Datasheet BLV910-P Datasheet (Philips)

Page 1
DATA SH EET
Product specification
1995 Apr 11
DISCRETE SEMICONDUCTORS
Philips Semiconductors
BLV910
UHF power transistor
Page 2
Philips Semiconductors Product specification
UHF power transistor BLV910
FEATURES
Internal input matching to achieve high power gain and easy design of wideband circuits
Emitter ballasting resistors for an optimum temperature profile
Gold metallization ensures excellent reliability.
APPLICATIONS
Base station transmitters in the 820 to 960 MHz range.
DESCRIPTION
NPN silicon planar epitaxial transistor intended for common emitter class-AB operation. The transistor is encapsulated in a 6-lead SOT171 flange envelope with a ceramic cap. All leads are isolated from the flange.
PINNING - SOT171
PIN SYMBOL DESCRIPTION
1 e emitter 2 e emitter 3 b base 4 c collector 5 e emitter 6 e emitter
Fig.1 Simplified outline and symbol.
handbook, halfpage
MAM141
Top view
e
c
b
12345
6
QUICK REFERENCE DATA
RF performance at T
mb
= 25 °C in a common emitter test circuit.
MODE OF OPERATION
f
(MHz)
V
CE
(V)
P
L
(W)
G
p
(dB)
η
C
(%)
CW, class-AB 960 26 10 11 55
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste.
Page 3
Philips Semiconductors Product specification
UHF power transistor BLV910
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
collector-base voltage open emitter 70 V
V
CEO
collector-emitter voltage open base 30 V
V
EBO
emitter-base voltage open collector 3V
I
C
collector current (DC) 1.5 A
I
C(AV)
average collector current 1.5 A
P
tot
total power dissipation up to Tmb=25°C 30 W
T
stg
storage temperature 65 +150 °C
T
j
operating junction temperature 200 °C
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-mb
thermal resistance from junction to mounting base
P
tot
= 30 W; Tmb=25°C 5.85 K/W
R
th mb-h
thermal resistance from mounting base to heatsink
0.4 K/W
Fig.2 DC SOAR.
(1) Tmb=25°C. (2) Th=70°C.
handbook, halfpage
10
1
10
11010
I
C
(A)
VCE(V)
(1)
MLC658
2
1
(2)
Fig.3 Power derating curves.
(1) Continuous operation. (2) Short-time operation during mismatch.
handbook, halfpage
0
10
20
30
40
0 20 40 60 80 100 120 140
T ( C)
o
h
P
tot
(W)
(2)
MLC659
(1)
Page 4
Philips Semiconductors Product specification
UHF power transistor BLV910
CHARACTERISTICS
T
j
=25°C unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)CBO
collector-base breakdown voltage
open emitter; IC= 5 mA 70 −−V
V
(BR)CEO
collector-emitter breakdown voltage
open base; IC=15mA 30 −−V
V
(BR)EBO
emitter-base breakdown voltage
open collector; IE= 0.3 mA 3 −−V
I
CES
collector leakage current VBE= 0; VCE=28V −−0.75 mA
h
FE
DC current gain VCE= 10 V; IC= 0.5 A; 30 120
C
c
collector capacitance VCB= 26 V; IE=ie= 0; f = 1 MHz 10 pF
C
re
feedback capacitance VCE= 26 V; IC= 0; f = 1 MHz 6 pF
Fig.4 DC current gainas a function of collector
current; typical values.
(1) VCE= 26 V: measured under pulsed conditions;
t
p
500 µs; δ<0.01.
(2) VCE=10V.
handbook, halfpage
0
40
60
20
80
100
0 0.5 1.0 1.5 2.0 2.5
h
FE
IC(A)
MLC660
(1)
(2)
Fig.5 Collector capacitance as a function of
collector-base voltage; typical values.
IE=ie= 0; f = 1 MHz.
handbook, halfpage
0
10
40
30
20
01020304050
(pF)
C
c
VCB(V)
MLC661
Page 5
Philips Semiconductors Product specification
UHF power transistor BLV910
APPLICATION INFORMATION
RF performance at T
h
=25°C in a common emitter, class-AB test circuit.
Ruggedness in class-AB operation
The BLV910 is capable of withstanding a load mismatch corresponding to VSWR = 20 : 1 through all phases at rated output power, under the following conditions: V
CE
= 26 V; f = 960 MHz; ICQ= 25 mA; Tmb=25°C.
