N-P-N silicon planar epitaxial
transistor intended for use in class-AB
or class-B operated high power
transmitters in the h.f. and v.h.f.
mismatch conditions. Transistors are
delivered in matched h
groups.
FE
The transistor has a1⁄2" flange
envelope with a ceramic cap. All
leads are isolated from the flange.
bands. The transistor presents
excellent performance as a linear
amplifier in the h.f. band. It is
resistance stabilized and is
guaranteed to withstand severe load
QUICK REFERENCE DATA
R.F. performance up to T
MODE OF OPERATIONV
s.s.b. (class-AB)280,11,6 − 2815 − 130
= 25 °C
h
V
CE
I
C(ZS)
A
f
MHz
P
W
L
G
p
dB
> 12> 37,5
%
η
(1)
<−30
(P.E.P.)
c.w. (class-B)28−87,5130typ. 7,5typ. 75−
Note
1. At 130 W P.E.P.
d
dB
3
PIN CONFIGURATION
PINNING - SOT121B.
PINDESCRIPTION
handbook, halfpage
43
1collector
2emitter
3base
4emitter
21
MLA876
Fig.1 Simplified outline. SOT121B.
PRODUCT SAFETY This device incorporates beryllium oxide, the dust of which is toxic. The device is entirely
safe provided that the BeO disc is not damaged.
August 19862
Page 3
Philips SemiconductorsProduct specification
HF/VHF power transistorBLW77
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Collector-emitter voltage (V
peak valueV
Collector-emitter voltage (open base)V
Emitter-base voltage (open collector)V
Collector current (average)I
Collector current (peak value); f > 1 MHzI
R.F. power dissipation (f > 1 MHz;); T
Storage temperatureT
Operating junction temperatureT
BE
= 0)
CESM
CEO
EBO
C(AV)
CM
= 25 °CP
mb
rf
stg
j
max.70 V
max.35 V
max.4 V
max.12 A
max.30 A
max.245 W
−65 to + 150 °C
max.200 °C
2
10
handbook, halfpage
I
C
(A)
10
1
11010
Th = 70 °C
Fig.2 D.C. SOAR.
Tmb = 25 °C
VCE (V)
MGP521
2
300
handbook, halfpage
P
rf
(W)
200
100
0
0
I Continuous d.c. operation
II Continuous r.f. operation
III Short-time operation during mismatch
ΙΙΙ
ΙΙ
Ι
derate by 1.11 W/K
derate by 0.82 W/K
50100
Th (°C)
MGP522
Fig.3R.F. power dissipation; VCE≤ 28 V; f ≥ 1 MHz.
THERMAL RESISTANCE
(dissipation = 100 W; T
=90°C, i.e. Th=70°C)
mb
From junction to mounting base (d.c. dissipation)R
From junction to mounting base (r.f. dissipation)R
From mounting base to heatsinkR
August 19863
th j-mb(dc)
th j-mb(rf)
th mb-h
=1,03 K/W
=0,71 K/W
=0,2 K/W
Page 4
Philips SemiconductorsProduct specification
HF/VHF power transistorBLW77
CHARACTERISTICS
T
=25°C unless otherwise specified
j
Collector-emitter breakdown voltage
V
= 0; IC= 50 mAV
BE
Collector-emitter breakdown voltage
open base; IC= 100 mAV
Emitter-base breakdown voltage
open collector; IE= 20 mAV
Collector cut-off current
VBE= 0; VCE= 35 VI
D.C. current gain
(1)
IC= 7 A; VCE=5 Vh
D.C. current gain ratio of matched devices
(1)
IC= 7 A; VCE=5 Vh
Collector-emitter saturation voltage
(1)
IC= 20 A; IB=4 AV
Transition frequency at f = 100 MHz
(2)
−IE= 7 A; VCB= 28 Vf
−I
= 20 A; VCB= 28 Vf
E
Collector capacitance at f = 1 MHz
I
= 0; VCB= 28 VC
E=Ie
Feedback capacitance at f = 1 MHz
IC= 100 mA; VCE= 28 VC
Collector-flange capacitanceC
(BR) CES
(BR) CEO
(BR)EBO
CES
FE
FE1/hFE2
CEsat
T
T
c
re
cf
>70 V
>35 V
>4V
<20 mA
15 to 80
<1,2
typ.2 V
typ.320 MHz
typ.300 MHz
typ.255 pF
typ.175 pF
typ.3 pF
Notes
1. Measured under pulse conditions: t
≤ 300 µs; δ≤0,02.
p
2. Measured under pulse conditions: tp≤ 50 µs; δ≤0,01.
10
handbook, halfpage
I
C
(A)
1
−1
10
−2
10
Fig.4 Typical values; VCE= 20 V.
