Datasheet BLW50F Datasheet (Philips)

Page 1
DISCRETE SEMICONDUCTORS
DATA SH EET
BLW50F
HF/VHF power transistor
Product specification
August 1986
Page 2
Philips Semiconductors Product specification
DESCRIPTION
N-P-N silicon planar epitaxial transistor primarily intended for use in
It has a 3/8" flange envelope with a ceramic cap. All leads are isolated from the flange.
class-A, AB and B operated, industrial and military transmitters in the h.f. and v.h.f. band. Resistance stabilization provides protection against device damage at severe load mismatch conditions. Matched hFEgroups are available on request.
QUICK REFERENCE DATA
R.F. performance
MODE OF OPERATION V
CE
V
f
MHz
P
W
L
G
p
dB
η
dt
%
I
I
C
C(ZS)
A
mA
d
dB
3
s.s.b. (class-A) 45 1,6 - 28 0 - 16 (P.E.P.) > 19,5 1,2 −<−40 70
(1)
s.s.b. (class-AB) 50 1,6 - 28 10 - 65 (P.E.P.) typ. 18 typ. 45
1,45 50 typ. 30 25
Note
1. At 65W P.E.P.
T °C
h
PIN CONFIGURATION
PINNING - SOT123
PIN DESCRIPTION
lfpage
1
23
4
handbook, halfpage
MSB057
MBB012
c
b
e
1 collector 2 emitter 3 base 4 emitter
Fig.1 Simplified outline and symbol.
PRODUCT SAFETY This device incorporates beryllium oxide, the dust of which is toxic. The device is entirely safe provided that the BeO disc is not damaged.
August 1986 2
Page 3
Philips Semiconductors Product specification
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Collector-emitter voltage (V
peak value V Collector-emitter voltage (open base) V Emitter-base voltage (open collector) V Collector current (average) I Collector current (peak value); f > 1 MHz I D.C. and r.f. (f > 1 MHz) power dissipation; T Storage temperature T Operating junction temperature T
BE
= 0)
CESM CEO
EBO C(AV) CM
= 25 °CP
mb
tot;Prf
stg
j
max. 110 V max. 55 V max. 4 V max. 2,5 A max. 7,5 A max. 94 W
65 to + 150 °C
max. 200 °C
10
handbook, halfpage
I
C
(A)
1
1
10
1 10 10
Th = 70 °C
VCE (V)
Fig.2 D.C. SOAR.
MGP466
Tmb = 25 °C
150
handbook, halfpage
P
rf
(W)
100
ΙΙ
50
Ι
2
0
0
I Continuous d.c. and r.f. operation II Short-time operation during mismatch
50
Th (°C)
MGP467
100
Fig.3 Power derating curves vs. temperature.
THERMAL RESISTANCE
(dissipation = 54 W; T
=86°C, i.e. Th=70°C)
mb
From junction to mounting base
(d.c. and r.f. dissipation) R
From mounting base to heatsink R
August 1986 3
th j-mb th mb-h
= 2,1 K/W = 0,3 K/W
Page 4
Philips Semiconductors Product specification
CHARACTERISTICS
T
=25°C
j
Collector-emitter breakdown voltage
V
= 0; IC= 25 mA V
BE
Collector-emitter breakdown voltage
open base; IC= 100 mA V
Emitter-base breakdown voltage
open collector; IE= 10 mA V
Collector cut-off current
VBE= 0; VCE= 55 V I
Second breakdown energy; L = 25 mH; f = 50 Hz
open base E R
=10 E
BE
D.C. current gain
(1)
IC= 1,2 A; VCE=5 V h
D.C. current gain ratio of matched devices
(1)
IC= 1,2 A; VCE=5 V h Collector-emitter saturation voltage
(1)
IC= 3,0 A; IB= 0,6 A V
Transition frequency at f = 100 MHz
(1)
IE= 1,2 A; VCB= 45 V f = 4,0 A; VCB= 45 V f
I
E
Collector capacitance at f = 1 MHz
IE=Ie= 0; VCB= 45 V C
Feedback capacitance at f = 1 MHz
I
= 50 mA; VCE= 45 V C
C
Collector-flange capacitance C
(BR) CES
(BR) CEO
(BR)EBO
CES
SBO SBR
FE
FE1/hFE2
CEsat
T T
c
re cf
> 110 V
> 55 V
> 4V
< 10 mA
> 8mJ > 8mJ
typ. 25
15 to 100
< 1,2
typ. 1,2 V
typ. 490 MHz typ. 540 MHz
typ. 53 pF
typ. 35 pF typ. 2 pF
Note
1. Measured under pulse conditions: t
200 µs; δ≤0,02.
p
August 1986 4
Page 5
Philips Semiconductors Product specification
10
handbook, halfpage
I
C
(A)
1
1
10
2
10
typ
1
VBE (V)
Fig.4 VCE= 40 V; Tmb=25°C.
