The transistor has a1⁄2in 6-lead
flange envelope with a ceramic cap.
All leads are isolated from the flange.
QUICK REFERENCE DATA
R.F. performance up to T
MODE OPERATION
=25°C in an unneutralized common-emitter class-B circuit.
h
V
CE
V
f
MHz
P
W
L
P
S
W
G
dB
p
narrow band; c.w.28108175< 17,5> 10,0> 65
PIN CONFIGURATION
PINNING
PINDESCRIPTION
1emitter
handbook, halfpage
1
2
2emitter
3base
3
4
4collector
5emitter
6emitter
65
η
%
MSB006
Fig.1 Simplified outline, SOT119A.
PRODUCT SAFETY This device incorporates beryllium oxide, the dust of which is toxic. The device is entirely
safe provided that the BeO disc is not damaged.
August 19862
Page 3
Philips SemiconductorsProduct specification
VHF power transistorBLV25
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Collector-emitter voltage
(peak value); V
open baseV
Emitter-base voltage (open collector)V
Collector current
d.c. or averageI
(peak value); f > 1 MHzI
Total power dissipation at T
R.F. power dissipation (f > 1 MHz); T
R.F. power dissipation (f > 1 MHz); T
Storage temperatureT
Operating junction temperatureT
=0V
BE
=25°CP
mb
=25°CP
mb
=70°CP
h
CESM
CEO
EBO
; I
C
C(AV)
CM
tot (d.c.)
tot (r.f.)
tot (r.f.)
stg
j
max.65 V
max.33 V
max.4 V
max.17, 5 A
max.35 A
max.220 W
max.270 W
max.146 W
−65to+150 °C
max.200 °C
2
10
handbook, halfpage
I
C
(A)
10
1
11010
(1) Second breakdown limit.
Tmb = 25 °C
Th = 70 °C
Fig.2 D.C. SOAR.
(1)
VCE (V)
MGP294
2
300
handbook, halfpage
P
tot
(W)
200
100
0
0100
I Continuous d.c. operation
II Continuous r.f. operation (f > 1 MHz)
III Short-time operation during mismatch; (f > 1 MHz).
ΙΙΙ
ΙΙ
Ι
50
Th (°C)
Fig.3 Power derating curves vs. temperature.
MGP295
THERMAL RESISTANCE
(dissipation = 150 W; T
=72°C, i.e. Th=42°C)
mb
From junction to mounting base (d.c. dissipation)R
From junction to mounting base (r.f. dissipation)R
From mounting base to heatsinkR
August 19863
th j-mb(dc)
th j-mb(rf)
th mb-h
max0,85 K/W
max0,60 K/W
max0,2 K/W
Page 4
Philips SemiconductorsProduct specification
VHF power transistorBLV25
CHARACTERISTICS
T
=25°C
j
Collector-emitter breakdown voltage
V
=0;IC=50mAV
BE
open base; I
= 200 mAV
C
Emitter-base breakdown voltage
open collector; I
=20mAV
E
Collector cut-off current
VBE=0;VCE= 33 VI
Second breakdown energy; L = 25 mH; f = 50 Hz
open baseE
R
=10ΩE
BE
D.C. current gain
(1)
IC= 8,5 A; VCE=25Vh
Collector-emitter saturation voltage
(1)
IC= 20 A; IB= 4,0 AV
Transition frequency at f = 100 MHz
(2)
−IE= 8,5 A; VCB=25Vf
−I
= 20 A; VCB=25Vf
E
Collector capacitance at f = 1 MHz
I
= 0; VCB=25VC
E=Ie
Feedback capacitance at f=1MHz
IC= 100 mA; VCE=25VC
Collector-flange capacitanceC
(BR)CES
(BR)CEO
(BR)EBO
CES
SBO
SBR
FE
CEsat
T
T
c
re
cf
>65 V
>33 V
>4V
<25 mA
>20 mJ
>20 mJ
typ.50
15 to 100
typ.1,6 V
typ.600 MHz
typ.600 MHz
typ.275 pF
typ.155 pF
typ.3 pF
Notes
1. Measured under pulse conditions: t
≤ 300 µs; δ≤0,02.
p
2. Measured under pulse conditions: tp≤ 50 µs; δ≤0,01.
August 19864
Page 5
Philips SemiconductorsProduct specification
VHF power transistorBLV25
80
handbook, halfpage
h
FE
40
0
0
typ
10
IC (A)
Fig.4 VCE= 25 V; Tj=25°C.
MGP296
800
handbook, halfpage
f
T
(MHz)
400
20
0
01030
typ
20
MGP297
−IE (A)
Fig.5 VCB= 25 V; f = 100 MHz; Tj=25°C.
600
handbook, halfpage
C
c
(pF)
300
0
0102030
typ
MGP298
VCB (V)
Fig.6 IE=Ie= 0; f = 1 MHz; Tj=25°C.
