Datasheet BLV2045N Datasheet (Philips)

Page 1
DISCRETE SEMICONDUCTORS
DATA SH EET
M3D171
BLV2045N
UHF power transistor
Preliminary specification
1999 Apr 23
Page 2
Philips Semiconductors Preliminary specification
UHF power transistor BLV2045N
FEATURES
Emitter ballasting resistors for optimum temperature profile
Gold metallization ensures excellent reliability
Internal input and output matc hing fo r an easy design of
wideband circuits.
APPLICATIONS
PINNING - SOT390A
PIN SYMBOL DESCRIPTION
1 c collector 2bbase 3 e emitter, connected to flange
handbook, halfpage
1
Common emitter class-AB operation in PCN and PCS applications in the 1800 to 2000 MHz frequency range.
2
3
DESCRIPTION
NPN silicon planar UHF power transistor in a 2-lead
Top view
MSA470
SOT390A flange package with a ceramic ca p. The emitter is connected to the flange.
Fig.1 Simplified outline.
QUICK REFERENCE DATA
RF performance at T
MODE OF
OPERATION
=25°C in a common emitter test circuit.
h
f
(MHz)
V
(V)
CE
P
(W)
L
G
p
(dB)
η
(%)
C
CW, class-AB 1990 26 35 typ. 9.5 typ. 43
2-tone, class-AB f
= 1990.0; f2= 1990.1 26 35 (PEP) 9.5 33 ≤−30
1
d
im
(dBc)
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
EBO
I
C
I
C(AV)
P
tot
T
stg
T
j
collector-base voltage open emitter 65 V collector-emitter voltage open base 27 V emitter-base voltage open collector 3V collector current (DC) 4A average collector current 4A total power dissipation Tmb=25°C 125 W storage temperature −65 +150 °C operating junction temperature 200 °C
WARNING
Product and environmental safety - toxic materials. This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged.
All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste.
Page 3
Philips Semiconductors Preliminary specification
UHF power transistor BLV2045N
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-mb
R
th mb-h
CHARACTERISTICS
=25°C unless otherwise specified.
T
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
I
CES
h
FE
C
c
C
re
thermal resistance from junction to
PL=35W; ηC= 40 %; Tmb=25°C1.4K/W
mounting base thermal resistance from mounting
0.4 K/W
base to heatsink
collector-base breakdown
open emitter; IC=20mA 65 −−V
voltage collector-emitter breakdown
open base; IC=60mA 27 −−V
voltage emitter-base breakdown
open collector; IE=40mA 3 −−V
voltage collector leakage current VCE=26V; VBE=0 −−4mA DC current gain VCE=10V; IC=2A 45 100 collector capacitance VCB=26V; IE=ie=0;
t.b.f. pF
f = 1 MHz; note 1
feedback capac itanc e VCE=26V; IC= 0;
t.b.f. pF
f=1MHz
Note
1. Capacitance of die only.
APPLICATION INFORMATION
RF performance at T
MODE OF
OPERATION
=25°C in a common emitter test circuit.
h
f
(MHz)
V
(V)
CE
I
CQ
(mA)
P
(W)
L
G
p
(dB)
η
(%)
C
d
im
(dBc)
CW, class-AB 1990 26 150 35 typ. 9.5 typ. 43
2-tone, class-AB
= 1990.0; f2= 1990.1
f
1
26 150 35 (PEP)
9.5
typ. 10.2
33
typ. 35
≤−30
typ. 32
Ruggedness in class-AB operation
The BLV2045N is capable of with standi ng a load mismatch correspon ding to VSWR = 3 : 1 through all phases under the following conditions: f
= 1990.0 MHz; f2= 1990.1 MHz; VCE= 26 V; ICQ= 150 mA; PL= 35 W (PEP); Tmb=25°C.
1
Page 4
Philips Semiconductors Preliminary specification
UHF power transistor BLV2045N
12
G
P
(dB)
8
4
0
0 10203040
G
P
η
C
P
(W)
L
VCE=26V; ICQ= 150 mA; f = 1990 M Hz.
Fig.2 Power gain and collector efficiency as
functions of load power; typical values.
60
η
C
(%)
50
40
30
20
10
0
12
G
P
(dB)
8
4
0
0 10203040
G
P
η
C
(PEP) (W)
P
L
60
η
C
(%)
50
40
30
20
10
0
VCE=26V; ICQ= 150mA; f1= 1990 MHz;f2=1990.1MHz
Fig.3 Power gain and collector efficiency as
functions of peak envelope load power; typical values.
0
d
im
(dBc)
-20
d
3
-40
-60 0 10203040
d
5
P
(PEP) (W)
L
VCE=26V; ICQ= 150 m A; f1= 1990 MHz; f2= 1990.1 MHz.
Fig.4 Intermodulation distortion as a function of
peak envelope load power; typical values.
Page 5
Philips Semiconductors Preliminary specification
UHF power transistor BLV2045N
Vbb
C1
Vb
L1
R1
R1
C8
C8 C9
C2
C11C10C9
L2
C10
C11
L3
L7
C12
L4
C12
L5
L6
L6
L5
C3
C4
C3
C4
L8
C5
L9
C13
C13
L13
L12
L12
L10
L11
Vcc
C16C15C14
L11
50 OHm output50 OHm input
C7
C6
Vc
C16C15
C14
40 mm
C1
C2
C7
C6
C5
30 mm
Dimensions in mm The components are situated on one side of the copper-clad board, the other side is unetched and serves as a ground plane. Earth connections
from the component side to the ground plane are made by through metallization.
