Datasheet BLV10 Datasheet (Philips)

Page 1
DISCRETE SEMICONDUCTORS
DATA SH EET
BLV10
VHF power transistor
Product specification
August 1986
Page 2
Philips Semiconductors Product specification

DESCRIPTION

N-P-N silicon planar epitaxial transistor intended for use in class-A, B and C operated mobile, h.f. and v.h.f. transmitters with a nominal supply voltage of 13,5 V. The transistor is resistance stabilized and is guaranteed to withstand severe load mismatch conditions with a supply over-voltage to 16,5 V.

QUICK REFERENCE DATA

R.F. performance up to T
MODE OF OPERATION V
= 25 °C in an unneautralized common-emitter class-B circuit
h
CE
V
c.w. 13,5 175 8 > 9,0 > 70 2,8 + j1,2 76 j16
c.w. 12,5 175 8 typ. 10,5 typ. 75 −−

PIN CONFIGURATION

handbook, halfpage
1
It has a 3/8” flange envelope with a ceramic cap. All leads are isolated from the flange.
f
MHz
P
L
W
4
G dB
P
η
%
z
i

PINNING

PIN DESCRIPTION
1 collector 2 emitter 3 base 4 emitter
Y
mS
L
23
MSB057
Fig.1 Simplified outline, SOT123.
PRODUCT SAFETY This device incorporates beryllium oxide, the dust of which is toxic. The device is entirely safe provided that the BeO disc is not damaged.
August 1986 2
Page 3
Philips Semiconductors Product specification

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)
Collector-emitter voltage (V
peak value V Collector-emitter voltage (open base) V Emitter-base voltage (open collector) V Collector current (average) I Collector current (peak value); f > 1 MHz I R.F. power dissipation (f > 1 MHz); T Storage temperature T Operating junction temperature T
BE
= 0)
CESM CEO
EBO C(AV) CM
=25°CP
mb
rf
stg
j
max. 36 V max. 18 V max. 4 V max. 1,5 A max. 4,0 A max. 20 W
65 to + 150 °C max. 200 °C
1.75
handbook, halfpage
I
C
(A)
1.5
1.25
1
0.75
0.5 5101520
Th = 70 °C
Fig.2 D.C. SOAR.
Tmb = 25 °C
VCE (V)
MGP248
30
handbook, halfpage
P
tot
(W)
20
10
0
0 50 100
I Continuous d.c. operation II Continuous r.f. operation III Short-time operation during mismatch
ΙΙΙ
derate by 0.12 W/K
ΙΙ
0.1 W/K
Ι
Fig.3 R.F. power dissipation;
VCE≤ 16,5 V; f > 1 MHz.
MGP249
Th (°C)
August 1986 3
Page 4
Philips Semiconductors Product specification

THERMAL RESISTANCE

(dissipation = 8 W; T
From junction to mounting base (d.c. dissipation) R From junction to mounting base (r.f. dissipation) R From mounting base to heatsink R

