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Preliminary data
OptiMOS-P Small-Signal-Transistor
Feature
• P-Channel
• Enhancement mode
• Super Logic Level (2.5 V rated)
• 150°C operating temperature
• Avalanche rated
• d v/d t rated
Type Package Ordering Code
BSA 223SP SC-75 Q67042-S4176
Marking
BPs
BSA 223SP
Product Summary
V
DS
R
DS(on)
I
D
SC-75
-20 V
1.2 Ω
-0.39 A
Gate
pin1
Source
pin 2
Drain
pin 3
Maximum Ratings, at T j = 25 °C, unless otherwise specified
Parameter Symbol Value Unit
Continuous drain current
TA=25°C
TA=70°C
Pulsed drain current
TA=25°C
Avalanche energy, single pulse
ID=-0.39 A , VDD=-10V, RGS=25Ω
Reverse diode d v/d t
IS=-0.39A, VDS=-16V, di/dt=200A/µs, T
jmax
=150°C
I
I
E
dv /dt
Gate source voltage V
Power dissipation
TA=25°C
P
Operating and storage temperature T
D
D puls
AS
GS
tot
, T
j
stg
-0.39
-0.31
-1.56
1.4 mJ
-6 kV/µs
±12
0.25 W
-55... +150
A
V
°C
IEC climatic category; DIN IEC 68-1 55/150/56
2002-08-26Page 1
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Preliminary data
BSA 223SP
Thermal Characteristics
Parameter Symbol Values Unit
min. typ. max.
Characteristics
Thermal resistance, junction - soldering point R
Thermal resistance, junction - ambient, leaded R
thJS
thJA
- - 150 K/W
- - 500
Electrical Characteristics, at T j = 25 °C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
Static Characteristics
Drain-source breakdown voltage
VGS=0, ID=-250µA
Gate threshold voltage, VGS = V
ID=-1.5µA
Zero gate voltage drain current
VDS=-20V, VGS=0, Tj=25°C
VDS=-20V, VGS=0, Tj=150°C
Gate-source leakage current
DS
V
(BR)DSS
V
GS(th)
I
DSS
I
GSS
-20 - - V
-0.6 -0.9 -1.2
-
-
-0.1
-10
-1
-100
- -10 -100 nA
µA
VGS=-12V, VDS=0
Drain-source on-state resistance
VGS=-2.5V, ID=-0.29A
Drain-source on-state resistance
VGS=-4.5, ID=-0.39A
R
DS(on)
R
DS(on)
- 1.27 2.1
- 0.7 1.2
Ω
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Preliminary data
BSA 223SP
Electrical Characteristics, at T j = 25 °C, unless otherwise specified
Parameter Symbol Conditions Values Unit
min. typ. max.
Dynamic Characteristics
Transconductance g
Input capacitance C
Output capacitance C
Reverse transfer capacitance C
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
Gate Charge Characteristics
Gate to source charge Q
Gate to drain charge Q
Gate charge total Q
fs
iss
oss
rss
d(on)
r
d(off)
f
gs
gd
g
VDS≥ 2* ID *R
ID=-0.31A
VGS=0, VDS=-15V,
f=1MHz
DS(on)max
,
0.35 0.7 - S
- 45 56 pF
- 21 26
- 17 22
VDD=-10V, VGS=-4.5V,
ID=-0.39A, RG=6Ω
- 3.8 5.7 ns
- 5 7.5
- 5.1 7.6
- 3.2 4.8
VDD=-10V, ID=-0.39A - -0.04 -0.05 nC
- -0.4 -0.5
VDD=-10V, ID=-0.39A,
VGS=0 to -4.5V
- -0.5 -0.62
Gate plateau voltage V
Reverse Diode
Inverse diode continuous
I
forward current
Inv. diode direct current, pulsed I
Inverse diode forward voltage V
Reverse recovery time t
Reverse recovery charge Q
(plateau)
S
SM
SD
rr
rr
VDD=-10V, ID=-0.39A - -2.2 -2.7 V
TA=25°C - - -0.39 A
- - -1.56
VGS=0, IF=-0.39 - -1 -1.33 V
VR=-10V, |IF| = |lD|,
di F/dt=100A/µs
- 7.6 9.5 ns
- 1.1 1.4 nC
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Preliminary data
BSA 223SP
1 Power dissipation
P
= f (T A)
tot
BSA 223SP
0.55
W
0.45
0.4
tot
0.35
P
0.3
0.25
0.2
0.15
0.1
0.05
0
0 20 40 60 80 100 120
°C
2 Drain current
ID = f (T A)
parameter: | V GS| ≥ 4.5 V
BSA 223SP
-0.42
A
-0.36
-0.32
-0.28
D
I
-0.24
-0.2