August 19864
Th = 70 °C
25 °C
VBE (V)
MGP523
1.50.51
Page 5
Philips SemiconductorsProduct specification
HF/VHF power transistorBLW77
75
handbook, halfpage
h
FE
50
25
0
0 102030
VCE = 28 V
5 V
IC (A)
Fig.5 Typical values; Tj=25°C.
MGP524
1500
handbook, halfpage
C
c
(pF)
1000
500
0
0
Fig.6 IE=Ie= 0; f = 1 MHz; Tj= 25 °C.
typ
2040
VCB (V)
MGP525
400
handbook, full pagewidth
f
T
(MHz)
200
0
0515
Fig.7 VCB= 28 V; f = 100 MHz; Tj=25°C.
August 19865
MGP526
typ
10
−IE (A)
20
Page 6
Philips SemiconductorsProduct specification
HF/VHF power transistorBLW77
APPLICATION INFORMATION
R.F. performance in s.s.b. class-AB operation (linear power amplifier)
V
1. Stated intermodulation distortion figures are referred
to the according level of either of the equal amplified
tones. Relative to the according peak envelope
powers these figures should be increased by 6 dB.
η
dt
G
p
P.E.P. (W)
MGP529
60
handbook, halfpage
η
dt
(%)
40
20
0
050100150
VCE= 28 V; I
= 28,001 MHz; Th= 25 °C; typical values.
f
2
= 100 mA; f1= 28,000 MHz;
C(ZS)
Fig.10 Double-tone efficiency and power gain as a
function of output power.
30
(dB)
20
10
0
G
p
August 19868
Page 9
Philips SemiconductorsProduct specification
HF/VHF power transistorBLW77
40
handbook, halfpage
G
p
(dB)
30
20
10
0
11010
VCE= 28 V; I
= 25 °C; ZL= 2,5 Ω.
T
h
= 100 mA; PL= 130 W;
C(ZS)
f (MHz)
Fig.11 Power gain as a function of frequency.
MGP530
2
5
handbook, halfpage
r
i
(Ω)
2.5
0
11010
VCE= 28 V; I
= 25 °C; ZL= 2,5 Ω.
T
h
= 100 mA; PL= 130 W;
C(ZS)
x
r
MGP531
i
i
f (MHz)
Fig.12 Input impedance (series components) as a
function of frequency.
1
x
i
(Ω)
0
−1
−2
−3
2
Figs 11 and 12 are typical curves and hold for an
unneutralized amplifier in s.s.b. class-AB operation.
August 19869
Page 10
Philips SemiconductorsProduct specification
HF/VHF power transistorBLW77
30
handbook, halfpage
G
p
(dB)
20
10
0
11010
VCE= 28 V; I
= 2,5Ω; neutralizing capacitor: 150 pF.
Z
L
= 100 mA; PL= 130 W; Th=25°C;
C(ZS)
f (MHz)
Fig.13 Power gain as a function of frequency.
MGP533
2
7.5
handbook, halfpage
r
i
(Ω)
5
2.5
0
11010
VCE= 28 V; I
= 2,5 Ω; neutralizing capacitor: 150 pF.
Z
L
= 100 mA; PL= 130 W; Th=25°C;
C(ZS)
x
r
MGP534
i
i
f (MHz)
Fig.14 Input impedance (series components) as a
function of frequency.
0
x
i
(Ω)
−1
−2
−3
2
13 and 14 are typical curves and hold for a push-pull
amplifier with cross-neutralization in s.s.b class-AB
operation.
August 198610
Page 11
Philips SemiconductorsProduct specification
HF/VHF power transistorBLW77
VSWR
MGP532
Th =
50 °C
70 °C
90 °C
250
handbook, halfpage
P
Lnom
(W P.E.P.)
(VSWR = 1)
200
150
100
11010
The graph shows the permissible output power under nominal
conditions (VSWR = 1) as a function of the expected VSWR during
short-time mismatch conditions with heatsink temperatures as
parameter.
Fig.15 R.F. SOAR; s.s.b. class-AB operation;
f1= 28,000 MHz; f2= 28,001 MHz;
VCE= 28 V; R
th mb-h
= 0,2 K/W.