CHARACTERISTICS

T
=25°C
j
Collector-emitter breakdown voltage
= 0; IC= 5 mA V
V
BE
Collector-emitter breakdown voltage
open base; I
C
Emitter-base breakdown voltage
open collector; IE= 1 mA V
Collector cut-off current
V
= 0; VCE= 18 V I
BE
Second breakdown energy; L = 25 mH; f = 50 Hz
open base E R
=10 E
BE
D.C. current gain
I
= 0,75 A; VCE=5 V h
C
Collector-emitter saturation voltage
IC= 2 A; IB= 0,4 A V
Transition frequency at f = 100 MHz
IE= 0,75 A; VCB= 13,5 V f
I
= 2 A; VCB= 13,5 V f
E
Collector capacitance at f = 1 MHz
I
=0;VCB= 13,5 V C
E=Ie
Feedback capacitance at f = 1 MHz
= 100 mA; VCE= 13,5 V C
I
C
Collector-flange capacitance C
= 72,4 °C, i.e. Th=70°C)
mb
= 25 mA V
(1)
(1)
(1)
th j-mb(dc) th j-mb(rf) th mb-h
(BR) CES
(BR) CEO
(BR)EBO
CES
SBO SBR
FE
CEsat
T T
c
re cf
= 10,7 K/W = 8,6 K/W = 0,3 K/W
> 36 V
> 18 V
> 4V
< 2mA
> 0,5 mJ > 0,5 mJ
typ. 40
10 to 100
typ. 0,85 V
typ. 950 MHz typ. 850 MHz
typ. 16,5 pF
typ. 12 pF typ. 2 pF
Note
1. Measured under pulse conditions: t
200 µs; δ≤0,02.
p
August 1986 4
Page 5
Philips Semiconductors Product specification
100
handbook, halfpage
h
FE
75
50
25
0
0123
VCE = 13.5 V
5 V
IC (A)
Fig.4 Typical values; Tj=25°C.
MGP250
40
handbook, halfpage
C
c
(pF)
30
20
10
0
05
Fig.5 IE=Ie= 0; f = 1 MHz; Tj= 25 °C.
typ
MGP251
10 15
VCB (V)
1250
handbook, full pagewidth
f
T
(MHz)
1000
750
500
250
0
01 3
VCB = 13.5 V
10 V
Fig.6 Typical values; f = 100 MHz; Tj= 25 °C.
August 1986 5
MGP252
2
IE (A)
Page 6
Philips Semiconductors Product specification

