• Transmitting applications in the UHF range with a
nominal supply voltage up to 28 V.
PINNING - SOT122A
PINSYMBOLDESCRIPTION
1ccollector
2eemitter
3bbase
4eemitter
QUICK REFERENCE DATA
RF performance at T
=25°C in a common emitter test circuit.
h
DESCRIPTION
NPN silicon planar epitaxial transistor primarily intended
for class-A, B or C operation. The transistor is
encapsulated in a 4-lead SOT122A stud envelope with a
ceramic cap.
handbook, halfpage
4
c
31
b
2
MAM229
e
Fig.1 Simplified outline and symbol.
MODE OF
OPERATION
f
(MHz)
V
(V)
CE
P
(W)
L
G
p
(dB)
η
(%)
C
CW, class-B4702825>6.5>55
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged.
All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety
precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of
the user. It must never be thrown out with the general or domestic waste.
1996 Feb 062
Page 3
Philips SemiconductorsProduct specification
UHF power transistorBLX94C
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
CESM
V
CEO
V
EBO
I
C
I
C(AV)
I
CM
P
tot
T
stg
T
j
THERMAL CHARACTERISTICS
collector-emitter voltage (peak value)VBE=0−65V
collector-emitter voltageopen base−30V
emitter-base voltageopen collector−4V
collector current (DC)−2.5A
average collector current−2.5A
peak collector currentf > 1 MHz−6A
total power dissipation≤ Tmb=25°C−60W
storage temperature−65+150°C
operating junction temperature−200°C
SYMBOLPARAMETER CONDITIONSVALUEUNIT
R
th j-mb
thermal resistance from junction to
P
=20W;Tmb=82°C; Th=70°C4K/W
tot
mounting base (DC dissipation)
R
th j-mb
thermal resistance from junction to
P
=20W;Tmb=82°C; Th=70°C2.7K/W
tot
mounting base (RF dissipation)
R
th mb-h
thermal resistance from mounting base
P
=20W;Tmb=82°C; Th=70°C0.6K/W
tot
to heatsink
10
handbook, halfpage
I
C
(A)
1
−1
10
11010
(1)(2)
VCE (V)
MBH096
2
60
handbook, halfpage
P
tot
(W)
50
40
30
20
10
0100
(3)
(2)
(1)
50Th (
MBH097
o
C)
(1) Tmb=25°C.
(2) Th=70°C.
Fig.2 DC SOAR.
1996 Feb 063
(1) Continuous DC operation.
(2) Continuous RF operation.
(3) Short-time operation during mismatch.
Fig.3 Power derating curves.
Page 4
Philips SemiconductorsProduct specification
UHF power transistorBLX94C
CHARACTERISTICS
T
=25°C unless otherwise specified.
j
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
(BR)CES
V
(BR)CEO
V
(BR)EBO
V
CEsat
I
CES
E
SBR
h
FE
f
T
C
c
C
re
C
c-s
collector-emitter breakdown voltage VBE= 0; IC=25mA65−−V
collector-emitter breakdown voltage open base; IC= 100 mA30−−V
emitter-base breakdown voltageopen collector; IE=10mA4−−V
collector-emitter saturation voltageIC= 4 A; IB= 0.8 A; note 1−1.5−V
collector cut-off currentVBE= 0; VCE=30V−−10mA
second breakdown energyopen base; L = 25 mH; f = 50 Hz3−−mJ
=10Ω; L = 25 mH; f = 50 Hz3−−mJ
R
BE
DC current gainVCE=5V; IC= 1.5 A; note 11550−
transition frequencyVCB= 28 V; IE= −1.5 A;
−1.1−f
T
f = 500 MHz; note 1
VCB= 28 V; IE= −4A;
−0.75−f
T
f = 500 MHz; note 1
collector capacitanceVCB= 28 V; IE=ie= 0; f = 1 MHz−33−pF
feedback capacitanceVCE= 28 V; IC= 20 mA; f = 1 MHz;−18−pF
collector-stud capacitance−1.2−pF
1. The striplines are on double-clad PCB with PTFE fibre-glass dielectric (ε
1996 Feb 067
= 2.74); thickness 1.45 mm.
r
Page 8
Philips SemiconductorsProduct specification
UHF power transistorBLX94C
handbook, full pagewidth
input
50 Ω
C1
C2
146
52.741.1
rivet (4x)
47
L2
R1
L1
C4
C3
C7
L4
L3
C5
C6
R2
L5
C8
V
CC
output
50 Ω
MBH108
Dimensions in mm.
The components are located on one side of the copper-clad PTFE microfibre-glass board, the other side is unetched and serves as a ground plane.
Earth connections from the component side to the ground plane are made by through metallization.
Fig.10 Component layout and printed-circuit board for 470 MHz class-B test circuit.
1996 Feb 068
Page 9
Philips SemiconductorsProduct specification
UHF power transistorBLX94C
30
handbook, halfpage
P
L
(W)
20
10
110VSWR
VCE= 28 V; f = 470 MHz; R
th mb-h
= 0.6 K/W.
Fig.11 Load power as a function of VSWR.
Th = 50
MBH102
o
C
o
70
o
90
handbook, halfpage
C
C
2
10
3
ri, x
i
(Ω)
2
1
r
i
0
−1
−2
100500
VCE= 28 V; PL=25W;
=25°C; Class-B operation.
T
h
300f (MHz)
MBH103
x
i
Fig.12 Input impedance as a function of frequency
(series components); typical values.
8
handbook, halfpage
RL, X
L
(Ω)
X
L
6
R
L
4
100500
VCE= 28 V; PL=25W;
=25°C; Class-B operation.
T
h
300f (MHz)
MBH104
Fig.13 Load impedance as a function of frequency
(series components); typical values.
24
handbook, halfpage
G
p
(dB)
20
16
12
8
4
0
100500
VCE= 28 V; PL=25W;
=25°C; Class-B operation.
T
h
300f (MHz)
Fig.14 Power gain as a function of frequency;
typical values.
MBH105
1996 Feb 069
Page 10
Philips SemiconductorsProduct specification
UHF power transistorBLX94C
PACKAGE OUTLINE
5.9
4
5.5
7.6 max
27.6
24.9
handbook, full pagewidth
27.6
24.9
3.0
Dimensions in mm.
Torque on nut: min. 0.75 Nm; max. 0.85 Nm.
Mounting hole to have no burrs at either end.
De-burring must leave surface flat; do not chamfer or countersink either end of hole.
When locking is required an adhesive is preferred instead of a lock washer.
2
(4x)
8.8
min
5
(4x)
31
8.5
MSA246
1.52
6.35
3.3
8-32 UNC
1.6
max
12.0
11.0
3.25
2.80
5.6 max
0.14
metal
BeO
ceramic
Fig.15 SOT122A.
1996 Feb 0610
Page 11
Philips SemiconductorsProduct specification
UHF power transistorBLX94C
DEFINITIONS
Data Sheet Status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Feb 0611
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