Datasheet BSA 223SP Datasheet (INFINEON)

Page 1
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Preliminary data
OptiMOS-P Small-Signal-Transistor
Feature
P-Channel
Enhancement mode
Super Logic Level (2.5 V rated)
150°C operating temperature
Avalanche rated
dv/dt rated
Type Package Ordering Code
BSA 223SP SC-75 Q67042-S4176
Marking
BPs
BSA 223SP
Product Summary
V
R
DS(on)
I
D
SC-75
-20 V
1.2
-0.39 A
Gate pin1
Source pin 2
Drain pin 3
Maximum Ratings, at Tj = 25 °C, unless otherwise specified Parameter Symbol Value Unit
Continuous drain current
TA=25°C TA=70°C
Pulsed drain current
TA=25°C
Avalanche energy, single pulse
ID=-0.39 A , VDD=-10V, RGS=25
Reverse diode dv/dt
IS=-0.39A, VDS=-16V, di/dt=200A/µs, T
jmax
=150°C
I
I
E
dv/dt
Gate source voltage V Power dissipation
TA=25°C
P
Operating and storage temperature T
D
D puls
AS
GS tot
, T
j
stg
-0.39
-0.31
-1.56
1.4 mJ
-6 kV/µs
±12
0.25 W
-55... +150
A
V
°C
IEC climatic category; DIN IEC 68-1 55/150/56
2002-08-26Page 1
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Preliminary data
BSA 223SP
Thermal Characteristics Parameter Symbol Values Unit
min. typ. max.
Characteristics
Thermal resistance, junction - soldering point R Thermal resistance, junction - ambient, leaded R
thJS thJA
- - 150 K/W
- - 500
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Symbol Values Unit
min. typ. max.
Static Characteristics
Drain-source breakdown voltage
VGS=0, ID=-250µA
Gate threshold voltage, VGS = V
ID=-1.5µA
Zero gate voltage drain current
VDS=-20V, VGS=0, Tj=25°C VDS=-20V, VGS=0, Tj=150°C
Gate-source leakage current
DS
V
(BR)DSS
V
GS(th)
I
DSS
I
GSS
-20 - - V
-0.6 -0.9 -1.2
-
-
-0.1
-10
-1
-100
- -10 -100 nA
µA
VGS=-12V, VDS=0
Drain-source on-state resistance
VGS=-2.5V, ID=-0.29A
Drain-source on-state resistance
VGS=-4.5, ID=-0.39A
R
DS(on)
R
DS(on)
- 1.27 2.1
- 0.7 1.2
2002-08-26Page 2
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Preliminary data
BSA 223SP
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Symbol Conditions Values Unit
min. typ. max.
Dynamic Characteristics
Transconductance g
Input capacitance C Output capacitance C
Reverse transfer capacitance C Turn-on delay time t Rise time t Turn-off delay time t Fall time t
Gate Charge Characteristics
Gate to source charge Q Gate to drain charge Q Gate charge total Q
fs
iss oss
rss
d(on) r d(off) f
gs gd
g
VDS≥2*ID*R ID=-0.31A
VGS=0, VDS=-15V, f=1MHz
DS(on)max
,
0.35 0.7 - S
- 45 56 pF
- 21 26
- 17 22
VDD=-10V, VGS=-4.5V, ID=-0.39A, RG=6
- 3.8 5.7 ns
- 5 7.5
- 5.1 7.6
- 3.2 4.8
VDD=-10V, ID=-0.39A - -0.04 -0.05 nC
- -0.4 -0.5
VDD=-10V, ID=-0.39A, VGS=0 to -4.5V
- -0.5 -0.62
Gate plateau voltage V
Reverse Diode
Inverse diode continuous
I
forward current Inv. diode direct current, pulsed I
Inverse diode forward voltage V Reverse recovery time t Reverse recovery charge Q
(plateau)
S
SM
SD
rr
rr
VDD=-10V, ID=-0.39A - -2.2 -2.7 V
TA=25°C - - -0.39 A
- - -1.56
VGS=0, IF=-0.39 - -1 -1.33 V VR=-10V, |IF| = |lD|,
diF/dt=100A/µs
- 7.6 9.5 ns
- 1.1 1.4 nC
2002-08-26Page 3
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Preliminary data
