Datasheet BLV12 Datasheet (Philips)

Page 1
DISCRETE SEMICONDUCTORS
DATA SH EET
BLV12
VHF power transistor
Product specification
September 1991
Page 2
Philips Semiconductors Product specification

FEATURES

Emitter-ballasting resistors for an optimum temperature profile
Excellent reliability
Withstands full load mismatch.

DESCRIPTION

NPN silicon planar epitaxial transistor encapsulated in a 4-lead SOT123 flange envelope with a ceramic cap. It is designed for common emitter, class-B operation in mobile VHF transmitters with a supply voltage of
12.5 V. All leads are isolated from the
mounting flange.

PINNING - SOT123

PIN DESCRIPTION
1 collector 2 emitter 3 base 4 emitter

QUICK REFERENCE DATA

RF performance at T
MODE OF OPERATION
= 25 °C in a common emitter test circuit.
mb
f
(MHz)
V
(V)
CE
P
(W)
L
G
P
(dB)
(%)
c.w. class-B 175 12.5 30 > 9 > 60
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste.

PIN CONFIGURATION

lfpage
1
4
c
handbook, halfpage
b
η
C
23
MSB057
Fig.1 Simplified outline and symbol.
MBB012
e
September 1991 2
Page 3
Philips Semiconductors Product specification

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
EBO
I
C,IC(AV)
I
CM
P
tot
T
stg
T
j
collector-base voltage open emitter 36 V collector-emitter voltage open base 16 V emitter-base voltage open collector 3V collector current DC or average value 6A collector current peak value
18 A
f > 1 MHz
total power dissipation RF operation;
100 W f > 1 MHz; Tmb=25°C
storage temperature range 65 150 °C junction operating temperature 200 °C
120
handbook, halfpage
P
tot
(W)
100
80
60
40
20
0
0 20406080100120
(I) Continuous DC operation. (II) Short time operation during mismatch
(f > 1 MHz)
II
I
Fig.2 Power/temperature derating curve.
MRA372
o
T ( C)
h

THERMAL RESISTANCE

SYMBOL PARAMETER CONDITIONS MAX. UNIT
R
th j-mb(RF)
from junction to mounting base P
= 100 W;
tot
1.75 K/W
Tmb=25°C
R
th mb-h
from mounting base to heatsink 0.3 K/W
September 1991 3
Page 4
Philips Semiconductors Product specification

CHARACTERISTICS

T
= 25 °C.
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
I
CES
h
FE
f
T
C
c
C
re
C
c-f
collector-base breakdown voltage open emitter;
Ic= 10 mA
collector-emitter breakdown voltage open base;
Ic= 25 mA
emitter-base breakdown voltage open collector;
IE= 2 mA
collector-emitter leakage current VBE=0;
VCE= 16 V
DC current gain VCE=5 V;
IC=4 A
transition frequency VCE= 12.5 V;
IE= 4 A; f = 500 MHz
collector capacitance VCB= 12.5 V;
IE=Ie=0; f = 1 MHz
feedback capacitance VCE= 12.5 V;
IC=0; f = 1 MHz
collector-flange capacitance f = 1 MHz 2 pF
36 −−V
16 −−V
3 −− V
−−10 mA
25 35
1.6 GHz
90 100 pF
60 70 pF
VCE=
12.5 V
I (A)
C
MRA378
50
handbook, halfpage
h
FE
40
30
20
10
0
0 4 8 12 16
V = 5 V
CE
Fig.3 DC current gain as a function of collector
current, typical values.
September 1991 4
250
handbook, halfpage
C
c
(pF)
200
150
100
50
0
0 4 8 12 16
IE=ie= 0; f = 1 MHz.
V (V)
Fig.4 Collector capacitance as a function of
collector-base voltage, typical values.
MRA374.1
CB
Page 5
Philips Semiconductors Product specification
handbook, halfpage
2
f
T
(GHz)
1.5
1
0.5
0
0246810
VCB= 12.5 V.
MRA375
I (A)
E
Fig.5 Transition frequency as a function of emitter
current, typical values.
September 1991 5
Page 6
Philips Semiconductors Product specification

APPLICATION INFORMATION

RF performance at T
=25°C in a common emitter test circuit.
mb
MODE OF OPERATION
f
(MHz)
V
(V)
CE
P
(W)
L
c.w. class-B 175 12.5 30 > 9
typ. 9.8
handbook, halfpage
G
P
(dB)
12
8
4
0
10 20 30 40
η
G
P
P (W)
L
MRA367
η
(%)
70
50
30
10
50
handbook, halfpage
P
L
(W)
40
30
20
10
0
02468
G
P
(dB)
> 60 typ. 66
MRA371
P (W)
IN
η
(%)
C
Class-B operation; VCE= 12.5 V; f = 175 MHz.
Fig.6 Gain and efficiency as functions of load
power, typical values.
Class-B operation; VCE= 12.5 V; f = 175 MHz.
Fig.7 Load power as a function of drive power,
typical values.