August 19865
Page 6
Philips SemiconductorsProduct specification
VHF power transistorBLV25
APPLICATION INFORMATION
R.F. performance in narrow band c.w. operation (common-emitter class-B circuit) T
are placed 7 mm from transistor edge
C8 = C10 = 470 pF multilayer ceramic chip capacitor (cat. no. 2222 856 13471)
C9 = C15 = 40 pF, parallel connection of 4 x 10 pF lead feed-through capacitors (cat. no. 2222 702 05109)
C11 = 100 nF multilayer ceramic chip capacitor (cat. no. 2222 852 59104)
C12 = C16 = 7 to 47 pF precision tuning capacitor (cat. no. 2222 805 00174)
C13 = 19 pF, parallel connection of 4 x 4,7 pF lead feed-through capacitors (cat. no. 2222 702 04478)
C14 = 6,8 µF/63 V electrolytic capacitor
η
%
CC
L1 = Cu strip (10 mm × 4 mm × 0,5 mm)
L2 = strip on printed-circuit board
L3 = 7 turns closely wound enamelled Cu wire (0,3 mm); int. dia. 3,0 mm; leads 2 × 6 mm
L4 = L8 = L9 = Ferroxcube wide-band h.f. choke, grade 3B (cat. no. 4312 020 36640)
L5 = 3 turns enamelled Cu wire (1,6 mm); int. dia. 8 mm; length 9 mm; leads 2 × 5 mm
L6 = Cu strip (27 mm × 9 mm × 0,5 mm)
L7 = 2 turns enamelled Cu wire (1,6 mm); int. dia. 8 mm; length 9 mm; leads 2 × 10 mm
L2 is strip on a double Cu-clad printed-circuit board with epoxy fibre-glass dielectric, thickness 1/16 in.
R1 = 10 Ω carbon resistor
Note
1. ATC means American Technical Ceramics.
August 19866
Page 7
Philips SemiconductorsProduct specification
VHF power transistorBLV25
270
80
C8
L4
C2
The circuit and the components are on one side of the epoxy fibre-glass board, the other side is unetched copper to serve as a
ground-plane. Earth connections are made by means of fixing screws. Additionally copper straps are used under the emitters and
at the input and output to provide direct contact between the copper on the component side and the ground-plane.
L3
L1
L2
C6, C7
C3C1
R1
C4, C5
7 mm
C10
C11
+V
CC
L7
L5
L8, L9
L6
C9
strip
C13
strip
stop
strip
C12
C15
stop
C16
Fig.8 Component layout and printed-circuit board for 108 MHz class-B test circuit.
strip
MGP300
August 19867
Page 8
Philips SemiconductorsProduct specification
VHF power transistorBLV25
200
handbook, halfpage
P
L
(W)
100
0
11010
——— f > 1 MHz (continuous);
− − − − short time operation during mismatch (f > 1 MHz).
Th =
25 °C
50 °C
70 °C
25 °C
50 °C
70 °C
VSWR
Fig.9 R.F. SOAR.
MGP301
2
250
handbook, halfpage
P
L
(W)
200
150
100
50
0
0102030
Test circuit tuned for each power level; typical values;
= 28 V; f = 108 MHz; Th=25°C; class-B operation.
V
CE
MGP302
PS (W)
Fig.10 Load power as a function of source power.
16
handbook, halfpage
G
p
(dB)
12
8
4
0
0100200 300
Test circuit tuned for each power level; typical values;
= 28 V; f = 108 MHz; Th=25°C; class-B operation.
V
CE
η
G
p
MGP303
PL (W)
Fig.11 Power gain and efficiency as a function of
source power.
80
60
40
20
0
(%)
handbook, halfpage
η
1
ri, x
i
(Ω)
r
0.5
0
−0.5
−1
20
Typical values; VCE= 28 V; PL= 175 W;
=25°C; class-B operation.
T
h
i
x
i
70
f (MHz)
MGP304
120
Fig.12 Input impedance (series components).
August 19868
Page 9
Philips SemiconductorsProduct specification
VHF power transistorBLV25
handbook, halfpage
3
RL, X
L
(Ω)
2
1
0
20
Typical values; VCE= 28 V; PL= 175 W;
=25°C; class-B operation.
T
h
R
X
70
L
L
f (MHz)
Fig.13 Load impedance (series components).
MGP305
120
20
handbook, halfpage
G
p
(dB)
10
0
20120
Typical values; VCE= 28 V; PL= 175 W;
=25°C; class-B operation.
T
h
70
f (MHz)
Fig.14 Power gain as a function of frequency.
MGP306
OPERATING NOTE for Figs 12, 13 and 14:
Below 50 MHz a base-emitter resistor of 4,7 Ω is
recommended to avoid oscillation. This resistor must be
effective for r.f. only.
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
A
UNIT
7.39
mm
6.32
0.291
inches
0.249
OUTLINE
VERSION
SOT119A97-06-28
5.59
5.33
0.220
0.210
b
1
5.34
5.08
0.210
0.200
c
0.18
0.07
0.007
0.003
Db
12.86
12.59
0.505
0.496
FH
eU
D
1
12.83
12.57
0.505
0.255
0.495
REFERENCES
6.48
2.54
2.28
0.100
0.090
22.10
21.08
0.870
0.830
b
2
4.07
3.81
0.160
0.150
IEC JEDEC EIAJ
H
18.55
18.28
0.730
0.720
qw
p
3.31
2.97
0.130
0.117
Q
4.58
3.98
0.180
0.157
1
U
1
6.48
25.23
6.07
23.95
0.255
0.993
0.239
0.943
EUROPEAN
PROJECTION
2
12.76
12.06
0.502
0.475
August 198610
U
3
w
1
2
0.5118.42
0.020.7250.010.04
ISSUE DATE
w
3
0.261.02
Page 11
Philips SemiconductorsProduct specification
VHF power transistorBLV25
DEFINITIONS
Data Sheet Status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
August 198611
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.