MGP468
40
handbook, halfpage
h
FE
30
20
10
1.50 0.5
0
0123
VCE = 45 V
5 V
MGP469
IC (A)
Fig.5 Typical values; Tj=25°C.
600
handbook, halfpage
f
T
(MHz)
400
200
0
0510
VCB = 45 V
10 V
IE (A)
MGP470
Fig.6 Typical values; f = 100 MHz; Tj=25°C.
August 1986 5
300
handbook, halfpage
C
c
(pF)
200
100
0
02550
Fig.7 IE=Ie= 0; f = 1 MHz; Tj= 25 °C.
MGP471
typ
VCB (V)
Page 6
Philips Semiconductors Product specification
APPLICATION INFORMATION
R.F. performance in s.s.b. class-A operation (linear power amplifier) V
= 45 V; f1= 28,000 MHz; f2= 28,001 MHz
CE
OUTPUT POWER
W
G dB
p
I
C
A
d
3
dB
(1)
> 16 (P.E.P.) > 19,5 1,2 40 <−40 70 typ. 17 (P.E.P.) typ. 20,5 1,2 40 <−40 70
d
5
dB
(1)
T °C
h
+V
R3
CC
C9
50
C8
MGP472
handbook, full pagewidth
50
C1
C2
L4
R2
T.U.T.
L2
C4C3
L3
C6
C5
C7
L1
R1
+V
BB
Fig.8 Test circuit; s.s.b. class-A.
List of components in Fig.8:
C1 = C2 = 10 to 780 pF film dielectric trimmer C3 = 22 nF ceramic capacitor (63 V) C4 = 4,7 µF/16 V electrolytic capacitor C5 = 1 µF/75 V solid tantalum capacitor C6 = C7 = 47 nF polyester capacitor (100 V) C8 = 68 pF ceramic capacitor (500 V) C9 = 3,9 nF ceramic capacitor L1 = 3 turns closely wound enamelled Cu wire (1,0 mm); int. dia 9,0 mm; leads 2 × 5 mm L2 = Ferroxcube wide-band h.f. choke, grade 3B (cat. no. 4312 020 36640) L3 = 1,05 µH; 15 turns enamelled Cu wire (1,0 mm); int. dia. 10 mm; length 17,4 mm; leads 2 × 5 mm L4 = 162 nH; 6 turns enamelled Cu wire (1,0 mm); int. dia. 7,0 mm; length 11,6 mm; leads 2 × 5 mm R1 = 1,6 ; parallel connection of 3 × 4,7 carbon resistors (± 5%; 0,125 W) R2 = 47 carbon resistor (± 5%; 0,25 W) R3 = 4,7 carbon resistor (± 5%; 0,25 W)
Note
1. Stated intermodulation distortion figures are referred to the according level of either of the equal amplified tones. Relative to the according peak envelope powers these figures should be increased by 6 dB.
August 1986 6
Page 7
Philips Semiconductors Product specification
20
handbook, full pagewidth
d
3
(dB)
30 IC = 0.8 A 1.0 A 1.2 A
40
50
60
010
20
P.E.P. (W)
Fig.9 Intermodulation distortion (see note on previous page) as a function of output power. Typical values;
VCE= 45 V; f1= 28,000 MHz; f2= 28,001 MHz; Th= 70 °C.
MGP473
30
August 1986 7
Page 8
Philips Semiconductors Product specification
R.F. performance in s.s.b. class-AB operation (linear power amplifier) V
= 50 V; f1= 28,000 MHz; f2= 28,001 MHz
CE
OUTPUT POWER G
p
ηdt(%) IC(A) d
(1)
3
W dB AT 65 W P.E.P. dB dB mA °C
10 to 65 (P.E.P.) typ.18 typ. 45 typ. 1,45 typ. 30 <−30 50 25
(1)
d
5
I
C(ZS)
T
h
C7
C9
50
+V
CC
MGP474
handbook, full pagewidth
C1
50
compensated bias
C2
temperature
(Ri < 0.1 )
L4
R2
T.U.T.
L2
L3
C4
C5 C6 C8
L1
R1
C3
Fig.10 Test circuit; s.s.b. class-AB.
