• Emitter-ballasting resistors for an
optimum temperature profile
• Excellent reliability
• Withstands full load mismatch.
DESCRIPTION
NPN silicon planar epitaxial transistor
encapsulated in a 4-lead SOT123
flange envelope with a ceramic cap. It
is designed for common emitter,
class-B operation in mobile VHF
transmitters with a supply voltage of
12.5 V. All leads are isolated from the
mounting flange.
PINNING - SOT123
PINDESCRIPTION
1collector
2emitter
3base
4emitter
QUICK REFERENCE DATA
RF performance at T
MODE OF OPERATION
= 25 °C in a common emitter test circuit.
mb
f
(MHz)
V
(V)
CE
P
(W)
L
G
P
(dB)
(%)
c.w. class-B17512.530> 9> 60
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided
that the BeO disc is not damaged. All persons who handle, use or dispose of
this product should be aware of its nature and of the necessary safety
precautions. After use, dispose of as chemical or special waste according to
the regulations applying at the location of the user. It must never be thrown
out with the general or domestic waste.
PIN CONFIGURATION
lfpage
1
4
c
handbook, halfpage
b
η
C
23
MSB057
Fig.1 Simplified outline and symbol.
MBB012
e
September 19912
Page 3
Philips SemiconductorsProduct specification
VHF power transistorBLV12
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
CBO
V
CEO
V
EBO
I
C,IC(AV)
I
CM
P
tot
T
stg
T
j
collector-base voltageopen emitter−36V
collector-emitter voltageopen base−16V
emitter-base voltageopen collector−3V
collector currentDC or average value−6A
collector currentpeak value
−18A
f > 1 MHz
total power dissipationRF operation;
−100W
f > 1 MHz;
Tmb=25°C
storage temperature range−65150°C
junction operating temperature−200°C
120
handbook, halfpage
P
tot
(W)
100
80
60
40
20
0
0 20406080100120
(I) Continuous DC operation.
(II) Short time operation during mismatch
(f > 1 MHz)
II
I
Fig.2 Power/temperature derating curve.
MRA372
o
T ( C)
h
THERMAL RESISTANCE
SYMBOLPARAMETERCONDITIONSMAX.UNIT
R
th j-mb(RF)
from junction to mounting baseP
= 100 W;
tot
1.75K/W
Tmb=25°C
R
th mb-h
from mounting base to heatsink0.3K/W
September 19913
Page 4
Philips SemiconductorsProduct specification
VHF power transistorBLV12
CHARACTERISTICS
T
= 25 °C.
j
SYMBOLPARAMETERCONDITIONSMIN. TYP. MAX. UNIT
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
I
CES
h
FE
f
T
C
c
C
re
C
c-f
collector-base breakdown voltageopen emitter;
Ic= 10 mA
collector-emitter breakdown voltage open base;
Ic= 25 mA
emitter-base breakdown voltageopen collector;
IE= 2 mA
collector-emitter leakage currentVBE=0;
VCE= 16 V
DC current gainVCE=5 V;
IC=4 A
transition frequencyVCE= 12.5 V;
IE= 4 A;
f = 500 MHz
collector capacitanceVCB= 12.5 V;
IE=Ie=0;
f = 1 MHz
feedback capacitanceVCE= 12.5 V;
IC=0;
f = 1 MHz
collector-flange capacitancef = 1 MHz−2−pF
36−−V
16−−V
3−− V
−−10mA
2535−
−1.6−GHz
−90100pF
−6070pF
VCE=
12.5 V
I (A)
C
MRA378
50
handbook, halfpage
h
FE
40
30
20
10
0
0481216
V = 5 V
CE
Fig.3DC current gain as a function of collector
current, typical values.
September 19914
250
handbook, halfpage
C
c
(pF)
200
150
100
50
0
0481216
IE=ie= 0; f = 1 MHz.
V (V)
Fig.4Collector capacitance as a function of
collector-base voltage, typical values.
MRA374.1
CB
Page 5
Philips SemiconductorsProduct specification
VHF power transistorBLV12
handbook, halfpage
2
f
T
(GHz)
1.5
1
0.5
0
0246810
VCB= 12.5 V.
MRA375
I (A)
E
Fig.5Transition frequency as a function of emitter
current, typical values.
September 19915
Page 6
Philips SemiconductorsProduct specification
VHF power transistorBLV12
APPLICATION INFORMATION
RF performance at T
=25°C in a common emitter test circuit.
mb
MODE OF OPERATION
f
(MHz)
V
(V)
CE
P
(W)
L
c.w. class-B17512.530> 9
typ. 9.8
handbook, halfpage
G
P
(dB)
12
8
4
0
10203040
η
G
P
P (W)
L
MRA367
η
(%)
70
50
30
10
50
handbook, halfpage
P
L
(W)
40
30
20
10
0
02468
G
P
(dB)
> 60
typ. 66
MRA371
P (W)
IN
η
(%)
C
Class-B operation; VCE= 12.5 V; f = 175 MHz.
