Datasheet BGA2712 Datasheet (Philips) [ru]

Page 1
DISCRETE SEMICONDUCTORS
DATA SH EET
ook, halfpage
MBD128
BGA2712
MMIC wideband amplifier
Product specification Supersedes data of 2002 Jan 31
2002 Sep 10
Page 2
Philips Semiconductors Product specification
MMIC wideband amplifier BGA2712

FEATURES

Internally matched to 50
Wide frequency range (3.2 GHz at 3 dB bandwidth)
Flat 21 dB gain (DC to 2.6 GHz at 1 dB flatness)
5 dBm saturated output power at 1 GHz
Good linearity (11 dBm IP3
at 1 GHz)
(out)
Unconditionally stable (K > 1.5).

APPLICATIONS

LNB IF amplifiers
Cable systems
ISM
General purpose.

DESCRIPTION

Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifierwith internal matching circuit in a 6-pin SOT363 SMD plastic package.

PINNING

PIN DESCRIPTION
1V
S
2, 5 GND2
3 RF out 4 GND1 6RFin
4
56
63
132
Top view
Marking code: E2-.
MAM455
Fig.1 Simplified outline (SOT363) and symbol.
1
2, 54

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
V I s
S
S
2
21
DC supply voltage 5 6 V DC supply current 12.3 mA
insertion power gain f = 1 GHz 21.3 dB NF noise figure f = 1 GHz 3.9 dB P
L(sat)
saturated load power f = 1 GHz 4.8 dBm

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
S
I
S
P
tot
T
stg
T
j
P
D
DC supply voltage RF input AC coupled 6V
supply current 35 mA
total power dissipation Ts≤ 90 °C 200 mW
storage temperature 65 +150 °C
operating junction temperature 150 °C
maximum drive power 10 dBm
CAUTION
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B.
2002 Sep 10 2
Page 3
Philips Semiconductors Product specification
MMIC wideband amplifier BGA2712

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-s

CHARACTERISTICS

=5V; IS= 12.3 mA; Tj=25°C; unless otherwise specified.
V
S
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
S
2
s
21
R
LIN
R
L OUT
2
s
12
NF noise figure f = 1 GHz 3.9 4.3 dB
BW bandwidth at s K stability factor f = 1 GHz 1.5 2 −−
P
L(sat)
P
L1dB
IP3
(in)
IP3
(out)
thermal resistance from junction to
P
= 200 mW; Ts≤ 90 °C 300 K/W
tot
solder point
supply current 9 12.3 15 mA
insertion power gain f = 100 MHz 20 20.8 22 dB
f = 1 GHz 20 21.3 22 dB f = 1.8 GHz 20 22 23 dB f = 2.2 GHz 20 22 23 dB f = 2.6 GHz 19 21.2 22 dB f = 3 GHz 16 19.3 21 dB
return losses input f = 1 GHz 12 14 dB
f = 2.2 GHz 8 10 dB
return losses output f = 1 GHz 17 20 dB
f = 2.2 GHz 15 18 dB
isolation f = 1.6 GHz 31 33 dB
f = 2.2 GHz 36 39 dB
f = 2.2 GHz 4.3 4.7 dB
2−3 dB below flat gain at 1 GHz 2.8 3.2 GHz
21
f = 2.2 GHz 2.5 3 −−
saturated load power f = 1 GHz 3 4.8 dBm
f = 2.2 GHz 0 1.3 dBm
load power at 1 dB gain compression; f = 1 GHz 2 0.2 dBm
at 1 dB gain compression; f = 2.2 GHz 4 2 dBm
input intercept point f = 1 GHz 12 10 dBm
f = 2.2 GHz 14 16 dBm
output intercept point f = 1 GHz 9 11 dBm
f = 2.2 GHz 4 6 dBm
2002 Sep 10 3
Page 4
Philips Semiconductors Product specification
MMIC wideband amplifier BGA2712

