Datasheet BLW96 Datasheet (Philips)

Page 1
DISCRETE SEMICONDUCTORS
DATA SH EET
BLW96
HF/VHF power transistor
Product specification
August 1986
Page 2
Philips Semiconductors Product specification
DESCRIPTION
N-P-N silicon planar epitaxial transistor intended for use in class-A, AB and B operated high power industrial and military transmitting
conditions. Transistors are supplied in matched h
groups.
FE
The transistor has a1⁄2" flange envelope with a ceramic cap. All
leads are isolated from the flange. equipment in the h.f. and v.h.f. band. The transistor presents excellent performance as a linear amplifier in s.s.b. applications. It is resistance stabilized and is guaranteed to withstand severe load mismatch
QUICK REFERENCE DATA
R.F. performance up to T
=25°C
h
I MODE OF OPERATION
s.s.b. (class-AB) 50 1,6 28 25 200 (P.E.P.) > 13,5 > 40
V
CE
V
f
MHz
P
W
L
G
p
dB
%
η
(1)
d
dB
3
d
dB
5
<−30 <−30 0,1
c.w. (class-B) 50 108 200 typ. 6,5 typ. 67 −−(6) s.s.b. (class-A) 40 28 50 (P.E.P.) typ. 19 typ. 40 <−40 (4)
Note
1. η
at 200 W P.E.P.
dt
C(ZS)
(IC)
A
PIN CONFIGURATION
PINNING - SOT121B.
PIN DESCRIPTION
handbook, halfpage
43
1 collector 2 emitter 3 base 4 emitter
21
MLA876
Fig.1 Simplified outline. SOT121B.
PRODUCT SAFETY This device incorporates beryllium oxide, the dust of which is toxic. The device is entirely safe provided that the BeO disc is not damaged.
August 1986 2
Page 3
Philips Semiconductors Product specification
HF/VHF power transistor BLW96
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Collector-emitter voltage (V
peak value V Collector-emitter voltage (open base) V Emitter-base voltage (open collector) V Collector current (average) I Collector current (peak value); f > 1 MHz I R.F. power dissipation (f > 1 MHz); T Storage temperature T Operating junction temperature T
BE
=0)
CESM CEO
EBO C(AV) CM
=45°CP
mb
rf
stg
j
max. 110 V max. 55 V max. 4 V max. 12 A max. 40 A max. 340 W
65 to + 150 °C
max. 200 °C
2
10
handbook, halfpage
I
C
(A)
10
Th = 70 °C
1
10 10
Fig.2 D.C. SOAR.
MGP685
Tmb = 45 °C
VCE (V)
400
handbook, halfpage
P
tot
(W)
300
200
100
2
0
0 50 100 150
I Continuous d.c. operation II Continuous r.f. operation; f >1 MHz III Short-time operation during mismatch; f > 1 MHz
ΙΙΙ
derate by
1.58 W/K
ΙΙ
Ι
1.35 W/K
MGP686
Th (°C)
Fig.3 Power/temperature derating curves.
THERMAL RESISTANCE
(dissipation = 150 W; T
= 100 °C, i.e. Th=70°C)
mb
From junction to mounting base (d.c. dissipation) R From junction to mounting base (r.f. dissipation) R From mounting base to heatsink R
August 1986 3
th j-mb(dc) th j-mb(rf) th mb-h
= 0,63 K/W = 0,45 K/W = 0,2 K/W
Page 4
Philips Semiconductors Product specification
HF/VHF power transistor BLW96
CHARACTERISTICS
T
=25°C
j
Collector-emitter breakdown voltage
V
=0;IC=50mA V
BE
Collector-emitter breakdown voltage
open base; IC= 200 mA V
Emitter-base breakdown voltage
open collector; IE=20mA V
Collector cut-off current
VBE=0;VCE=55V I
Second breakdown energy; L = 25 mH; f = 50 Hz
open base E R
=10 E
BE
D.C. current gain
(1)
IC= 7 A; VCE=5 V h
(BR)CES
(BR)CEO
(BR)EBO
CES
SBO SBR
FE
> 110 V
> 55 V
> 4V
< 10 mA
> 20 mJ > 20 mJ
typ.
