Datasheet BLS3135-10 Datasheet (Philips)

Page 1
DISCRETE SEMICONDUCTORS
DATA SH EET
M3D324
BLS3135-10
Microwave power transistor
Product specification 2000 Feb 01
Page 2
Philips Semiconductors Product specification
FEATURES
Suitable for short and medium pulse applications
Internal inputand output matching networks for an easy
circuit design
Emitter ballasting resistors improve ruggedness
Gold metallization ensures excellent reliability
Interdigitated emitter-base structure provides high
emitter efficiency
Multicellgeometry improves power sharing andreduces thermal resistance.
APPLICATIONS
Common base class-C pulsed power amplifier for radar applications in the 3.1 to 3.5 GHz range.
DESCRIPTION
NPN silicon planar epitaxial microwave powertransistor in a 2-lead rectangular flange package with a ceramic cap (SOT445C) with the common base connected to the flange.
PINNING - SOT445C
PIN DESCRIPTION
1 collector 2 emitter 3 base; connected to flange
handbook, halfpage
Top view
Fig.1 Simplified outline.
1
3
2
MBK132
QUICK REFERENCE DATA
RF performance at Th=25°C in a common base class-C test circuit.
MODE OF OPERATION
f
(GHz)
V
(V)
CB
P
(W)
L
G
(dB)
p
η
C
(%)
Pulsed class-C 3.1 to 3.5 40 10 typ. 9 typ. 40
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste.
2000 Feb 01 2
Page 3
Philips Semiconductors Product specification
Microwave power transistor BLS3135-10
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CES
V
EBO
I
CM
P
tot
T
stg
T
j
T
sld
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Z
th j-h
collector-base voltage open emitter 75 V collector-emitter voltage RBE=0 75 V emitter-base voltage open collector 2V peak collector current tp≤ 100 µs; δ≤10% 1.5 A total power dissipation tp= 100 µs; δ = 10%; Th=25°C 34 W storage temperature 65 +200 °C operating junction temperature 200 °C soldering temperature up to 0.2 mm from ceramic cap; t 10 s 235 °C
thermal impedance from junction to heatsink tp= 100 µs; δ = 10%; note 1 5.2 K/W
= 200 µs; δ = 10%; note 1 5.8 K/W
t
p
t
= 300 µs; δ = 10%; note 1 6.3 K/W
p
Note
1. Equivalent thermal impedance under pulsed microwave operating conditions.
CHARACTERISTICS
Tj=25°C unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
(BR)CBO
V
(BR)CES
I
CBO
I
CES
I
EBO
h
FE
collector-base breakdown voltage IC= 2.5 mA; open emitter 75 V collector-emitter breakdown voltage IC= 2.5 mA; VBE=0 75 V collector leakage current VCB=40V; IE=0 0.3 mA collector leakage current VCE=40V; VBE=0 0.5 mA emitter leakage current VEB= 1.5 V; IC=0 0.1 mA DC current gain VCE=5V; IC= 0.25 A 40
APPLICATION INFORMATION
RF performance at T
MODE OF OPERATION
Class-C; t
= 100 µs; δ = 10% 3.1 to 3.5 40 10 7.5
p
=25°C in a common-base test circuit.
h
f
(GHz)
V
(V)
CE
P
(W)
L
G
p
(dB)
η
(%)
C
35
typ. 9
typ. 40
2000 Feb 01 3
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Philips Semiconductors Product specification
Microwave power transistor BLS3135-10
12
handbook, halfpage
P
L
(W)
8
4
0
0
VCB= 40 V; class-C; tp= 100 µs; δ = 10%. (1) f = 3.1 GHz. (2) f = 3.3 GHz. (3) f = 3.5 GHz.
(1) (2) (3)
0.5 1.5
1
PD (W)
Fig.2 Load power as a function of drive power;
typical values.
MCD856
12
handbook, halfpage
G
p
(dB)
8
4
0
04 12
VCB= 40 V; class-C; tp= 100 µs; δ = 10%. (1) f = 3.1 GHz. (2) f = 3.3 GHz. (3) f = 3.5 GHz.