BSA 223SP
1 Power dissipation
P
= f (TA)
tot
BSA 223SP
0.55
W
0.45
0.4
tot
0.35
P
0.3
0.25
0.2
0.15
0.1
0.05
0
0 20 40 60 80 100 120
°C
2 Drain current
ID = f (TA) parameter: | VGS| 4.5 V
BSA 223SP
-0.42
A
-0.36
-0.32
-0.28
D
I
-0.24
-0.2
-0.16
-0.12
-0.08
-0.04
160
T
A
0
0 20 40 60 80 100 120 °C 160
T
A
3 Safe operating area
ID = f ( VDS )
parameter : D = 0 , TA = 25 °C
1
BSA 223SP
-10
A
I
D
DS(on)
V
=
-10
/
DS
0
0
-10
D
I
R
-1
-10
-2
-10
-10
-1
DC
-10
t
= 180.0µs
p
1 ms
10 ms
1
V
4 Transient thermal impedance
Z
= f (tp)
thJA
parameter : D = tp/T
BSA 223SP
3
10
K/W
2
10
1
10
thJA
Z
0
10
D = 0.50
0.20
-1
10
-2
10
2
-10
V
DS
10
-3
10
single pulse
-7
10
-6
-5
-4
10
10
10
-3
10
0.10
0.05
0.02
0.01
-2
t
0
s
10
p
2002-08-26Page 4
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Preliminary data
BSA 223SP
5 Typ. output characteristic
ID = f (VDS)
parameter: Tj =25°C
0.7
3V 4V
A
4.5V 6V 7V 8V
0.5
10V
D
-I
0.4
0.3
0.2
0.1
0
0 0.3 0.6 0.9
6 Typ. drain-source on resistance
R
DS(on)
= f (ID)
parameter: VGS, Tj = 25 °C
4
2.2V
2.5V 3V
2.5V
2.2V
V
-V
1.5
DS
3
4V
DS(on)
R
4.5V
2.5
6V 7V 8V
2
10V
1.5
1
0.5
0
0 0.1 0.2 0.3 0.4 0.5
A
0.7
-I
D
7 Typ. transfer characteristics
ID= f ( VGS ); | VDS| 2 x |ID| x R
DS(on)max
parameter: Tj = 25 °C
0.7
A
0.5
D
-I
0.4
0.3
0.2
0.1
0
0 0.5 1 1.5 2
8 Typ. forward transconductance
gfs = f(ID)
parameter: Tj = 25 °C
1.1
S
0.9
0.8
0.7
fs
g
0.6
0.5
0.4
0.3
0.2
0.1
V
-V
3
GS
0
0 0.1 0.2 0.3 0.4 0.5
A
0.7
-I
D
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Preliminary data
BSA 223SP
9 Drain-source on-resistance
R
DS(on)
= f(Tj)
parameter: ID = -0.39 A, VGS = -4.5 V
1.6
1.2
DS(on)
1
R
0.8
0.6
0.4
0.2
0
-60 -20 20 60 100
98%
typ.
°C
10 Typ. gate threshold voltage
V
parameter: VGS = V
160
T
j
= f (Tj)
GS(th)
DS
1.6
V
1.2
GS(th)
1
- V
0.8
0.6
0.4
0.2
0
-60 -20 20 60 100
2%
typ.
98%
°C
T
160
j
11 Typ. capacitances
C = f (VDS) parameter: VGS=0, f=1 MHz, Tj = 25 °C
2
10
C
C
pF
C
C
1
10
0 2 4 6 8 10 12
iss
oss
V
-V
rss
DS
15
12 Forward character. of reverse diode
IF = f (VSD)
parameter: Tj = 25 °C
1
BSA 223SP
-10
A
0
-10
F
I
-1
-10
Tj = 25 °C typ Tj = 150 °C typ Tj = 25 °C (98%) Tj = 150 °C (98%)
-2
-10 0 -0.4 -0.8 -1.2 -1.6 -2 -2.4
V
V
SD
-3
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Preliminary data
BSA 223SP
13 Typ. avalanche energy
EAS = f (Tj), par.: ID = -0.39 A VDD = -10 V, RGS = 25
1.4
mJ
1
AS
E
0.8
0.6
0.4
0.2
0
20 40 60 80 100 120
°C
14 Typ. gate charge
V
GS
= f (Q
Gate
)
parameter: ID = -0.39 A pulsed, Tj = 25 °C
BSA 223SP
-16
V
-12
GS
-10
V
-8
20% 50%
-6
80%
-4
-2
160
T
j
0
0 0.2 0.4 0.6 0.8 1
nC
|Q
1.3
Gate
|
15 Drain-source breakdown voltage
V
(BR)DSS
(BR)DSS
V
= f (Tj)
BSA 223SP
-24.5
V
-23.5
-23
-22.5
-22
-21.5
-21
-20.5
-20
-19.5
-19
-18.5
-18
-60 -20 20 60 100
°C
180
T
j
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Preliminary data
Published by Infineon Technologies AG , Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 München © Infineon Technologies AG 1999 All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
BSA 223SP
2002-08-26Page 8
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