15 to3050
D.C. current gain ratio of matched devices
(1)
IC= 7 A; VCE=5V h
Collector-emitter saturation voltage
(1)
IC= 20 A; IB = 4 A V
Transition frequency at f = 100 MHz
(2)
IE= 7 A; VCB= 45 V f = 20 A; VCB= 45 V f
I
E
Collector capacitance at f = 1 MHz
IE=Ie= 0; VCB=50V
Feedback capacitance at f = 1 MHz C
I
= 150 mA; VCE=50V C
C
Collecting-flange capacitance C
Notes
1. Measured under pulse conditions: t
300 µs; δ≤0,02.
p
2. Measured under pulse conditions: tp≤ 50 µs; δ≤0,01.
FE1/hFE2
CEsat
T T
c re cf
1,2
typ. 1,9 V
typ. 235 MHz typ. 245 MHz
typ. 280 pF typ. 170 pF typ. 4,4 pF
August 1986 4
Page 5
Philips Semiconductors Product specification
HF/VHF power transistor BLW96
10
handbook, halfpage
I
E
(A)
1
1
10
2
10
MGP687
Th = 70 °C
25 °C
VBE (mV)
Fig.4 Typical values; VCE= 40 V.
50
handbook, halfpage
h
FE
40
30
20
10
1250500 1000750
0
010
VCE = 45 V
20
MGP688
15 V
5 V
(A)
30
I
C
Fig.5 Typical values; Tj=25°C.
300
handbook, halfpage
f
T
(MHz)
200
100
0
0 102030
VCB = 45 V
15 V
5 V
MGP689
IE (A)
Fig.6 Typical values; f = 100 MHz; Tj=25°C.
August 1986 5
1000
handbook, halfpage
C
c
(pF)
750
500
250
0
0 255075
Fig.7 IE=Ie= 0; f = 1 MHz; Tj=25°C.
MGP690
typ
VCB (V)
Page 6
Philips Semiconductors Product specification
HF/VHF power transistor BLW96
APPLICATION INFORMATION
R.F. performance in s.s.b. class-AB operation (linear power amplifier) V
= 50 V; Th=25°C; f1= 28,000 MHz; f2 = 28,001 MHz
CE
OUTPUT POWER G
p
ηdt (%) IC(A) d
(1)
3
W dB at 200 W (P.E.P.) dB dB A
25 to 200 (P.E.P.) > 13,5 > 40 < 5,0 <−30 < −30 0,1
(1)
d
5
I
C(ZS)
L3
C10
C11
C12 C13
+V
CC
handbook, full pagewidth
50
C1
C2
L1 R1
C4
C3
temperature
compensated bias
(Ri < 0.1 )
L4
T.U.T.
L2
R2
C5
C6
C7
C8
C9
Fig.8 Test circuit; s.s.b. class-AB.
List of components:
C1 = C4 = C10 = C14 = 100 pF film dielectric trimmer C2 = 27 pF ceramic capacitor (500 V) C3 = 270 pF polysterene capacitor (630 V) C5 = C7 = C8 = 220 nF multilayer ceramic chip capacitor
(2)
C6 = 27 pF multilayer ceramic chip capacitor (500 V; ATC
)
C9 = 47 µF/63 V electrolytic capacitor
(2)
)
(2)
) in parallel
(2)
) in parallel
C11 = 2 × 36 pF multilayer ceramic chip capacitors (500 V; ATC C12 = 2 × 43 pF multilayer ceramic chip capacitors (500 V; ATC C13 = 43 pF multilayer ceramic chip capacitor (500 V; ATC L1 = 88 nH; 3 turns Cu wire (1,0 mm); int. dia. 9,0 mm; length 6,1 mm; leads 2 × 5 mm L2 = Ferroxcube wide-band h.f. choke, grade 3B (cat. no. 4312 020 36640) L3 = 150 nH; 5 turns Cu wire (2,0 mm); int. dia. 10,0 mm; length 18,7 mm; leads 2 × 5 mm L4 = 197 nH; 5 turns Cu wire (2,0 mm); int. dia. 12,0 mm; length 18,6 mm; leads 2 × 5 mm R1 = 0,66 ; parallel connection of 5 × 3,3 metal film resistors (PR37; ± 5%; 1,6 W each) R2 = 27 carbon resistor (± 5%; 0,5 W)
50
C14
MGP691
Notes
1. Stated intermodulation distortion figures are referred to the according level of either of the equal amplified tones. Relative to the according peak envelope powers these figures should be increased by 6 dB.
