Datasheet BLV20 Datasheet (Philips)

Page 1
DISCRETE SEMICONDUCTORS
DATA SH EET
BLV20
VHF power transistor
Product specification
August 1986
Page 2
Philips Semiconductors Product specification

DESCRIPTION

N-P-N silicon planar epitaxial transistor intended for use in class-A, B and C operated h.f. and v.h.f. transmitters with a nominal supply voltage of 28 V. The transistor is resistance stabilized and is guaranteed to withstand severe load mismatch conditions.
It has a 3/8" flange envelope with a ceramic cap. All leads are isolated from the flange.

PINNING - SOT123

PIN DESCRIPTION
1 collector 2 emitter 3 base 4 emitter

QUICK REFERENCE DATA

R.F. performance up to T
= 25 °C in an unneutralized common-emitter
h
class-B circuit
MODE OF
OPERATION
V
CE
VfMHz
P
W
G
L
p
dB
%
η
z
i
c.w. 28 175 8 > 12 > 65 1,8 + j0,7 18 j20

PIN CONFIGURATION

lfpage
1
23
4
handbook, halfpage
b
MBB012
MSB057
Fig.1 Simplified outline and symbol.
Y
L
mS
c
e
PRODUCT SAFETY This device incorporates beryllium oxide, the dust of which is toxic. The device is entirely safe provided that the BeO disc is not damaged.
August 1986 2
Page 3
Philips Semiconductors Product specification

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)
Collector-emitter voltage (V
peak value v Collector-emitter voltage (open base) V Emitter-base voltage (open collector) V Collector current (average) I Collector current (peak value); f > 1 MHz I R.F. power dissipation (f > 1 MHz); T Storage temperature T Operating junction temperature T
BE
=0)
CESM
CEO
EBO C(AV) CM
=25°CP
mb
rf
stg
j
max. 65 V max. 36 V max. 4 V max. 0,9 A max. 2,5 A max. 20 W
65 to + 150 °C
max. 200 °C
handbook, halfpage
1
I
C
(A)
0.5
0
10 20 30 40
Th = 70 °C
Fig.2 D.C. SOAR.
Tmb = 25 °C
VCE (V)
MGP272
30
handbook, halfpage
P
tot
(W)
20
10
0
0 50 100
I Continuous d.c. operation II Continuous r.f. operation III Short-time operation during mismatch
ΙΙΙ
derate by 0.12 W/K
ΙΙ
0.1 W/K
Ι
MGP273
Th (°C)
Fig.3 R.F. power dissipation; VCE≤ 28 V; f > 1 MHz.

THERMAL RESISTANCE

(dissipation = 8 W; T
= 72,4 °C, i.e. Th=70°C)
mb
From junction to mounting base (d.c. dissipation) R From junction to mounting base (r.f. dissipation) R From mounting base to heatsink R
August 1986 3
th jmb(dc) th jmb(rf) th mbh
= 10,7 K/W = 8,6 K/W = 0,3 K/W
Page 4
Philips Semiconductors Product specification

CHARACTERISTICS

T
=25°C
j
Collector-emitter breakdown voltage
V
= 0; IC= 2 mA V
BE
(BR)CES
Collector-emitter breakdown voltage
open base; IC= 10 mA V
(BR)CEO
Emitter-base breakdown voltage
open collector; IE= 1 mA V
(BR)EBO
Collector cut-off current
VBE= 0; VCE= 36 V I
CES
Second breakdown energy; L = 25 mH; f = 50 Hz
open base E R
=10 E
BE
D.C. current gain
I
= 0,4 A; VCE= 5 V 10 to 100
C
Collector-emitter saturation voltage
(1)
(1)
IC= 1,25 A; IB= 0,25 A V
Transition frequency at f = 100 MHz
(1)
IE= 0,4 A; VCB= 28 V f = 1,25 A; VCB= 28 V f
I
E
h
T T
SBO SBR
FE
CEsat
Collector capacitance at f = 1 MHz
IE=Ie= 0; VCB= 28 V C
c
Feedback capacitance at f = 1 MHz
I
= 50 mA; VCE= 28 V C
C
Collector-flange capacitance C
re cf
> 65 V
> 36 V
> 4V
< 1mA
> 0,5 mJ > 0,5 mJ
typ. 50
typ. 0,8 V
typ. 600 MHz typ. 520 MHz
typ. 10 pF
typ. 7,1 pF typ. 2 pF
Note
1. Measured under pulse conditions: t
200 µs; δ≤0,02.
p
August 1986 4
Page 5
Philips Semiconductors Product specification
100
handbook, halfpage
h
FE
50
0
0 0.5 1.5
VCE = 28 V
5 V
1
IC (A)
Fig.4 Typical values; Tj=25°C.
MGP274
40
handbook, halfpage
C
c
(pF)
30
20
10
0
0 102030
Fig.5 IE=Ie= 0; f = 1 MHz; Tj=25°C.
MGP275
typ
VCB (V)
1000
handbook, full pagewidth
f
T
(MHz)
500
0
0
Fig.6 Typical values; f = 100 MHz; Tj=25°C.
August 1986 5
VCB = 28 V
20 V
10.5
IE (A)
MGP276
1.5
Page 6
Philips Semiconductors Product specification