Ruggedness in class-B operation

The BLV12 is capable of withstanding a full load mismatch corresponding to VSWR = 50:1 through all phases at rated output power, up to a supply voltage of 15.5 V, and f = 175 MHz.
September 1991 6
Page 7
Philips Semiconductors Product specification
handbook, full pagewidth
50
C1
C2
C3a
L1
L2
T.U.T.
L4
C3b
L5
L6
C4
C6a
L7
C5
C7
50
C8C6b
R2
R1
L3
+V
CC
L8
MGP247
Fig.8 Class-B test circuit at f = 175 MHz.
List of components (see test circuit)
COMPONENT DESCRIPTION VALUE DIMENSIONS CATALOGUE NO.
C1 film dielectric trimmer 2.5 to 20 pF 2222 809 07004 C2, C8 film dielectric trimmer 4 to 40 pF 2222 809 07008 C3a, C3b 500 V ceramic capacitor 47 pF C4 500 V ceramic capacitor 120 pF C5 polyester capacitor 100 nF C6a, C6b 500 V ceramic capacitor 8.2 pF C7 film dielectric trimmer 5 to 60 pF 2222 809 07011 L1 1 turn enamelled 1.6 mm copper wire int. dia. 9 mm;
leads 2 × 5 mm
L2 7 turns closely wound enamelled 0.5 mm
copper wire
100 nH int. dia. 3 mm;
leads 2 × 5 mm L3, L8 grade 3B Ferroxcube wideband HF choke 4312 020 36640 L4, L5 stripline (note 1) 12 mm × 6 mm;
note 2 L6 2 turns enamelled 1.6 mm copper wire int. dia. 5 mm;
length 6 mm;
leads 2 × 5 mm L7 2 turns enamelled 1.6 mm copper wire int. dia. 4.5 mm;
length 6 mm;
leads 2 × 5 mm R1 0.25 W carbon resistor 10 ,5% R2 0.25 W carbon resistor 4.7 ,5%
Notes
1. The striplines are on a double copper-clad printed circuit board, with epoxy fibre-glass dielectric, thickness
2. Taps for capacitors C3a and C3b are situated 5 mm from the transistor.
September 1991 7
1
⁄16inch.
Page 8
Philips Semiconductors Product specification
handbook, full pagewidth
150
72
L3
R1
C4
L8
C5 R2
+V
CC
C3a
L2
C1 C2
The circuit and components are situated on one side of an epoxy fibre-glass board; the other side is unetched and serves as a ground plane. Earth connections are made by means of hollow rivets and copper straps under the emitters, to provide a direct contact between the component side and the ground plane.
L1
L4
C3b
rivet
L6
L5
C6a
C7
L7
C6b
Fig.9 Component layout for 175 MHz class-B test circuit.
September 1991 8
C8
MGP245
Page 9
Philips Semiconductors Product specification
handbook, halfpage
3
Z
i
()
2
1
0
100 150 200 250
Class-B operation; VCE= 12.5 V; PL= 30 W.
r
i
x
i
MRA369
f (MHz)
Fig.10 Input impedance (series components) as a
function of frequency, typical values.
handbook, halfpage
4
Z
L
()
3
2
1
0
-1
-2 100 150 200 250
Class-B operation; VCE= 12.5 V; PL= 30 W.
R
L
X
L
MRA370
f (MHz)
Fig.11 Load impedance (series components) as a
function of frequency, typical values.
handbook, halfpage
Z
i
Z
L
Fig.12 Definition of transistor impedance.
MBA451
handbook, halfpage
G
P
(dB)
15
10
5
0
100 150 200 250
Class-B operation; VCE= 12.5 V; PL= 30 W.
MRA368
f (MHz)
Fig.13 Power gain as a function of frequency, typical
values.
September 1991 9
Page 10
Philips Semiconductors Product specification

PACKAGE OUTLINE

Flanged ceramic package; 2 mounting holes; 4 leads SOT123A

D
A
F
H
α
1
H
q
U
1
L
C
B
w
M
C
2
b
43
p
2
0 5 10 mm
scale
A
U
2
w
M
AB
1
c
U
3
Q
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
5.82
5.56
c
Db
9.73
0.18
9.47
0.10
0.397
0.383
0.007
0.004
IEC JEDEC EIAJ
0.373
0.371
D
9.63
9.42
F
1
2.72
20.71
2.31
19.93
0.815
0.107
0.091
0.221
0.785
0.203
REFERENCES
5.61
5.16
pH
3.33
3.04
0.131
0.120
Q
4.63
4.11
0.182
0.162
q
18.42
0.725
U
1
25.15
24.38
0.99
0.96
U2U
6.61
6.09
0.26
0.24
w
1
3
9.78
9.39
0.385
0.370
EUROPEAN
PROJECTION
UNIT
inches
A
7.47
mm
6.37
0.229
0.294
0.219
0.251
OUTLINE
VERSION
SOT123A 97-06-28
September 1991 10
w
2
1.020.51
0.040.02
ISSUE DATE
αL
45°
Page 11
Philips Semiconductors Product specification

DEFINITIONS

Data Sheet Status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
September 1991 11
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