2. ATC means American Technical Ceramics.
August 1986 6
Page 7
Philips Semiconductors Product specification
HF/VHF power transistor BLW96
25
handbook, halfpage
d3, d
5
(dB)
35
45
0 100 200 300
VCE= 50 V; I
= 28,001 MHz; Th=25°C; typical values.
f
2
d
3
d
5
= 0,1 A; f1= 28,000 MHz;
C(ZS)
MGP692
P.E.P. (W)
Fig.9 Intermodulation distortion as a function of
output power.
(1)
100
handbook, halfpage
η
dt
(%)
G
75
50
25
0
0 100
VCE= 50 V; I
= 28,001 MHz; Th=25°C; typical values.
f
2
p
η
dt
= 0,1 A; f1= 28,000 MHz;
C(ZS)
200
MGP693
P.E.P. (W)
Fig.10 Double-tone efficiency and power gain as a
function of output power.
300
20
15
10
5
0
G
(dB)
p
Ruggedness
The BLW96 is capable of withstanding full load mismatch (VSWR = 50 through all phases) up to 150 W (P.E.P.) or a load mismatch (VSWR = 5 through all phases) up to 200 W (P.E.P.) under the following conditions:
VCE= 45 V; f = 28 MHz; Th=70°C; R
th mb-h
= 0,2 K/W.
August 1986 7
Page 8
Philips Semiconductors Product specification
HF/VHF power transistor BLW96
30
handbook, halfpage
G
p
(dB)
20
10
0
11010
VCE= 50 V; I
=25°C; ZL=5Ω; neutralizing capacitor: 47 pF
T
h
= 0,1 A; PL= 200 W (P.E.P.);
C(ZS)
f (MHz)
Fig.11 Power gain as a function of frequency.
MGP694
2
r
i
i
f (MHz)
MGP695
2
4
ndbook, halfpage
r
, x
i
i
()
3
2
1
0
11010
VCE= 50 V; I
=25°C; ZL=5Ω; neutralizing capacitor: 47 pF
T
h
r
i
x
i
= 0,1 A; PL= 200 W (P.E.P.);
C(ZS)
x
Fig.12 Input impedance (series components) as a
function of frequency.
Figs 11 and 12 are typical curves and hold for one transistor of a push-pull amplifier with cross-neutralization in s.s.b. class-AB operation.
August 1986 8
Page 9
Philips Semiconductors Product specification
HF/VHF power transistor BLW96
R.F. performance in c.w. operation (unneutralized common-emitter class-B circuit) T
= 25 °C
h
f (MHz) V
(V) PL(W) PS(W) Gp(dB) IC (A) η (%)
CE
108 50 200 typ. 45 typ. 6,5 typ. 6 typ. 67
PS (W)
MGP696
10
handbook, halfpage
G
p
(dB)
7.5
5
2.5
0
0 100 200 300
G
p
η
400
handbook, halfpage
P
L
(W)
300
200
100
0
0 255075
typ
PL (W)
MGP697
100
η
(%)
75
50
25
0
Fig.13 VCE= 50 V; f = 108 MHz; Th=25°C.
Fig.14 VCE= 50 V; f = 108 MHz; Th=25°C;
typical values.
August 1986 9
Page 10
Philips Semiconductors Product specification
HF/VHF power transistor BLW96
handbook, halfpage
1
ri, x
i
()
0.5
0
0.5
Typical values; VCE= 50 V; PL= 200 W; Th=25°C; class-B operation
r
i
x
i
25 125
75
f (MHz)
Fig.15 Input impedance (series components).
MGP698
handbook, halfpage
6
RL, X
L
()
R
4
2
0
25 125
Typical values; VCE= 50 V; PL= 200 W; Th=25°C; class-B operation
L
X
L
75
f (MHz)
Fig.16 Load impedance (series components).
