• Emitter-ballasting resistors for an
optimum temperature profile
• Excellent reliability
• Withstands full load mismatch.
DESCRIPTION
NPN silicon planar epitaxial transistor
encapsulated in a 4-lead
3
⁄8inch
SOT120 capstan envelope with a
ceramic cap. It is designed for
common emitter, class-B operation
mobile VHF transmitters with a supply
voltage of 12.5 V. All leads are
isolated from the stud.
PINNING - SOT120
PINDESCRIPTION
1collector
2emitter
3base
4emitter
QUICK REFERENCE DATA
RF performance at T
MODE OF
OPERATION
= 25 °C in a common emitter test circuit.
mb
f
(MHz)
V
(V)
CE
P
(W)
L
G
P
(dB)
η
(%)
c.w. class-B17512.530> 10> 55
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided
that the BeO disc is not damaged. All persons who handle, use or dispose of
this product should be aware of its nature and of the necessary safety
precautions. After use, dispose of as chemical or special waste according to
the regulations applying at the location of the user. It must never be thrown
out with the general or domestic waste.
PIN CONFIGURATION
alfpage
4
31
handbook, halfpage
b
c
C
MBB012
2
MSB056
Fig.1 Simplified outline and symbol.
e
September 19912
Page 3
Philips SemiconductorsProduct specification
VHF power transistorBLW30
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
CBO
V
CEO
V
EBO
I
C,IC(AV)
I
CM
P
tot
T
stg
T
j
collector-base voltageopen emitter−36V
collector-emitter voltageopen base−16V
emitter-base voltageopen collector−3V
collector currentDC or average value−6A
collector currentpeak value
−18A
f > 1 MHz
total power dissipationRF operation;
−100W
f > 1 MHz;
Tmb=25°C
storage temperature range−65150°C
junction operating temperature−200°C
120
handbook, halfpage
P
tot
(W)
100
II
80
60
40
20
0
(I) Continuous RF operation (f> 1 MHz).
(II) Shorttime operation during mismatch
(f > 1 MHz).
I
020406080100120
Fig.2 Power/temperature derating curve.
MRA382
o
T ( C)
h
THERMAL RESISTANCE
SYMBOLPARAMETERCONDITIONSMAX.UNIT
R
th j-mb(RF)
from junction to mounting baseP
= 100 W;
tot
1.75K/W
Tmb=25°C
R
th mb-h
from mounting base to heatsink0.45K/W
September 19913
Page 4
Philips SemiconductorsProduct specification
VHF power transistorBLW30
CHARACTERISTICS
T
= 25 °C.
j
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
I
CES
h
FE
f
T
C
c
C
re
C
c-s
collector-base breakdown voltageopen emitter;
Ic= 10 mA
collector-emitter breakdown voltageopen base;
Ic= 25 mA
emitter-base breakdown voltageopen collector;
IE= 2 mA
collector-emitter leakage currentVBE=0;
VCE= 16 V
DC current gainVCE=5 V;
IC=4 A
transition frequencyVCE= 12.5 V;
IE= 4 A;
f = 500 MHz
collector capacitanceVCB= 12.5 V;
IE=Ie=0;
f = 1 MHz
feedback capacitanceVCE= 12.5 V;
IC=0;
f = 1 MHz
collector-stud capacitancef = 1 MHz−2−pF
36−−V
16−−V
3−−V
−−10mA
2535−
−1.6−GHz
−90100pF
−6070pF
VCE=
12.5 V
I (A)
C
MRA378
50
handbook, halfpage
h
FE
40
30
20
10
0
0481216
V = 5 V
CE
Fig.3DC current gain as a function of collector
current, typical values.
250
handbook, halfpage
C
c
(pF)
200
150
100
50
0
0481216
IE=ie= 0; f = 1 MHz.
V (V)
Fig.4Collector capacitance as a function of
collector-base voltage, typical values.
MRA374.1
CB
September 19914
Page 5
Philips SemiconductorsProduct specification
VHF power transistorBLW30
handbook, halfpage
2
f
T
(GHz)
1.5
1
0.5
0
0246810
VCB= 12.5 V.
MRA375
I (A)
E
Fig.5Transition frequency as a function of emitter
current, typical values.
September 19915
Page 6
Philips SemiconductorsProduct specification
VHF power transistorBLW30
APPLICATION INFORMATION
RF performance at T
=25°C in a common emitter test circuit.
mb
MODE OF OPERATION
f
(MHz)
V
CE
(V)
P
(W)
L
c.w. class-B17512.530> 10
typ. 11
16
handbook, halfpage
G
P
(dB)(%)
12
8
4
0
10203040
G
P
η
MRA376
(W)P
L
80
η
60
40
20
0
50
handbook, halfpage
P
L
(W)
40
30
20
10
0
0123456
G
P
(dB)
> 55
typ. 60
MRA381
PIN(W)
η
(%)
C
Class-B operation; VCE= 12.5 V; f = 175 MHz.
