N-P-N silicon planar epitaxial
transistor intended for use in class-A,
It has a
ceramic cap. All leads are isolated
from the flange.
1
⁄2" flange envelope with a
AB or B operated mobile, industrial
and military transmitters in the h.f.
and v.h.f. bands. It is resistance
stabilized and is guaranteed to
withstand severe load mismatch
conditions.
1. Stated intermodulation distortion figures are referred to the according level of either of the equal amplified tones.
Relative to the according peak envelope powers these figures should be increased by 6 dB.
PIN CONFIGURATION
PINNING - SOT121B.
PINDESCRIPTION
handbook, halfpage
43
1collector
2emitter
3base
4emitter
21
MLA876
Fig.1 Simplified outline. SOT121B.
PRODUCT SAFETY This device incorporates beryllium oxide, the dust of which is toxic. The device is entirely
safe provided that the BeO disc is not damaged.
August 19862
Page 3
Philips SemiconductorsProduct specification
HF/VHF power transistorBLW78
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Collector-emitter voltage (V
peak valueV
Collector-emitter voltage (open base)V
Emitter-base voltage (open collector)V
Collector current (average)I
Collector current (peak value); f > 1 MHzI
R.F. power dissipation (f > 1 MHz); T
Storage temperatureT
Operating junction temperatureT
BE
=0)
CESM
CEO
EBO
C(AV)
CM
=25°CP
mb
rf
stg
j
max.70 V
max.35 V
max.4 V
max.10 A
max.25 A
max.160 W
−65 to +150 °C
max.200 °C
2
10
handbook, halfpage
I
C
(A)
10
1
11010
Th = 70 °CTmb = 25 °C
VCE (V)
Fig.2 D.C. SOAR.
MGP543
2
200
handbook, halfpage
P
rf
(W)
150
100
50
050100
I Continuous d.c. operation
II Continuous r.f. operation
III Short-time operation during mismatch
ΙΙΙ
ΙΙ
0.61 W/K
Ι
derate by 0.79 W/K
derate by
Th (°C)
MGP544
Fig.3 R.F. power dissipation; VCE≤ 28 V; f > 1 MHz.
THERMAL RESISTANCE
(dissipation = 80 W; T
=86°C; i.e. Th=70°C)
mb
From junction to mounting base (d.c. dissipation)R
From junction to mounting base (r.f. dissipation)R
From mounting base to heatsinkR
August 19863
th j-mb(dc)
th j-mb(rf)
th mb-h
=1,45 K/W
=1,06 K/W
=0,2 K/W
Page 4
Philips SemiconductorsProduct specification
HF/VHF power transistorBLW78
CHARACTERISTICS
T
=25°C
j
Collector-emitter breakdown voltage
V
=0;IC=50mAV
BE
Collector-emitter breakdown voltage
open base; IC= 100 mAV
Emitter-base breakdown voltage
open collector; IE= 5 mAV
Collector cut-off current
VBE= 0; VCE=35VI
D.C. current gain
(1)
IC= 5 A; VCE=5Vh
Collector-emitter saturation voltage
I
= 15 A; IB=3 AV
C
Transition frequency at f = 100 MHz
(2)
−IE= 5 A; VCB=28Vf
−I
= 15 A; VCB=28Vf
E
Collector capacitance at f = 1 MHz
I
= 0; VCB=28VC
E=Ie
Feedback capacitance at f=1MHz
I
= 100 mA; VCE=28VC
C
Collector-flange capacitanceC
(BR)CES
(BR)CEO
(BR)EBO
CES
FE
CEsat
T
T
c
re
cf
>70 V
>35 V
>4V
<5mA
20 to 85
typ.2 V
typ. 370 MHz
typ. 350 MHz
typ. 155 pF
typ. 102 pF
typ.3 pF
Notes
1. Measured under pulse conditions: t
≤ 300 µs; δ≤0,02.
p
2. Measured under pulse conditions: tp≤ 50 µs; δ≤0,01.
August 19864
Page 5
Philips SemiconductorsProduct specification
HF/VHF power transistorBLW78
75
handbook, halfpage
h
FE
50
25
0
0510
Fig.4 Typical values; Tj=25°C.
750
handbook, full pagewidth
VCE = 28 V
5 V
IC (A)
MGP545
600
handbook, halfpage
C
c
(pF)
400
200
0
02040
Fig.5 IE=Ie= 0; f = 1 MHz; Tj=25°C.