MGP699
20
handbook, halfpage
G
p
(dB)
10
0
25 125
Typical values; VCE= 50 V; PL= 200 W; Th=25°C; class-B operation
75
Fig.17
MGP700
f (MHz)
August 1986 10
Page 11
Philips Semiconductors Product specification
HF/VHF power transistor BLW96
R.F. performance in s.s.b. class-A operation (linear power amplifier) V
= 40 V; Th=25°C; f1= 28,000 MHz; f2 = 28,001 MHz
CE
OUTPUT POWER
W
G
dB
p
I
C
A
d
3
dB
(1)
typ. 50 (P.E.P.) typ. 19 4 typ. 40 < 40
d
5
dB
(1)
C8
C9
C10
50
MGP701
handbook, full pagewidth
50
C1
+V
BB
C2
L4
L1
L2
C3
C4
R1
T.U.T.
C5
C6
L3
C7
+V
CC
Fig.18 Test circuit; s.s.b. class-A.
List of components:
C1 = C2 = 10 to 780 pF film dielectric trimmer C3 = 220 nF polyester capacitor (100 V) C4 = 100 µF/4 V electrolytic capacitor C5 = 2 × 330 nF polyester capacitors (100 V) in parallel C6 = 47 µF/63 V electrolytic capacitor C7 = C10 = 2 × 82 pF ceramic capacitors (500 V) in parallel C8 = C9 = 10 to 150 pF air dielectric trimmer L1 = 45 nH; 2 turns enamelled Cu wire (1,6 mm); int. dia. 8,0 mm; length 4,0 mm; leads 2 × 3 mm L2 = Ferroxcube wide-band h.f. choke, grade 3B (cat. no. 4312 020 36640) L3 = 110 nH; 4 turns enamelled Cu wire (2,0 mm); int. dia. 10,0 mm; length 8,0 mm; leads 2 × 2mm L4 = 210 nH; 5 turns enamelled Cu wire (2,0 mm); int. dia. 12,0 mm; length 10,0 mm; leads 2 × 2 mm R1 = 27 carbon resistor (± 5%; 0,5 W)
Note
1. Stated intermodulation distortion figures are referred to the according level of either of the equal amplified tones. Relative to the according peak envelope powers these figures should be increased by 6 dB.
August 1986 11
Page 12
Philips Semiconductors Product specification
HF/VHF power transistor BLW96
30
handbook, full pagewidth
d
3
(dB)
40
50
60
020 80
IC = 3 A 4 A
40 60
Fig.19 Third order intermodulation distortion as a function of output power.
Th=25°C; f1= 28,000 MHz; f2= 28,001 MHz.
5 A
P.E.P. (W)
(1)
Typical values; VCE=40V;
MGP702
100
August 1986 12
Page 13
Philips Semiconductors Product specification
HF/VHF power transistor BLW96
PACKAGE OUTLINE
Flanged ceramic package; 2 mounting holes; 4 leads SOT121B
D
A
F
H
43
α
12
H
q
U
1
L
C
B
b
p
w
M
C
2
A
U
U
2
w
M
AB
1
D
3
1
c
Q
0 5 10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
5.82
5.56
c
Db
12.83
12.86
0.16
0.10
0.006
0.004
IEC JEDEC EIAJ
12.59
0.506
0.496
12.57
0.505
0.495
F
D
1
2.67
28.45
2.41
0.105
0.095
7.93
25.52
6.32
1.120
0.312
1.005
0.249
REFERENCES
0.130
0.120
UNIT
inches
A
7.27
mm
6.17
0.229
0.286
0.219
0.243
OUTLINE
VERSION
SOT121B 97-06-28
pH
3.30
3.05
Q
4.45
3.91
0.175
0.154
q
18.42
0.725
U
1
24.90
24.63
0.98
0.97
U
6.48
6.22
0.255
0.245
2
w1w
U
3
12.32
0.51
12.06
0.485
0.02
0.475
EUROPEAN
PROJECTION
August 1986 13
2
1.02
0.04
ISSUE DATE
αL
45°
Page 14
Philips Semiconductors Product specification
HF/VHF power transistor BLW96
DEFINITIONS
Data Sheet Status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
August 1986 14
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