-0.16
-0.12
-0.08
-0.04
160
T
A
0
0 20 40 60 80 100 120 °C 160
T
A
3 Safe operating area
ID = f ( VDS )
parameter : D = 0 , T A = 25 °C
1
BSA 223SP
-10
A
I
D
DS(on)
V
=
-10
/
DS
0
0
-10
D
I
R
-1
-10
-2
-10
-10
-1
DC
-10
t
= 180.0µs
p
1 ms
10 ms
1
V
4 Transient thermal impedance
Z
= f (t p)
thJA
parameter : D = t p/T
BSA 223SP
3
10
K/W
2
10
1
10
thJA
Z
0
10
D = 0.50
0.20
-1
10
-2
10
2
-10
V
DS
10
-3
10
single pulse
-7
10
-6
-5
-4
10
10
10
-3
10
0.10
0.05
0.02
0.01
-2
t
0
s
10
p
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Preliminary data
BSA 223SP
5 Typ. output characteristic
ID = f (VDS)
parameter: T j =25°C
0.7
3V
4V
A
4.5V
6V
7V
8V
0.5
10V
D
-I
0.4
0.3
0.2
0.1
0
0 0.3 0.6 0.9
6 Typ. drain-source on resistance
R
DS(on)
= f (I D)
parameter: V GS, T j = 25 °C
4
Ω
2.2V
2.5V
3V
2.5V
2.2V
V
-V
1.5
DS
3
4V
DS(on)
R
4.5V
2.5
6V
7V
8V
2
10V
1.5
1
0.5
0
0 0.1 0.2 0.3 0.4 0.5
A
0.7
-I
D
7 Typ. transfer characteristics
ID= f ( VGS ); | VDS| ≥ 2 x |ID| x R
DS(on)max
parameter: T j = 25 °C
0.7
A
0.5
D
-I
0.4
0.3
0.2
0.1
0
0 0.5 1 1.5 2
8 Typ. forward transconductance
gfs = f(ID)
parameter: T j = 25 °C
1.1
S
0.9
0.8
0.7
fs
g
0.6
0.5
0.4
0.3
0.2
0.1
V
-V
3
GS
0
0 0.1 0.2 0.3 0.4 0.5
A
0.7
-I
D
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Preliminary data
BSA 223SP
9 Drain-source on-resistance
R
DS(on)
= f(T j)
parameter: I D = -0.39 A, V GS = -4.5 V
1.6
Ω
1.2
DS(on)
1
R
0.8
0.6
0.4
0.2
0
-60 -20 20 60 100
98%
typ.
°C
10 Typ. gate threshold voltage
V
parameter: V GS = V
160
T
j
= f (T j)
GS(th)
DS
1.6
V
1.2
GS(th)
1
- V
0.8
0.6
0.4
0.2
0
-60 -20 20 60 100
2%
typ.
98%
°C
T
160
j
11 Typ. capacitances
C = f (VDS)
parameter: V GS=0, f =1 MHz, T j = 25 °C
2
10
C
C
pF
C
C
1
10
0 2 4 6 8 10 12
iss
oss
V
-V
rss
DS
15
12 Forward character. of reverse diode
IF = f (VSD)
parameter: T j = 25 °C
1
BSA 223SP
-10
A
0
-10
F
I
-1
-10
Tj = 25 °C typ
Tj = 150 °C typ
Tj = 25 °C (98%)
Tj = 150 °C (98%)
-2
-10
0 -0.4 -0.8 -1.2 -1.6 -2 -2.4
V
V
SD
-3
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Preliminary data
BSA 223SP
13 Typ. avalanche energy
EAS = f (Tj), par.: ID = -0.39 A
VDD = -10 V, RGS = 25 Ω
1.4
mJ
1
AS
E
0.8
0.6
0.4
0.2
0
20 40 60 80 100 120
°C
14 Typ. gate charge
V
GS
= f (Q
Gate
)
parameter: I D = -0.39 A pulsed, T j = 25 °C
BSA 223SP
-16
V
-12
GS
-10
V
-8
20%
50%
-6
80%
-4
-2
160
T
j
0
0 0.2 0.4 0.6 0.8 1
nC
|Q
1.3
Gate
|
15 Drain-source breakdown voltage
V
(BR)DSS
(BR)DSS
V
= f (T j)
BSA 223SP
-24.5
V
-23.5
-23
-22.5
-22
-21.5
-21
-20.5
-20
-19.5
-19
-18.5
-18
-60 -20 20 60 100
°C
180
T
j
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Preliminary data
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© Infineon Technologies AG 1999
All Rights Reserved.
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characteristics.
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regarding circuits, descriptions and charts stated herein.
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For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).
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For information on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
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or system Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.
BSA 223SP
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