MGP546
typ
VCB (V)
MGP547
f
T
(MHz)
500
250
0
010520
Fig.6 Typical values; f = 100 MHz; Tj=25°C.
August 19865
VCB = 28 V
15
20 V
−IE (A)
25
Page 6
Philips SemiconductorsProduct specification
HF/VHF power transistorBLW78
APPLICATION INFORMATION
R.F. performance in c.w. operation (unneutralized common-emitter class-B circuit); T
C5 = 1 nF feed-through capacitor
C6 = 100 nF polyester capacitor
L1 = strip (30 mm × 8 mm); bent to form inverted ‘U’ shape with top 15 mm above heatsink, and bottom 5 mm above
heatsink
L2 = 1 µH r.f. choke
L3 = strip; shape as shown in Fig.8; 5 mm above heatsink
L4 = strip (40 mm × 8 mm); bent in form, 25 mm at 15 mm above heatsink, 5 mm at 5 mm above heatsink
L5 = strip (75 mm long; width 8 mm); 5 mm above base
L1, L3, L4, and L5 are copper strips with a thickness of 0,6 mm.
Heatsink: aluminium; 0,9 K/W
= 100 W and VCE= 28 V, the output power at heatsink temperatures between 25 °C and 90 °C relative to that at
At P
L
25 °C is diminished by typ. 0,12 W/K.
Component layout on an aluminium heatsink for 150 MHz test circuit is shown in Fig.8.
Note
1. ATC means American Technical Ceramics.
August 19866
Page 7
Philips SemiconductorsProduct specification
HF/VHF power transistorBLW78
handbook, full pagewidth
C5
L4
output
50 Ω
C8
MGP549
input
50 Ω
C1
C2
L2
L1
L3
C3
C4
L5
C7
aluminium heatsink
Fig.8 Component layout on an aluminium heatsink for 150 MHz test circuit. ⊗ Earthing bolts.
August 19867
Page 8
Philips SemiconductorsProduct specification
HF/VHF power transistorBLW78
150
handbook, halfpage
P
L
(W)
100
50
0
02040
typ
PS (W)
Fig.9VCE= 28 V; f = 150 MHz; Th=25°C.
150
handbook, halfpage
P
Lnom
(W)
(VSWR = 1)
MGP550
MGP552
10
handbook, halfpage
G
p
(dB)
5
0
050100150
η
G
p
PL (W)
Fig.10 VCE= 28 V; f = 150 MHz; Th=25°C;
typical values.
MGP551
100
η
(%)
50
0
100
Th ≤ 70 °C
50
0
11010
The graph shows the permissible output power
under nominal conditions (VSWR = 1) as a
function of the expected VSWR during short-time
mismatch conditions with heatsink temperatures
as parameter.
≤ 90 °C
VSWR
2
Fig.11 R.F. SOAR; c.w. class-B operation;
f = 150 MHz; VCE=28V;
R
th mb-h
= 0,2 K/W.
August 19868
Page 9
Philips SemiconductorsProduct specification
HF/VHF power transistorBLW78
OPERATING NOTE
Below 50 MHz a base-emitter resistor of 4,7 Ω is
recommended to avoid oscillation. This resistor must be
effective for r.f. only.
1. Stated intermodulation distortion figures are referred to the according level of either of the equal amplified tones.
Relative to the according peak envelope powers these figures should be increased by 6 dB.
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
5.82
5.56
c
Db
12.83
12.86
0.16
0.10
0.006
0.004
IEC JEDEC EIAJ
12.59
0.506
0.496
12.57
0.505
0.495
F
D
1
2.67
28.45
2.41
25.52
1.120
0.105
0.095
0.312
1.005
0.249
REFERENCES
7.93
6.32
0.130
0.120
UNIT
inches
A
7.27
mm
6.17
0.229
0.286
0.219
0.243
OUTLINE
VERSION
SOT121B97-06-28
pH
3.30
3.05
Q
4.45
3.91
0.175
0.154
q
18.42
0.725
U
1
24.90
24.63
0.98
0.97
U
2
6.48
6.22
0.255
0.245
w1w
U
3
12.32
0.51
12.06
0.485
0.02
0.475
EUROPEAN
PROJECTION
August 198615
2
1.02
0.04
ISSUE DATE
αL
45°
Page 16
Philips SemiconductorsProduct specification
HF/VHF power transistorBLW78
DEFINITIONS
Data Sheet Status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
August 198616
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