APPLICATION INFORMATION

Figure 2 shows a typical application circuit for the BGA2712MMIC.Thedeviceisinternallymatchedto50 , and therefore does not need any external matching. The value of the input and output DC blocking capacitors C2 and C3 should not be more than 100 pF for applications above 100 MHz. However, when the device is operated below 100 MHz, the capacitor value should be increased.
handbook, halfpage
DC-block
100 pF
input output
DC-block
100 pF
DC-block
100 pF
MGU437
The 22 nF supply decoupling capacitor C1 should be located as closely as possible to the MMIC.
Separate paths must be used for the ground planes of the groundpinsGND1andGND2,andthesepathsmustbeas short as possible. When using vias, use multiple vias per pin in order to limit ground path inductance.
V
handbook, halfpage
s
C1
V
s
RF input
C2 C3
RF outRF in
GND2GND1
RF output
MGU435
Fig.2 Typical application circuit.
Figure 3 shows two cascaded MMICs. This configuration doubles overall gain while preserving broadband characteristics. Supply decoupling and grounding conditions for each MMIC are the same as those for the circuit of Fig.2.
Fig.3 Easy cascading application circuit.
handbook, halfpage
from RF
circuit
handbook, halfpage
antenna
mixer
wideband
amplifier
oscillator
to IF circuit or demodulator
Fig.4 Application as IF amplifier.
LNA
mixer
wideband
amplifier
oscillator
to IF circuit or demodulator
Fig.5 Application as RF amplifier.
MGU438
MGU439
The excellent wideband characteristics of the MMIC make it an ideal building block in IF amplifier applications such as LBNs (see Fig.4).
As a buffer amplifier between an LNA and a mixer in a receiver circuit, the MMIC offers an easy matching, low noise solution (see Fig.5).
InFig.6theMMICisused as a driver to the power amplifier as part of a transmitter circuit. Good linear performance and matched input and output offer quick design solutions in such applications.
2002 Sep 10 4
handbook, halfpage
from modulation
or IF circuit
Fig.6 Application as driver amplifier.
oscillator
mixer
wideband
amplifier
to power amplifier
MGU440
Page 5
Philips Semiconductors Product specification
MMIC wideband amplifier BGA2712
handbook, full pagewidth
180°
IS= 12.3 mA; VS= 5 V; PD= 30 dBm; ZO=50Ω.
Fig.7 Input reflection coefficient (s11); typical values.
135°
+0.2
0
0.2
135°
+0.5
0.2 0.5
0.5
90°
+1
100 MHz
4 GHz
1
90°
+2
2 5
2
45°
45°
+5
5
MLD904
1.0
0.8
0.6
0.4
0.2
0°
0
1.0
handbook, full pagewidth
180°
IS= 12.3 mA; VS= 5 V; PD= 30 dBm; ZO=50Ω.
Fig.8 Output reflection coefficient (s22); typical values.
135°
+0.2
0
0.2
135°
+0.5
0.2 0.5
0.5
4 GHz
100 MHz
90°
+1
1
90°
+2
2 5
2
45°
45°
+5
5
MLD905
1.0
0.8
0.6
0.4
0.2
0°
0
1.0
2002 Sep 10 5
Page 6
Philips Semiconductors Product specification
MMIC wideband amplifier BGA2712
3000
MLD906
f (MHz)
handbook, halfpage
0
2
s
12
(dB)
10
20
30
40
50
0 1000
IS= 12.3 mA; VS= 5 V; PD= 30 dBm; ZO=50Ω.
2000 4000
Fig.9 Isolation(s122)asafunctionoffrequency;
typical values.
25
handbook, halfpage
2
s
21
(dB)
20
15
10
0
PD= 30 dBm; ZO=50Ω. (1) IS= 15.1 mA; VS= 5.5 V. (2) IS= 12.3 mA; VS=5V. (3) IS= 10.1 mA; VS= 4.5 V.
1000 2000 4000
3000
f (MHz)
Fig.10 Insertion gain (s212) as a function of
frequency; typical values.
MLD907
(1)
(2)
(3)
10
handbook, halfpage
P
L
(dBm)
5
0
5
10
30 20
f = 1 GHz; ZO=50Ω. (1) VS= 5.5 V. (2) VS=5V. (3) VS= 4.5 V.
10
MLD908
(1)
(2)
(3)
PD (dBm)
Fig.11 Load power as a function of drive power at
1 GHz; typical values.
10
handbook, halfpage
P
L
(dBm)
5
0
5
0
10
30 20
f = 2.2 GHz; ZO=50Ω. (1) VS= 5.5 V. (2) VS=5V. (3) VS= 4.5 V.
10
MLD909
(1) (2)
(3)
PD (dBm)
0
Fig.12 Load power as a function of drive power at
2.2 GHz; typical values.
2002 Sep 10 6
Page 7
Philips Semiconductors Product specification
MMIC wideband amplifier BGA2712
handbook, halfpage
6
NF
(dB)
5
4
3
2
0
ZO=50Ω. (1) IS= 15.1 mA; VS= 5.5 V. (2) IS= 12.3 mA; VS=5V. (3) IS= 10.1 mA; VS= 4.5 V.
1000 2000
(1)
(3) (2)
f (MHz)
Fig.13 Noise figure as a function of frequency;
typical values.
MLD902
3000
3000
MLD903
f (MHz)
10
handbook, halfpage
K
8
6
4
2
0
0
IS= 12.3 mA; VS= 5 V; ZO=50Ω.
1000 2000 4000
Fig.14 Stability factor as a function of frequency;
typical values.
2002 Sep 10 7
Page 8
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2002 Sep 10 8
Scattering parameters
VS=5V; IS= 12.3 mA; PD= 30 dBm; ZO=50Ω; T
amb
=25°C;
Philips Semiconductors Product specification
MMIC wideband amplifier BGA2712
f (MHz)
MAGNITUDE
(ratio)
s
11
ANGLE
(deg)
MAGNITUDE
(ratio)
s
21
ANGLE
(deg)
MAGNITUDE
(ratio)
s
12
ANGLE
(deg)
MAGNITUDE
(ratio)
s
22
ANGLE
FACTOR
(deg)
100 0.04752 13.48 10.9826 1.753 0.03355 2.342 0.07706 170.0 1.5 200 0.05643 22.73 11.0172 6.898 0.03308 7.340 0.07237 164.8 1.5 400 0.09546 39.62 11.0842 15.64 0.03111 15.47 0.07314 130.7 1.6 600 0.13547 37.16 11.1812 24.08 0.02829 21.84 0.07471 101.8 1.7
800 0.17466 32.62 11.3239 32.64 0.02501 26.57 0.08218 72.30 1.9 1000 0.20739 27.40 11.5760 41.38 0.02145 30.44 0.10113 47.04 2.0 1200 0.24036 23.23 11.8439 50.97 0.01788 31.20 0.11792 25.82 2.3 1400 0.26469 18.36 12.1222 61.14 0.01489 28.60 0.13314 10.96 2.6 1600 0.29368 13.54 12.3892 72.07 0.01262 22.41 0.14376 1.624 3.0 1800 0.31261 8.127 12.5808 83.89 0.01132 12.86 0.14606 13.51 3.2 2000 0.31986 1.984 12.6359 96.79 0.01102 2.369 0.13749 24.90 3.2 2200 0.32544 4.878 12.4802 110.7 0.01151 5.585 0.11928 37.21 3.1 2400 0.31554 13.05 12.2649 125.2 0.01238 9.990 0.08992 51.50 3.0 2600 0.29374 21.53 11.5087 139.8 0.01322 11.44 0.05626 68.53 3.1 2800 0.26599 28.39 10.4126 152.8 0.01362 10.70 0.02424 110.2 3.3 3000 0.21222 31.80 9.17830 163.8 0.01335 9.622 0.02731 159.1 4.0 3200 0.17076 31.52 8.12024 171.0 0.01239 10.22 0.04752 135.0 4.9 3400 0.14479 32.14 7.38827 176.5 0.01150 15.36 0.06279 132.1 5.8 3600 0.11730 35.25 6.96284 177.3 0.01108 19.97 0.07643 142.1 6.4 3800 0.08946 46.06 6.62125 171.3 0.01107 27.62 0.09760 153.5 6.7 4000 0.06606 64.65 6.32249 165.6 0.01178 34.46 0.12925 160.6 6.6
K-
Page 9
Philips Semiconductors Product specification
MMIC wideband amplifier BGA2712