APPLICATION INFORMATION

R. F. performance in c.w. operation (unneutralized common-emitter class-B circuit) T
=25°C
h
f (MHz) V
(V) PL(W) PS(W) Gp(dB) IC(A) η (%) zi(Ω) YL(mS)
CE
175 28 8 < 0,5 > 12 < 0,44 > 65 1,8 + j0,7 18 j20
handbook, full pagewidth
50
C1
C2
L4
T.U.T.
L1
L3
L2
C3
C4
L5
L6
+V
CC
C5
C6
L7
R1
MGP253
50
C7
Fig.7 Test circuit; c.w. class-B.
List of components:
C1 = C7 = 2,5 to 20 pF film dielectric trimmer (cat. no. 2222 809 07004) C2 = C6 = 5 to 60 pF film dielectric trimmer (cat. no. 2222 809 07011) C3 = 27 pF ceramic capacitor (500 V) C4 = 120 pF ceramic capacitor (500 V) C5 = 100 nF polyester capacitor L1 = 1 turn Cu wire (1,6 mm); int. dia. 8,4 mm; leads 2 × 5 mm L2 = 7 turns closely wound enamelled Cu wire (0,5 mm); int. dia. 3 mm; leads 2 × 5 mm L3 = L8 = Ferroxcube wide band h.f. choke, grade 3B (cat. no. 4312 020 36640) L4 = L5 = strip (12 mm × 6 mm); tap for C3 at 5 mm from transistor L6 = 3 turns closely wound enamelled Cu wire (1,0 mm); int. dia. 9,0 mm; leads 2 × 5 mm L7 = 3 turns closely wound enamelled Cu wire (1,0 mm); int. dia. 8,2 mm; leads 2 × 5 mm L4 and L5 are strips on a double Cu-clad printed-circuit board with epoxy fibre-glass dielectric, thickness 1/16". R1 = R2 = 10 carbon resistor Component layout and printed-circuit board for 175 MHz test circuit see Fig.8.
August 1986 6
Page 7
Philips Semiconductors Product specification
handbook, full pagewidth
150
C4
L6
C5 R1
+V
72
CC
rivet
L5
L4
L7
C6
C7
MGP254
C1 C2
L3
L1
L2
C3
Fig.8 Component layout and printed-circuit board for 175 MHz test circuit.
The circuit and the components are situated on one side of the epoxy fibre-glass board, the other side being fully metallized to serve as earth. Earth connections are made by means of hollow rivets, whilst under the emitter leads Cu straps are used for a direct contact between upper and lower sheets.
August 1986 7
Page 8
Philips Semiconductors Product specification
15
handbook, halfpage
P
L
(W)
10
5
0
0 0.5 1
Th = 25 °C
70 °C
PS (W)
Fig.9 Typical values; VCE= 28 V; f = 175 MHz.
MGP277
15
handbook, halfpage
G
p
(dB)
10
5
0
01020
G
p
T
h = 25 °C
70 °C
T
h = 25 °C
η
70 °C
MGP278
PL (W)
Fig.10 Typical values; VCE= 28 V; f = 175 MHz.
100
η
(%)
50
0
handbook, halfpage
P
Lnom
(W)
(VSWR = 1)
The graph shows the permissible output power under nominal conditions (VSWR = 1) as a function of the expected VSWR during short-time mismatch conditions with heatsink temperatures as parameter.
Fig.11 R.F. SOAR; c.w. class-B operation; f = 175 MHz; VCE= 28 V; R
August 1986 8
VSWR
= 0,3 K/W.
MGP279
T
h =
50 °C
70 °C
90 °C
2
11
10
9
8
7
11010
th mb-h
Page 9
Philips Semiconductors Product specification
12
handbook, halfpage
r
i
()
10
8
x
6
4
2
0
0 200 400
Typical values; VCE= 28 V;
= 8 W;
P
L
=25°C
T
h
i
r
i
x
i
r
i
f (MHz)
Fig.12 Input impedance (series components).
MGP280
5
()
0
5
10
0
MGP281
20
40
60
0
C
(pF)
L
150
handbook, halfpage
R
L
x
i
()
100
Typical values; VCE= 28 V;
= 8 W;
P
L
=25°C
T
h
R
L
C
50
L
0
0 200 400
C
f (MHz)
L
R
L
Fig.13 Load impedance (parallel components).
OPERATING NOTE
30
handbook, halfpage
G
p
(dB)
20
10
0
0 200 400
Typical values; VCE= 28 V;
= 8 W;
P
L
=25°C
T
h
Fig.14
f (MHz)
MGP282
Below 100 MHz a base-emitter resistor of 10 is recommended to avoid oscillation. This resistor must be effective for r.f. only.
August 1986 9
Page 10
Philips Semiconductors Product specification

PACKAGE OUTLINE

Flanged ceramic package; 2 mounting holes; 4 leads SOT123A

D
A
F
H
α
1
H
q
U
1
L
C
B
w
M
C
2
b
43
p
2
0 5 10 mm
scale
A
U
2
w
M
AB
1
c
U
3
Q
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
5.82
5.56
c
Db
9.73
0.18
9.47
0.10
0.397
0.383
0.007
0.004
IEC JEDEC EIAJ
0.373
0.371
D
9.63
9.42
F
1
2.72
20.71
2.31
19.93
0.815
0.107
0.091
0.221
0.785
0.203
REFERENCES
5.61
5.16
pH
3.33
3.04
0.131
0.120
Q
4.63
4.11
0.182
0.162
q
18.42
0.725
U
25.15
24.38
0.99
0.96
1
U2U
6.61
6.09
0.26
0.24
w
1
3
9.78
9.39
0.385
0.370
EUROPEAN
PROJECTION
UNIT
inches
A
7.47
mm
6.37
0.229
0.294
0.219
0.251
OUTLINE VERSION
SOT123A 97-06-28
August 1986 10
w
2
1.020.51
0.040.02
ISSUE DATE
αL
45°
Page 11
Philips Semiconductors Product specification

DEFINITIONS

Data Sheet Status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
August 1986 11
Loading...