8
PL (W)
Fig.3 Power gain as a function of load power;
typical values.
MCD857
(1) (2)
(3)
50
handbook, halfpage
η
C
(%)
40
30
20
10
0
04 12
VCB= 40 V; class-C; tp= 100 µs; δ = 10%. (1) f = 3.1 GHz. (2) f = 3.3 GHz. (3) f = 3.5 GHz.
8
PL (W)
Fig.4 Collector efficiency as a function of load
power; typical values.
MCD858
(3)
MCD859
12
handbook, halfpage
(2) (1)
G
(dB)
VCB= 40 V; class-C; PL= 10 W; tp= 100 µs; δ = 10%.
G
p
p
8
return losses
4
0
3 3.2 3.4 3.6
f (GHz)
24
return
losses
(dB)
16
8
0
Fig.5 Power gain and input return losses as
functions of frequency; typical values.
2000 Feb 01 4
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Philips Semiconductors Product specification
Microwave power transistor BLS3135-10
handbook, halfpage
8
Z
i
()
4
0
4
8
3 3.2 3.4 3.6
VCB= 40 V; class-C; PL=10W.
r
i
x
i
MCD860
f (GHz)
Fig.6 Input impedance as a function of frequency
(series components); typical values.
12
handbook, halfpage
Z
()
VCB= 40 V; class-C; PL=10W.
R
L
L
X
L
8
4
0
3 3.2 3.4 3.6
MCD861
f (GHz)
Fig.7 Load impedance as a function of frequency
(series components); typical values.
2000 Feb 01 5
Page 6
Philips Semiconductors Product specification
Microwave power transistor BLS3135-10
handbook, full pagewidth
30 30
40
C2
C1
MCD862
Dimensions in mm. The components are situated on one side of the copper-clad printed-circuit board with Duroid dielectric (εr= 2.2), thickness 0.38 mm.
The other side is unetched and serves as a ground plane. C1 = 10 pF (ATC 100A); C2 = 100 pF (ATC 100A).
Fig.8 Component layout for 3.1 to 3.5 GHz class-C test circuit.
2000 Feb 01 6
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Philips Semiconductors Product specification
Microwave power transistor BLS3135-10
PACKAGE OUTLINE
Flanged hermetic ceramic package; 2 mounting holes; 2 leads SOT445C
D
A
F
3
D
1
D
2
H
U
2
A
DIMENSIONS (mm are the original dimensions)
mm
A
5.57
4.70
cD E
b
0.15
3.15
0.09
2.95
8.13
7.87
D
7.65
7.35
1
UNIT
D
8.15
7.85
U
1
q
1
2
w
E
4.25
3.95
M
C
2
scale
1
5.31
5.01
b
0 5 10 mm
E
2
4.20
3.93
B
C
p
2
w
M
AB
1
3.35
3.05
Q
3.33
3.03
FHp q
1.82
15.84
1.22
14.64
2
E1E
14.22
c
Q
U
1
20.47
20.17
U
5.18
4.98
E
w
0.51
w
1
2
1.02
2
OUTLINE
VERSION
SOT445C 97-05-23
IEC JEDEC EIAJ
REFERENCES
2000 Feb 01 7
EUROPEAN
PROJECTION
ISSUE DATE
Page 8
Philips Semiconductors Product specification
Microwave power transistor BLS3135-10
DEFINITIONS
Data Sheet Status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
2000 Feb 01 8
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Philips Semiconductors Product specification
Microwave power transistor BLS3135-10
NOTES
2000 Feb 01 9
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Philips Semiconductors Product specification
Microwave power transistor BLS3135-10
NOTES
2000 Feb 01 10
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Philips Semiconductors Product specification
Microwave power transistor BLS3135-10
NOTES
2000 Feb 01 11
Page 12
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Printed in The Netherlands 603516/01/pp12 Date of release: 2000 Feb 01 Document order number: 9397 750 06715
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