MODE OF OPERATION
f
(MHz)
V
CE
(V)
I
CQ
(mA)
P
L
(W)
G
p
(dB)
η
C
(%)
CW, class-AB 960 26 25 10 11 55
Fig.6 Power gain and efficiency as functions of
load power; typical values.
VCE=26V. ICQ=25mA. f = 960 MHz.
handbook, halfpage
048 16
0
MLC662
12
16
8
P (W)
L
80
40
60
20
0
4
12
η
(%)
η
G
p
(dB)
G
p
VCE=26V. ICQ=25mA. f = 960 MHz.
Fig.7 Load power as a function of input power;
typical values.
handbook, halfpage
0 0.4 0.8 1.61.2
16
12
4
0
8
MLC663
P
L
(W)
P (W)
i
Page 6
Philips Semiconductors Product specification
UHF power transistor BLV910
List of components (see Figs 8 and 9)
COMPONENT DESCRIPTION VALUE DIMENSIONS CATALOGUE No.
C1, C13 multilayer ceramic chip
capacitor; note 1
43 pF
C2, C3, C11, C12 film dielectric trimmer 1.4 pF to 5.5 pF 2222 809 09001 C4, C5 multilayer ceramic chip
capacitor; note 2
10 pF
C6 multilayer ceramic chip
capacitor; note 1
150 pF
C7, C16 ceramic capacitor 22 nF 2222 640 08223 C8, C19 solid aluminium capacitor 10 µF, 63 V 2222 030 38109 C14 multilayer ceramic chip
capacitor; note 1
20 pF
C9, C10 multilayer ceramic chip
capacitor; note 2
8.2 pF
C17 multilayer ceramic chip
capacitor; note 1
220 pF
C15, C18 multilayer ceramic chip
capacitor; note 1
62 pF
L1 stripline; note 3 50 length 17 mm
width 2.4 mm
L2, L3 stripline; note 3 50 length 14 mm
width 2.4 mm
L4 stripline; note 3 43 length 4 mm
width 3 mm
Fig.8 Class-AB test circuit at f = 960 MHz.
handbook, full pagewidth
MLC664
R1
L13
R2
L14
C7
C2 C3 C4 C11 C12C9
C8
C1 C13
C18C6
C5 C10
C15C14 C17
,,,,,
L1 L2 L3
L12
L11
L4
L8 L9 L10
L5 L6 L7 input 50
output
50
V
B
C16 C19
V
CC
DUT
Page 7
Philips Semiconductors Product specification
UHF power transistor BLV910
Notes
1. American Technical Ceramics type 100B or capacitor of same quality.
2. American Technical Ceramics type 100A or capacitor of same quality.
3. The striplines are on double-clad PCB with PTFE fibre-glass dielectric (εr= 2.2); thickness1⁄32".
L5, L6 stripline; note 3 43 length 3 mm
width 3 mm
L7 stripline; note 3 43 length 3.4 mm
width 3 mm
L8 stripline; note 3 50 length 6.3 mm
width 2.4 mm
L9 stripline; note 3 50 length 18 mm
width 2.4 mm
L10 stripline; note 3 50 length 15 mm
width 2.4 mm
L11 4 turns enamelled 0.8 mm
copper wire
int. diameter 4mm length 5 mm leads 2 × 5mm
L12 3 turns enamelled 0.8 mm
copper wire
int. diameter 3mm length 5 mm leads 2 × 5mm
L13, L14 grade 3B Ferroxcube
wideband RF choke
4312 020 36642
R1, R2 metal film resistor 10 Ω, 0.4 W 2322 151 71009
COMPONENT DESCRIPTION VALUE DIMENSIONS CATALOGUE No.
Page 8
Philips Semiconductors Product specification
UHF power transistor BLV910
Fig.9 Component layout for 960 MHz class-AB test circuit.
Dimensions in mm. The components are located on one side of the PTFE fibre-glass board, the other side being fully metallized to serve as an earth. Earth connections
are made by fixing screws, hollow rivets and copper straps around the board and under the emitters to provide a direct contact between the component side and the ground plane.
handbook, full pagewidth
MLC665
rivets
rivets
rivets
copper straps
copper straps
rivets
copper straps
copper straps
122
70
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
C11
C12
C13
C14
C15
C16
L1 L2 L3 L4 L5 L6 L7
L8
L9 L10
L11
L12
L13
L14
R1
R2
C17
C18
C19
Page 9
Philips Semiconductors Product specification
UHF power transistor BLV910
Fig.10 Input impedance as a function of frequency
(series components); typical values.