Fig.5 1990 MHz class-AB testcircuit and component layout
30 mm
Page 6
Philips Semiconductors Preliminary specification
UHF power transistor BLV2045N
List of components
COMPONENT DESCRIPTION VALUE DIMENSIONS CATALOGUE NO.
C1 Tekelec variable capacitor; type A T 37281 0.4 to 2.5 pF C2, C7 multilayer ceramic chip capacitor; note 1 30pF C3 multilayer ceramic chip capacitor; note 2 2.4 pF C4 multilayer ceramic chip capacitor; note 2 1.8 pF C5 Tekelec variable capacitor; type A T 37271 0.6 to 4.5 pF C6 multilayer ceramic chip capacitor; note 2 1.3 pF C8, C14 tantal SMD capacitor 35 V; 10 µF C9, C10, C11,
C15, C16 C12, C13 multilayer ceramic chip capacitor; note 2 20 pF L1 stripline; note 3 50 8x1mm L2 stripline; note 3 20.5 2.5x3.5mm L3 stripline; note 3 29.8 5.6x2.1mm L4 stripline; note 3 1 1 2.0x7.4mm L5 stripline; note 3 13.2 7.2x6.0mm L6 5 turns enamelled 1 mm copper wire int. dia. = 3.3 mm;
L7 EMI filter; type NFM61RH20T332 3300 pF L8 stripline; note 3 1 1.5 6.6x7.1mm L9 stripline; note 3 6.9 6.4 x 12.6 mm L10 stripline; note 3 35.8 9.9x1.6mm L1 1 stripline; note 3 14.4 2.7x5.4mm L12 2 turns enamelled 1 mm copper wire int. dia. = 3.3 mm;
L13 EMI filter; type NFM60RH20T152 1500 pF R1 chip resistor 2.2
multilayer ceramic chip capacitor 100 nF
length = 6 mm
length = 2.5 mm
Notes
1. American Technical Ceramics type 100A or capacitor of same quality
2. American Technical Ceramics type 100B or capacitor of same quality
3. The striplines are on a double copper-clad PCB ε
= 6.15; thickness 0.64mm.
r
Page 7
Philips Semiconductors Preliminary specification
UHF power transistor BLV2045N
4
Z
i
(Ω)
r
3
2
1
0
1800 1900 2000
i
x
i
f (MHz)
VCE=26V; ICQ= 150 m A; PL=35W; Tmb=25°C.
Fig.6 Input i mpedance as a functi on of frequency
(series components); typical values.
6
Z
L
(Ω)
4
2
0
-2 1800 1900 2000
Z
L
X
L
f (MHz)
VCE=26V; ICQ= 150mA; PL=35W; Tmb=25°C.
Fig.7 Load i mpedance as a functi on of frequency
(series components); typical values.
12
G
P
(dB)
8
4
0
1800 1900 2000
G
P
η
C
f (MHz)
60
η
C
(%)
50
40
30
20
10
0
book, halfpage
Z
i
Z
MBA451
L
VCE=26V; ICQ= 150 m A; PL=35W; Tmb=25°C.
Fig.8 Power gain and collector efficiency as
functions of frequency; typical values.
Fig.9 Definition of transistor impedance.
Page 8
Philips Semiconductors Preliminary specification
UHF power transistor BLV2045N
PACKAGE OUTLINE
Flanged ceramic package; 2 mounting holes; 2 leads SOT390A
D
A
F
3
D
1
U
1
q
C
1
L
U
2
A
L
p
2
w
scale
M M
2
C
b
0 5 10 mm
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
B
w
M M M
1
E
AB
c
E
1
Q
3.43
3.17
Q
2.32
2.00
0.091
0.079
U
1
19.03
18.77
0.749
0.739
U
w
2
1
6.43
0.2514.22
6.17
0.253
0.0100.560 0.020
0.243
EUROPEAN
PROJECTION
w
2
0.51
ISSUE DATE
UNIT
mm
inches
A
5.03
4.22
0.198
0.225
0.166
0.215
OUTLINE
VERSION
SOT390A 99-03-29
b
5.72
5.46
cD
8.18
0.16
8.08
0.10
0.322
0.318
0.325
0.315
0.006
0.004
IEC JEDEC EIAJ
EFLpq
D
8.26
8.00
1
6.40
6.30
0.252
0.248
E
1
6.43
1.66
6.17
1.39
0.065
0.253
0.055
0.243
REFERENCES
6.10
5.33
0.24
0.21
0.135
0.125
Page 9
Philips Semiconductors Preliminary specification
UHF power transistor BLV2045N
DEFINITIONS
Data Sheet Status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such a pplic ations do so at thei r own ri sk and agree to fully inde mnify Philips for any d amages resulting from such improper use or sale.
Page 10
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Printed in The Netherlands budgetnum/printrun/ed/pp10 Date of release: 1999 Apr 23 Document order number: 9397 750 05828
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