Fig.6Gain and efficiency as functions of load
power, typical values.
Class-B operation; VCE= 12.5 V; f = 175 MHz.
Fig.7Load power as a function of drive power,
typical values.
Ruggedness in class-B operation
The BLV12 is capable of withstanding a full load mismatch
corresponding to VSWR = 50:1 through all phases at rated
output power, up to a supply voltage of 15.5 V, and
f = 175 MHz.
September 19916
Page 7
Philips SemiconductorsProduct specification
VHF power transistorBLV12
handbook, full pagewidth
50 Ω
C1
C2
C3a
L1
L2
T.U.T.
L4
C3b
L5
L6
C4
C6a
L7
C5
C7
50 Ω
C8C6b
R2
R1
L3
+V
CC
L8
MGP247
Fig.8 Class-B test circuit at f = 175 MHz.
List of components (see test circuit)
COMPONENTDESCRIPTIONVALUEDIMENSIONSCATALOGUE NO.
C1film dielectric trimmer2.5 to 20 pF2222 809 07004
C2, C8film dielectric trimmer4 to 40 pF2222 809 07008
C3a, C3b500 V ceramic capacitor47 pF
C4500 V ceramic capacitor120 pF
C5polyester capacitor100 nF
C6a, C6b500 V ceramic capacitor8.2 pF
C7film dielectric trimmer5 to 60 pF2222 809 07011
L11 turn enamelled 1.6 mm copper wireint. dia. 9 mm;
leads 2 × 5 mm
L72 turns enamelled 1.6 mm copper wireint. dia. 4.5 mm;
length 6 mm;
leads 2 × 5 mm
R10.25 W carbon resistor10 Ω,5%
R20.25 W carbon resistor4.7 Ω,5%
Notes
1. The striplines are on a double copper-clad printed circuit board, with epoxy fibre-glass dielectric, thickness
2. Taps for capacitors C3a and C3b are situated 5 mm from the transistor.
September 19917
1
⁄16inch.
Page 8
Philips SemiconductorsProduct specification
VHF power transistorBLV12
handbook, full pagewidth
150
72
L3
R1
C4
L8
C5R2
+V
CC
C3a
L2
C1C2
The circuit and components are situated on one side of an epoxy fibre-glass board; the other side is unetched
and serves as a ground plane. Earth connections are made by means of hollow rivets and copper straps under
the emitters, to provide a direct contact between the component side and the ground plane.
L1
L4
C3b
rivet
L6
L5
C6a
C7
L7
C6b
Fig.9 Component layout for 175 MHz class-B test circuit.
September 19918
C8
MGP245
Page 9
Philips SemiconductorsProduct specification
VHF power transistorBLV12
handbook, halfpage
3
Z
i
(Ω)
2
1
0
100150200250
Class-B operation; VCE= 12.5 V; PL= 30 W.
r
i
x
i
MRA369
f (MHz)
Fig.10 Input impedance (series components) as a
function of frequency, typical values.
handbook, halfpage
4
Z
L
(Ω)
3
2
1
0
-1
-2
100150200250
Class-B operation; VCE= 12.5 V; PL= 30 W.
R
L
X
L
MRA370
f (MHz)
Fig.11 Load impedance (series components) as a
function of frequency, typical values.
handbook, halfpage
Z
i
Z
L
Fig.12 Definition of transistor impedance.
MBA451
handbook, halfpage
G
P
(dB)
15
10
5
0
100150200250
Class-B operation; VCE= 12.5 V; PL= 30 W.
MRA368
f (MHz)
Fig.13 Power gain as a function of frequency, typical
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
5.82
5.56
c
Db
9.73
0.18
9.47
0.10
0.397
0.383
0.007
0.004
IEC JEDEC EIAJ
0.373
0.371
D
9.63
9.42
F
1
2.72
20.71
2.31
19.93
0.815
0.107
0.091
0.221
0.785
0.203
REFERENCES
5.61
5.16
pH
3.33
3.04
0.131
0.120
Q
4.63
4.11
0.182
0.162
q
18.42
0.725
U
1
25.15
24.38
0.99
0.96
U2U
6.61
6.09
0.26
0.24
w
1
3
9.78
9.39
0.385
0.370
EUROPEAN
PROJECTION
UNIT
inches
A
7.47
mm
6.37
0.229
0.294
0.219
0.251
OUTLINE
VERSION
SOT123A97-06-28
September 199110
w
2
1.020.51
0.040.02
ISSUE DATE
αL
45°
Page 11
Philips SemiconductorsProduct specification
VHF power transistorBLV12
DEFINITIONS
Data Sheet Status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
September 199111
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