PACKAGE OUTLINE

Plastic surface mounted package; 6 leads SOT363

D
y
56
pin 1 index
4
132
e
1
e
b
p
wBM
E
H
E
A
A
1
detail X
AB
Q
L
p
X
v M
A
c
0 1 2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
max
0.1
1
b
cD
p
0.30
0.25
0.20
0.10
IEC JEDEC EIAJ
2.2
1.8
E
1.35
1.15
REFERENCES
1.3
e
e
1
0.65
UNIT
A
1.1
mm
0.8
OUTLINE
VERSION
SOT363 SC-88
2002 Sep 10 9
H
E
2.2
2.0
L
p
0.45
0.15
Qywv
0.25
0.15
0.2 0.10.2
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
Page 10
Philips Semiconductors Product specification
MMIC wideband amplifier BGA2712

DATA SHEET STATUS

PRODUCT
DATA SHEET STATUS
Objective data Development This data sheet contains data from the objective specification for product
Preliminary data Qualification This data sheet contains data from the preliminary specification.
Product data Production This data sheet contains data from the product specification. Philips
(1)
STATUS
(2)

DEFINITIONS

development. Philips Semiconductors reserves the right to change the specification in any manner without notice.
Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product.
Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DEFINITIONS Short-form specification The data in a short-form
specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.
Limiting values definition  Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device attheseoratanyotherconditionsabovethosegiveninthe Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information  Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make norepresentationorwarrantythat such applications will be suitable for the specified use without further testing or modification.
DISCLAIMERS Life support applications These products are not
designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductorscustomersusingorselling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes  Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for theuseofanyoftheseproducts, conveys no licence or title under any patent, copyright, or mask work right to these products,andmakesnorepresentationsorwarrantiesthat these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2002 Sep 10 10
Page 11
Philips Semiconductors Product specification
MMIC wideband amplifier BGA2712
NOTES
2002 Sep 10 11
Page 12
Philips Semiconductors – a w orldwide compan y
Contact information
For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2002 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable andmaybechanged without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands 613516/02/pp12 Date of release: 2002 Sep 10 Document order number: 9397 750 10022
SCA74
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