List of components:
C1 = C2 = 10 to 780 pF film dielectric trimmer C3 = C5 = C6 = 220 nF polyester capacitor C4 = 120 pF ceramic capacitor (500 V) C7 = 150 pF ceramic capacitor (500 V) C8 = 47µF/63 V electrolytic capacitor C9 = 3,9 nF ceramic capacitor L1 = 4 turns closely wound enamelled Cu wire (1,6 mm); int. dia 7,0 mm; leads 2 × 5 mm L2 = Ferroxcube wide-band h.f. choke, grade 3B (cat.no. 4312 020 36640) L3 = 9 turns enamelled Cu wire (1,0 mm); int. dia. 10 mm; length 14,5 mm; leads 2 × 5 mm L4 = 6 turns enamelled Cu wire (1,0 mm); int. dia. 6,5 mm; length 11,0 mm; leads 2 × 5 mm R1 = 2,4 ; parallel connection of 2 × 4,7 carbon resistors R2 = 39 carbon resistor
Note
1. Stated intermodulation distortion figures are referred to the according level of either of the equal amplified tones. Relative to the according peak envelope powers these figures should be increased by 6 dB.
August 1986 8
Page 9
Philips Semiconductors Product specification
20
handbook, halfpage
d3, d
5
(dB)
30
40
0255075
VCE= 50 V; I
= 28,001 MHz; Th=25°C; typical values.
f
2
d
3
d
5
= 50 mA; f1= 28,000 MHz;
C(ZS)
MGP475
P.E.P. (W)
Fig.11 Intermodulation distortion as a function of
output power
(1)
.
50
handbook, halfpage
η
dt
(%)
25
0
0255075
VCE= 50 V; I
= 28,001 MHz; Th=25°C; typical values.
f
2
G
p
η
dt
= 50 mA; f1= 28,000 MHz;
C(ZS)
MGP476
P.E.P. (W)
Fig.12 Double-tone efficiency and power gain as a
function of output power.
20
(dB)
10
0
G
p
Ruggedness in s.s.b. operation
The BLW50F is capable of withstanding full load mismatch (VSWR = 50 through all phases) up to 45 W (P.E.P.) under the following conditions:
VCE= 50 V; f1= 28,000 MHz; f2= 28,001 MHz; Th= 70°C; R
th mb-h
= 0,3 K/W.
August 1986 9
Page 10
Philips Semiconductors Product specification
30
handbook, halfpage
G
p
(dB)
20
10
0
11010
VCE= 50 V; I
=25°C; ZL= 16 .
T
h
= 50 mA; PL= 60 W;
C(ZS)
f (MHz)
Fig.13 Power gain as a function of frequency.
MGP477
2
20
handbook, halfpage
r
, x
i
i
()
10
0
10 11010
VCE= 50 V; I
=25°C; ZL= 16 .
T
h
= 50 mA; PL= 60 W;
C(ZS)
r
i
x
i
MGP478
f (MHz)
Fig.14 Input impedance (series components) as
a function of frequency.
2
Figs 13 and 14 are typical curves and hold for an unneutralized amplifier in s.s.b. class-AB operation.
August 1986 10
Page 11
Philips Semiconductors Product specification
PACKAGE OUTLINE
Flanged ceramic package; 2 mounting holes; 4 leads SOT123A
D
A
F
H
α
1
H
q
U
1
L
C
B
w
M
C
2
b
43
p
2
0 5 10 mm
scale
A
U
2
w
M
AB
1
c
U
3
Q
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
5.82
5.56
c
Db
9.73
0.18
9.47
0.10
0.397
0.383
0.007
0.004
IEC JEDEC EIAJ
0.373
0.371
D
9.63
9.42
F
1
2.72
20.71
2.31
19.93
0.815
0.107
0.091
0.221
0.785
0.203
REFERENCES
5.61
5.16
pH
3.33
3.04
0.131
0.120
Q
4.63
4.11
0.182
0.162
q
18.42
0.725
U
1
25.15
24.38
0.99
0.96
U2U
6.61
6.09
0.26
0.24
PROJECTION
w
3
9.78
9.39
0.385
0.370
EUROPEAN
1
UNIT
inches
A
7.47
mm
6.37
0.229
0.294
0.219
0.251
OUTLINE
VERSION
SOT123A 97-06-28
August 1986 11
w
2
1.020.51
0.040.02
ISSUE DATE
αL
45°
Page 12
Philips Semiconductors Product specification
DEFINITIONS
Data Sheet Status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
August 1986 12
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