powered products such as computers, printers,
PCMCIA cards, cellular and cordless telephones.
Features
• Low Threshold Voltage (V
: 0.5 V−1.5 V) Makes it Ideal for
GS(th)
Low Voltage Applications
• Miniature SOT−23 Surface Mount Package Saves Board Space
• BVSS Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS (T
Rating
Drain−to−Source VoltageV
Gate−to−Source Voltage − ContinuousV
Drain Current
− Continuous @ T
− Pulsed Drain Current (t
Total Power Dissipation @ TA = 25°CP
Operating and Storage Temperature
Range
Thermal Resistance,
Junction−to−Ambient
Maximum Lead Temperature for
Soldering Purposes, for 10 seconds
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
= 25°C unless otherwise noted)
A
SymbolValueUnit
DSS
GS
= 25°C
A
≤ 10 ms)
p
I
I
DM
TJ, T
R
T
D
q
D
− 55 to 150°C
stg
JA
L
50Vdc
± 20Vdc
mA
200
800
225mW
556°C/W
260°C
http://onsemi.com
200 mA, 50 V
N−Channel
3
(Pb−Free)
(Pb−Free)
(Pb−Free)
= 3.5 W
3
2
MARKING
DIAGRAM
J1 M G
G
1
†
3000 / Tape & Reel
3000 / Tape & Reel
10,000 / Tape & Reel
R
DS(on)
1
1
2
SOT−23
CASE 318
STYLE 21
J1= Device Code
M= Date Code*
G= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
DevicePackageShipping
BSS138LT1GSOT−23
BVSS138LT1GSOT−23
BSS138LT3GSOT−23
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
0.037
SCALE 10:1
2.0
0.079
ǒ
inches
mm
Ǔ
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867Toll Free USA/Canada
Email: orderlit@onsemi.com
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
http://onsemi.com
5
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
BSS138LT1/D
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