Datasheet BSN20W Datasheet (Philips)

Page 1
DISCRETE SEMICONDUCTORS
DATA SH EET
BSN20W
N-channel enhancement mode vertical D-MOS transistor
Product specification File under Discrete Semiconductors, SC13b
1997 Jun 20
Page 2
Philips Semiconductors Product specification
N-channel enhancement mode vertical D-MOS transistor
FEATURES
Direct interface to C-MOS, TTL, etc.
High-speed switching
No secondary breakdown.
APPLICATIONS
Thin and thick film circuits
General purpose fast switching applications.
DESCRIPTION
N-channel enhancement mode vertical D-MOS transistor in a 3 pin plastic SOT323 SMD package.
CAUTION
The device is supplied in an antistatic package. The gate-source input must be protected against static discharge during transport or handling.
PINNING - SOT323
PIN SYMBOL DESCRIPTION
1 g gate 2 s source 3 d drain
handbook, halfpage
12
Top view
Marking code: M8t.
3
g
MAM356
Fig.1 Simplified outline and symbol.
BSN20W
d
s
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS MAX. UNIT
V V I
D
R P
DS GSth
DSon tot
drain-source voltage (DC) 50 V gate-source threshold voltage 1.8 V drain current (DC) 80 mA drain-source on-state resistance 15 total power dissipation T
25 °C; note 1 200 mW
amb
Note
1. Device mounted on a printed-circuit board.
Page 3
Philips Semiconductors Product specification
N-channel enhancement mode
BSN20W
vertical D-MOS transistor
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DS
V
GSO
I
D
I
DM
P
tot
T
stg
T
j
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-a
Note to the Limiting values and Thermal characteristics
1. Device mounted on a printed-circuit board.
drain-source voltage (DC) 50 V gate-source voltage (DC) open drain −±20 V drain current (DC) 80 mA peak drain current 300 mA total power dissipation T
25 °C; note 1 200 mW
amb
storage temperature 65 +150 °C operating junction temperature 65 +150 °C
thermal resistance from junction to ambient note 1 625 K/W
CHARACTERISTICS
=25°C unless otherwise specified.
T
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)DSS
V
GSth
I
DSS
I
GSS
R
DSon
C
iss
C
oss
C
rss
drain-source breakdown voltage VGS= 0; ID=10µA50−−V gate-source threshold voltage VGS=VDS; ID= 1 mA 0.4 1.8 V drain-source leakage current VGS= 0; VDS=40V −−1µA gate-source leakage current VGS= ±20 V; VDS=0 −−±100 nA drain-source on-state resistance VGS= 10 V; ID=80mA 815
=5V; ID=80mA 14 20
V
GS
V
= 2.5 V; ID=10mA 18 30
GS
input capacitance VGS= 0; VDS= 10 V; f = 1 MHz 815pF output capacitance VGS= 0; VDS= 10 V; f = 1 MHz 715pF reverse transfer capacitance VGS= 0; VDS= 10 V; f = 1 MHz 25pF
Switching times
t
on
turn-on time VGS= 0 to 10 V; VDD=20V;
25ns
ID=80mA
t
off
turn-off time VGS=10to0V; VDD=20V;
510ns
ID=80mA
Page 4
Philips Semiconductors Product specification
N-channel enhancement mode vertical D-MOS transistor
150
T
MDA183
amb
300
handbook, halfpage
P
tot
(mW)
200
100
0
050
Device mounted on a printed-circuit board.
100
Fig.2 Power derating curve.
BSN20W
30
handbook, halfpage
C
(pF)
20
10
0
200
o
(
C)
0 5 10 15 20 25
VGS= 0; Tj=25°C; f = 1 MHz. (1) C
.
iss
(2) C
.
oss
(3) C
.
rss
Fig.3 Capacitance as a function of drain-source
voltage; typical values.
MRA781
(1) (2)
(3)
VDS (V)
handbook, halfpage
500
I
D
(mA)
400
300
200
100
0
04812
Tj=25°C.
GS
MRA782
= 10 VV
7 V
5 V
4 V
3 V
2.5 V
VDS (V)
Fig.4 Output characteristics; typical values.
handbook, halfpage
500
I
D
(mA)
400
300
200
100
0
0246810
VDS= 10 V; Tj=25°C.
Fig.5 Transfer characteristics; typical values.
MRA783
VGS (V)
Page 5
Philips Semiconductors Product specification
N-channel enhancement mode vertical D-MOS transistor
24
handbook, halfpage
R
DSon
()
16
8
0
1
Tj=25°C. (1) VGS= 2.5 V. (2) VGS=5V. (3) VGS=10V.
(1)
(2)
(3)
2
10
10
ID (mA)
MDA163
BSN20W
80
handbook, halfpage
R
DSon
()
60
40
20
3
10
0
02 10
VDS= 0.1 V; Tj=25°C.
4
68
MDA162
VGS (V)
Fig.6 Drain-source on-state resistance as a
function of drain current; typical values.
1.2
handbook, halfpage
k
1.1
1
0.9
0.8
0.7
=
k
-------------------------------------­V
Typical V
V
GSth
GSth
at 25°C
GSth
at T
j
at 1 mA.
0 50 100 150−50
Tj (
MRA785
o
C)
Fig.7 Drain-source on-state resistance as a function
of gate-source voltage; typical values.
handbook, halfpage
2
k
1.6
1.2
0.8
0.4
R
DSon
k
=
----------------------------------------­R
DSon
Typical R (1) ID= 10 mA; VGS= 2.5 V. (2) ID= 100 mA; VGS=10V.
DSon
0 50 100 150−50
at T
j
at 25 °C
at 100 mA / 10 V.
MRA784
(2)
(1)
Tj (oC)
Fig.8 Temperature coefficient of gate-source
threshold voltage.
Fig.9 Temperature coefficient of drain-source
on-state resistance.
Page 6
Philips Semiconductors Product specification
N-channel enhancement mode
BSN20W
vertical D-MOS transistor
PACKAGE OUTLINE
Plastic surface mounted package; 3 leads SOT323
D
y
3
E
H
E
AB
X
v M
A
12
e
DIMENSIONS (mm are the original dimensions)
A
UNIT
mm
A
1.1
0.8
max
0.1
1
b
p
0.4
0.3
b
1
p
e
cD
0.25
2.2
0.10
1.8
A
A
1
B
w M
0 1 2 mm
scale
e
H
E
1.35
1.15
1.3
e
1
0.65
E
2.2
2.0
L
p
0.45
0.15
L
p
detail X
Qwv
0.23
0.13
0.20.2
Q
c
OUTLINE VERSION
SOT323 SC-70
IEC JEDEC EIAJ
REFERENCES
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
Page 7
Philips Semiconductors Product specification
N-channel enhancement mode
BSN20W
vertical D-MOS transistor
DEFINITIONS
Data Sheet Status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
Page 8
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Printed in The Netherlands 137107/00/01/pp8 Date of release: 1997 Jun 20 Document order number: 9397 750 02266
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