VCE=26V. ICQ=25mA. Tmb=25°C. PL=10W.
handbook, halfpage
800 840 880 1000
10
0
8
MLC666
920 960
6
4
2
Z
i
()
f (MHz)
x
i
r
i
Fig.11 Load impedance as a function of frequency
(series components); typical values.
VCE=26V. ICQ=25mA. Tmb=25°C. PL=10W.
handbook, halfpage
800 840 880 920 1000
10
0
8
MLC667
960
6
4
2
Z
L
()
f (MHz)
R
L
X
L
Fig.12 Power gain as a function of frequency;
typical values.
VCE=26V. ICQ=25mA. Tmb=25°C. PL=10W.
handbook, halfpage
800 840 880 920 1000
10
MLC668
960
13
12
11
G
f (MHz)
p
(dB)
Fig.13 Definition of transistor impedance.
handbook, halfpage
MBA451
Z
i
Z
L
Page 10
1995 Apr 11 10
Philips Semiconductors Product specification
UHF power transistor BLV910
PACKAGE OUTLINE
Fig.14 SOT171.
Dimensions in mm. Torque on screw: min. 0.6 Nm; max. 0.75 Nm. Recommended screw: cheese-head 4-40 UNC/2A. Heatsink compound must be applied sparingly and evenly distributed.
handbook, full pagewidth
MBC828 - 1
1 3
5
6
4
2
1 (2x)
2.25
1.85
(2x)
3.25
2.85
9.15
2.25 min
5.85
11.5
10.5
3.45
3.15
(2x)
2.8
6 max
0.14
4.50
4.05
7.0
max
18.42
25.2 max
9.3
max
Page 11
1995 Apr 11 11
Philips Semiconductors Product specification
UHF power transistor BLV910
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
Data Sheet Status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Page 12
Philips Semiconductors
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Philips Semiconductors
Philips Semiconductors – a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428)
BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. (02)805 4455, Fax. (02)805 4466
Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213,
Tel. (01)60 101-1236, Fax. (01)60 101-1211
Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands,
Tel. (31)40 783 749, Fax. (31)40 788 399
Brazil: Rua do Rocio 220 - 5
th
floor, Suite 51, CEP: 04552-903-SÃO PAULO-SP, Brazil. P.O. Box 7383 (01064-970). Tel. (011)821-2333, Fax. (011)829-1849
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS:
Tel. (800) 234-7381, Fax. (708) 296-8556
Chile: Av. Santa Maria 0760, SANTIAGO,
Tel. (02)773 816, Fax. (02)777 6730
Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17,
77621 BOGOTA, Tel. (571)249 7624/(571)217 4609, Fax. (571)217 4549
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Tel. (032)88 2636, Fax. (031)57 1949
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Ireland: Newstead, Clonskeagh, DUBLIN 14,
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Piazza IV Novembre 3, 20124 MILANO, Tel. (0039)2 6752 2531, Fax. (0039)2 6752 2557
Japan: Philips Bldg13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
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SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880
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Tel. 9-5(800)234-7381, Fax. (708)296-8556
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB
Tel. (040)783749, Fax. (040)788399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. (09)849-4160, Fax. (09)849-7811
Norway: Box 1, Manglerud 0612, OSLO,
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Tel. (03)301 6312, Fax. (03)301 42 43
Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM,
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Tel. (0212)279 27 70, Fax. (0212)282 67 07
United Kingdom: Philips Semiconductors LTD.,
276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. (0181)730-5000, Fax. (0181)754-8421
United States:811 East Arques Avenue, SUNNYVALE,
CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556
Uruguay: Coronel Mora 433, MONTEVIDEO,
Tel. (02)70-4044, Fax. (02)92 0601
Internet: http://www.semiconductors.philips.com/ps/ For all other countries apply to: Philips Semiconductors,
International Marketing and Sales, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Telex 35000 phtcnl, Fax. +31-40-724825
SCD38 © Philips Electronics N.V. 1995
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123052/1500/01/pp12 Date of release: 1995 Apr 11 Document order number: 9397 750 00072
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