2
August 198611
Page 12
Philips SemiconductorsProduct specification
HF/VHF power transistorBLW77
R.F. performance in c.w. operation (unneutralized common-emitter class-B circuit); Th=25°C
C1=4 to 40 pF film dielectric trimmer (cat. no. 2222 809 07008)
C2=C9 = C10 = 7 to 100 pF film dielectric trimmer (cat. no. 2222 809 07015)
C3=C8 = 22 pF ceramic capacitor (500 V)
C4=4 × 82 pF ceramic capacitors in parallel (500 V)
C5=390 pF polystyrene capacitor
C6=220 nF polyester capacitor
C7a=2 × 10 pF ceramic capacitors in parallel (500 V)
C7b=2 × 8,2 pF ceramic capacitors in parallel (500 V)
L1=25 nH; 2 turns Cu wire (1,6 mm); int. dia. 5,0 mm; length 4,6 mm; leads 2 × 5 mm
L2=L5 = 2,4 nH; strip (12 mm × 6 mm); tap for L4 and L6 at 5 mm from transistor
L3=L7 = Ferroxcube wide-band h.f. choke, grade 3B (cat. no. 4312 020 36640)
L4=100 nH; 7 turns closely wound enamelled Cu wire (0,5 mm); int. dia. 3 mm; leads 2 × 5 mm
L6=46 nH; 2 turns Cu wire (2,0 mm); int. dia. 9,0 mm; length 6,0 mm; leads 2 × 5 mm
L8=44 nH; 2 turns Cu wire (2,0 mm); int. dia. 9,0 mm; length 6,7 mm; leads 2 × 5 mm
L2 and L5 are strips on a double Cu-clad printed-circuit board with epoxy fibre-glass dielectric.
R1=10 Ω (± 10%) carbon resistor
R2=10 Ω (± 10%) carbon resistor
Component layout and printed-circuit board for 87,5 MHz test circuit are shown in Fig.17.
August 198612
Page 13
Philips SemiconductorsProduct specification
HF/VHF power transistorBLW77
116
handbook, full pagewidth
65
L7
+V
CC
C8
C9
C10
MGP536
C5
L8
R2
C6
C7a
C7b
C1
C2
C3
L3
R1
L4
L1
L2L5
C4
rivet
L6
strip
Fig.17 Component layout and printed-circuit board for 87,5 MHz test circuit.
The circuit and the components are situated on one side of the epoxy fibre-glass board, the other side being fully
metallized to serve as earth. Earth connections are made by means of hollow rivets, whilst under the emitter leads Cu
straps are used for a direct contact between upper and lower sheets.
August 198613
Page 14
Philips SemiconductorsProduct specification
HF/VHF power transistorBLW77
250
handbook, halfpage
P
L
(W)
200
150
100
50
0
0255075
typ
Fig.18 VCE= 28 V; f = 87,5 MHz; Th=25°C.
175
handbook, halfpage
PS (W)
MGP537
MGP539
10
handbook, halfpage
G
p
(dB)
5
0
0100200300
η
G
p
PL (W)
Fig.19 VCE= 28 V; f = 87,5 MHz; Th=25°C;
typical values.
MGP538
100
η
(%)
50
0
P
Lnom
(W)
(VSWR = 1)
125
Th =
50 °C
70 °C
75
11010
The graph shows the permissible output power under
nominal conditions (VSWR = 1) as a function of the
expected VSWR during short-time mismatch
conditions with heatsink temperatures as parameter.
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
5.82
5.56
c
Db
12.83
12.86
0.16
0.10
0.006
0.004
IEC JEDEC EIAJ
12.59
0.506
0.496
12.57
0.505
0.495
F
D
1
2.67
28.45
2.41
25.52
1.120
0.105
0.095
0.312
1.005
0.249
REFERENCES
7.93
6.32
0.130
0.120
UNIT
inches
A
7.27
mm
6.17
0.229
0.286
0.219
0.243
OUTLINE
VERSION
SOT121B97-06-28
pH
3.30
3.05
Q
4.45
3.91
0.175
0.154
q
18.42
0.725
U
1
24.90
24.63
0.98
0.97
U
2
6.48
6.22
0.255
0.245
w1w
U
3
12.32
0.51
12.06
0.485
0.02
0.475
EUROPEAN
PROJECTION
August 198616
2
1.02
0.04
ISSUE DATE
αL
45°
Page 17
Philips SemiconductorsProduct specification
HF/VHF power transistorBLW77
DEFINITIONS
Data Sheet Status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
August 198617
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