APPLICATION INFORMATION

R.F. performance in c.w. operation (unneutralized common-emitter class-B circuit) T
=25°C
h
f (MHz) V
(V) PL(W) PS(W) GP(dB) IC(A) η (%) zi() YL(mS)
CE
175 13,5 8 < 1,0 > 9,0 < 0,85 > 70 2,8 + j1,2 76 j16
175 12,5 8 typ. 10,5 typ. 75 −−
handbook, full pagewidth
50
C1
C2
L4
T.U.T.
L1
L3
L2
C3
C4
L5
L6
+V
CC
C5
C6
L7
R1
MGP253
50
C7
Fig.7 Test circuit; c.w. class-B.
List of components:
C1 = 2,5 to 20 pF film dielectric trimmer (cat. no. 2222 809 07004) C2 = C6 = 4 to 40 pF film dielectric trimmer (cat. no. 2222 809 07008) C3 = 47 pF ceramic capacitor (500 V) C4 = 120 pF ceramic capacitor (500 V) C5 = 100 nF polyester capacitor C7 = 5 to 60 pF film dielectric trimmer (cat. no. 2222 809 07011) L1 = 2 turns Cu wire (1,6 mm); int. dia. 4,5 mm; length 5,7 mm; leads 2 × 5 mm L2 = L6 = Ferroxcube wide-band h.f. choke, grade 3B (cat. no. 4312 020 36640) L3 = L4 = strip (12 mm × 6 mm); tap for C3 at 5 mm from transistor L5 = 3 turns Cu wire (1,6 mm); int. dia. 7,5 mm; length 7,5 mm; leads 2 × 5 mm L7 = 3 turns Cu wire (1,6 mm); int. dia. 6,5 mm; length 7,4 mm; leads 2 × 5 mm L3 and L4 are strips on a double Cu-clad printed-circuit board with epoxy fibre-glass dielectric, thickness 1/16". R1 = 10 carbon resistor Component layout and printed-circuit board for 175 MHz test circuit see Fig.8.
August 1986 6
Page 7
Philips Semiconductors Product specification
handbook, full pagewidth
150
C4
L6
C5 R1
+V
72
CC
rivet
L5
L4
L7
C6
C7
MGP254
C1 C2
L3
L1
L2
C3
Fig.8 Component layout and printed-circuit board for 175 MHz test circuit.
The circuit and the components are situated on one side of the epoxy fibre-glass board, the other side being fully metallized to serve as earth. Earth connections are made by means of hollow rivets, whilst under the emitter leads Cu straps are used for a direct contact between upper and lower sheets.
August 1986 7
Page 8
Philips Semiconductors Product specification
15
handbook, halfpage
P
L
(W)
10
5
0
012
 VCE= 13,5V;
− − − V
= 12,5 V.
CE
MGP255
Th = 25 °C
70 °C
PS (W)
Fig.9 Typical values; f = 175 MHz;
15
handbook, halfpage
 VCE= 13,5 V;
− − − V
G
G
p
(dB)
10
5
0
0 5 10 20
= 12,5 V.
CE
Fig.10 Typical values; f = 175 MHz;
MGP256
p
Th = 70 °C
25 °C
η
25 °C 70 °C
15
PL (W)
150
η
(%)
100
50
0
The transistor has been developed for use with unstabilized supply voltages. As the output power and drive power increase with the supply voltage, the nominal output power must be derated in accordance with the graph for safe operation at supply voltages other than the nominal. The graph shows the permissible output power under nominal conditions (VSWR = 1), as a function of the expected supply over-voltage ratio with VSWR as parameter.
The graph applies to the situation in which the drive (P over-voltage ratio.
) increases linearly with supply
S/PSnom
(VSWR = 1)
10
handbook, halfpage
P
Lnom (W)
7.5
5
2.5
0
0 1.1 1.2 1.3
VSWR =
10 50
Fig.11 R.F. SOAR (short-time operation during mismatch); f = 175 MHz; Th= 70 °C; R
V
= 13,5 V or 12,5 V; PS=P
CEnom
Snom
at V
and VSWR = 1.
CEnom
August 1986 8
P
P
Snom V
V
CEnom
S
CE
MGP257
th mb-h
= 0,3 K/W;
Page 9
Philips Semiconductors Product specification
10
handbook, halfpage
ri, x
i
()
5
r
i
0
x
i
5
10
0 100 200
Typical values; VCE= 13,5 V; PL= 8 W;
=25°C
T
h
f (MHz)
Fig.12 Input impedance (series components).
MGP258
x
i
r
i
300
25
handbook, halfpage
R
L
R
()
20
15
10
Typical values; VCE= 13,5 V; PL= 8 W;
=25°C
T
h
L
C
L
5
0 100 200
C
L
R
L
f (MHz)
Fig.13 Load impedance (parallel components).
OPERATING NOTE
MGP259
300
0
C
(pF)
50
100
150
200
L
20
handbook, halfpage
G
p
(dB)
15
10
5
0
0 100 200
Typical values; VCE= 13,5 V; PL= 8 W;
=25°C
T
h
Fig.14
f (MHz)
MGP260
Below 70 MHz a base-emitter resistor of 10 is recommended to avoid oscillation. This resistor must be effective for r.f. only.
300
August 1986 9
Page 10
Philips Semiconductors Product specification

PACKAGE OUTLINE

Flanged ceramic package; 2 mounting holes; 4 leads SOT123A

D
A
F
H
α
1
H
q
U
1
L
C
B
w
M
C
2
b
43
p
2
0 5 10 mm
scale
A
U
2
w
M
AB
1
c
U
3
Q
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
5.82
5.56
c
Db
9.73
0.18
9.47
0.10
0.397
0.383
0.007
0.004
IEC JEDEC EIAJ
0.373
0.371
D
9.63
9.42
F
1
2.72
20.71
2.31
0.107
0.091
5.61
19.93
5.16
0.815
0.221
0.785
0.203
REFERENCES
pH
3.33
3.04
0.131
0.120
Q
4.63
4.11
0.182
0.162
q
18.42
0.725
U
1
25.15
24.38
0.99
0.96
U2U
6.61
6.09
0.26
0.24
PROJECTION
w
3
9.78
9.39
0.385
0.370
EUROPEAN
1
UNIT
inches
A
7.47
mm
6.37
0.229
0.294
0.219
0.251
OUTLINE
VERSION
SOT123A 97-06-28
August 1986 10
w
2
1.020.51
0.040.02
ISSUE DATE
αL
45°
Page 11
Philips Semiconductors Product specification

DEFINITIONS

Data Sheet Status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
August 1986 11
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