Fig.6Gain and efficiency as functions of load
power, typical values.
Class-B operation; VCE= 12.5 V; f = 175 MHz.
Fig.7Load power as a function of drive power,
typical values.
Ruggedness in class-B operation
The BLW30 is capable of withstanding a full load mismatch
corresponding to VSWR = 50:1 through all phases at rated
output power, up to a supply voltage of 15.5 V, and f =
175 MHz.
September 19916
Page 7
Philips SemiconductorsProduct specification
VHF power transistorBLW30
handbook, full pagewidth
50 Ω
C1
C2
C3a
L1
L2
R1
T.U.T.
L4
C3b
L3
L5
L6
C4
+V
C5
L7
CC
C6
L8
R2
50 Ω
C7
MGP427
Fig.8 Class-B test circuit at f = 175 MHz.
List of components (see test circuit)
COMPONENTDESCRIPTIONVALUEDIMENSIONSCATALOGUE NO.
C1film dielectric trimmer2.5 to 20 pF2222 809 07004
C2, C7film dielectric trimmer4 to 40 pF2222 809 07008
C3a, C3b500 V ceramic capacitor47 pF
C4ceramic capacitor120 pF
C5polyester capacitor100 nF
C6film dielectric trimmer7 to 100 pF2222 809 07015
L1
1
⁄2turn enamelled 1.6 mm copper wireint. dia. 6 mm;
leads 2 × 5 mm
L81 turn enamelled 1.6 mm copper wireint. dia. 6 mm;
leads 2 × 5 mm
R1, R20.25 W carbon resistor10 Ω, 5%
Notes
1. The striplines are on a double copper-clad printed circuit board, with epoxy fibre-glass dielectric, thickness
2. Taps for capacitors C3a and C3b are situated 5 mm from the transistor.
September 19917
1
⁄16inch.
Page 8
Philips SemiconductorsProduct specification
VHF power transistorBLW30
150
handbook, full pagewidth
72
L3
R1
C3a
L2
C1C2L1
The circuit and components are situated on one side of an epoxy fibre-glass board; the other side is unetched
and serves as a ground plane. Earth connections are made by means of hollow rivets and copper straps under
the emitters, to provide a direct contact between the component side and the ground plane.
L4L5
C3b
C4
L6
rivet
L7
+V
C5R2
C6
L8
Fig.9 Component layout for 175 MHz class-B test circuit.
CC
C7
MGP428
September 19918
Page 9
Philips SemiconductorsProduct specification
VHF power transistorBLW30
handbook, halfpage
3
Z
i
(Ω)
2
r
i
1
0
100150200250
Class-B operation; VCE= 12.5 V; PL= 30 W.
x
i
MRA379
f (MHz)
Fig.10 Input impedance (series components) as a
function of frequency, typical values.
handbook, halfpage
4
Z
L
(Ω)
3
2
1
0
-1
-2
100150200250
Class-B operation; VCE= 12.5 V; PL= 30 W.
R
L
X
L
MRA380
f (MHz)
Fig.11 Load impedance (series components) as a
function of frequency, typical values.
handbook, halfpage
Z
i
Z
L
Fig.12 Definition of transistor impedance.
MBA451
handbook, halfpage
G
P
(dB)
15
10
5
0
100150200250
Class-B operation; VCE= 12.5 V; PL= 30 W.
f (MHz)
Fig.13 Power gain as a function of frequency,
typical values.
MRA377
September 19919
Page 10
Philips SemiconductorsProduct specification
VHF power transistorBLW30
PACKAGE OUTLINE
Studded ceramic package; 4 leadsSOT120A
D
A
Q
c
D
N
1
N
N
3
L
H
1
1
D
2
H
b
4
A
w
A
M
1
X
3
2
M
M
1
detail X
W
0510 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
5.90
5.48
c
Db
9.73
0.18
9.47
0.14
0.383
0.007
0.373
0.004
IEC JEDEC EIAJ
D
8.39
8.12
0.330
0.320
D
2
1
9.66
27.44
9.39
25.78
1.080
0.380
0.370
0.354
1.015
0.315
REFERENCES
L
9.00
8.00
MH
3.41
2.92
0.134
0.115
0.065
0.055
UNIT
mm
inches
AW
5.97
4.74
0.232
0.283
0.216
0.248
OUTLINE
VERSION
SOT120A
September 199110
M
1.66
1.39
8-32
UNC
w
1
0.38
0.015
ISSUE DATE
97-06-28
N
N
1
12.83
11.17
0.505
0.440
1
1.60
0.00
0.063
0.000
N
3
3.31
2.54
0.130
0.100
Q
4.35
3.98
0.171
0.157
EUROPEAN
PROJECTION
Page 11
Philips SemiconductorsProduct specification
VHF power transistorBLW30
DEFINITIONS
Data Sheet Status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
September 199111
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