Datasheet BFT25 Datasheet (Philips)

Page 1
DISCRETE SEMICONDUCTORS
DATA SH EET
BFT25
NPN 2 GHz wideband transistor
Product specification File under Discrete Semiconductors, SC14
November 1992
Page 2
NPN 2 GHz wideband transistor BFT25
DESCRIPTION
NPN transistor in a plastic SOT23 envelope.
It is primarily intended for use in RF low power amplifiers, such as in pocket phones, paging systems, etc. The transistor features low current
PINNING
PIN DESCRIPTION
Code: V1p 1 base 2 emitter 3 collector
page
3
consumption (100µA to 1 mA); due to its high transition frequency, it also has excellent wideband properties and low noise up to high frequencies.
12
Top view
MSB003
Fig.1 SOT23.
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
V
CBO
V
CEO
I
c
P
tot
f
T
C
re
G
UM
F noise figure I
collector-base voltage open emitter 8V collector-emitter voltage open base 5V DC collector current 6.5 mA total power dissipation up to Ts= 167 °C; note 1 30 mW transition frequency IC= 1 mA; VCE= 1 V; f = 500 MHz;
T
=25°C
amb
feedback capacitance IC= 1 mA; VCE= 1 V; f = 1 MHz;
=25°C
T
amb
maximum unilateral power gain IC= 1 mA; VCE= 1 V; f = 500 MHz;
T
=25°C
amb
= 1 mA; VCE= 1 V; f = 500 MHz;
C
T
=25°C
amb
2.3 GHz
0.45 pF
18 dB
3.8 dB
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
EBO
I
C
I
CM
P
tot
T
stg
T
j
collector-base voltage open emitter 8V collector-emitter voltage open base 5V emitter-base voltage open collector 2V DC collector current 6.5 mA peak collector current f > 1 MHz 10 mA total power dissipation up to Ts= 167 °C; note 1 30 mW storage temperature 65 150 °C junction temperature 175 °C
Note
is the temperature at the soldering point of the collector tab.
1. T
s
November 1992 2
Page 3
NPN 2 GHz wideband transistor BFT25
THERMAL RESISTANCE
SYMBOL PARAMETER CONDITIONS THERMAL RESISTANCE
R
th j-s
thermal resistance from junction to soldering point
Note
= is the temperature at the soldering point of the collector tab.
1. T
s
CHARACTERISTICS
= 25 °C unless otherwise specified.
T
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
CBO
h
FE
f
T
C
c
C
e
C
re
G
UM
F noise figure I
collector cut-off current IE = 0; VCB = 5 V −−50 nA DC current gain IC = 10 µA; VCE = 1 V 20 30
I
= 1 mA; VCE = 1 V 20 40
C
transition frequency IC= 1 mA; VCE= 1 V; f = 500 MHz 1.2 2.3 GHz collector capacitance IE=ie= 0; VCB= 0.5 V; f = 1 MHz −− 0.6 pF emitter capacitance Ic=ic=0;VEB = 0; f = 1 MHz −−0.5 pF feedback capacitance IC= 1 mA; VCE= 1 V; f = 1 MHz;
T
amb
maximum unilateral power gain (note 1)
IC= 1 mA; VCE= 1 V; f = 500 MHz; T
amb
I
= 1 mA; VCE= 1 V; f = 800 MHz;
C
T
amb
= 0.1 mA; VCE=1V;
C
f = 500 MHz; T I
= 1 mA; VCE= 1 V; f = 500 MHz;
C
T
amb
up to Ts= 167°C; note 1 260 K/W
−− 0.45 pF
=25°C
18 dB
=25°C
12 dB
=25°C
5.5 dB
=25°C
amb
3.8 dB
=25°C
Note
1. G
is the maximum unilateral power gain, assuming S12is zero and
UM
G
UM
--------------------------------------------------------------
10 log

1S

2
S
21
2

1S

11
22
dB.=
2
November 1992 3
Page 4
NPN 2 GHz wideband transistor BFT25
110
MEA908
I (mA)
C
60
handbook, halfpage
h
FE
40
20
0
–3
10
VCE= 1 V; Tj=25°C.
–2
10
–1
Fig.2 DC current gain as a function of collector
current.
1
C
c
(pF)
0.8
0.6
0.4
0.2
0
10
024 8
IE=ie= 0; f = 1 MHz; Tj=25°C.
6
MEA914
V
CB
10
(V)
Fig.3 Collector capacitance as a function of
collector-base voltage.
1.5
MEA907
I (mA)
C
handbook, halfpage
3
f
T
(GHz)
2
1
0
0 0.5 1 2
VCE= 1 V; f = 500 MHz; Tj=25°C.
Fig.4 Transition frequency as a function of
collector current.
November 1992 4
handbook, halfpage
8
F
(dB)
6
4
2
0
–2
10
VCE= 1 V; ZS= opt.; f = 500 MHz; T
–1
amb
110
=25°C.
I (mA)
C
Fig.5 Minimum noise figure as a function of
collector current.
MEA909
10
Page 5
NPN 2 GHz wideband transistor BFT25
handbook, full pagewidth
IC= 1 mA; VCE = 1 V; T
=50Ω.
Z
o
amb
+ j
– j
=25°C.
1
0.5
0.2
0
0.2
0.5
10.2 10520.5
800 MHz
1
2
5
200
500
5
2
MEA916
Fig.6 Common emitter input reflection coefficient (S11).
10
10
handbook, full pagewidth
IC= 1 mA; VCE = 1 V; T
90°
60°
1
60°
amb
=25°C.
180°
150°
150°
200
120°
120°
500
800 MHz
90°
Fig.7 Common emitter forward transmission coefficient (S21).
30°
2 3
30°
MEA918
+ ϕ
0°
− ϕ
November 1992 5
Page 6
NPN 2 GHz wideband transistor BFT25
handbook, full pagewidth
IC= 1 mA; VCE = 1 V; T
amb
90°
120°
150°
200
180°
150°
120°
90°
=25°C.
60°
800 MHz
500
0.1
60°
Fig.8 Common emitter reverse transmission coefficient (S12).
30°
0.150.05
30°
MEA917
+ ϕ
0°
− ϕ
handbook, full pagewidth
IC= 1 mA; VCE = 1 V; T
=50Ω.
Z
o
amb
1
0.5
0.2
+ j
0
– j
0.2
0.5
=25°C.
10.2 10520.5
800 MHz
1
Fig.9 Common emitter output reflection coefficient (S22).
2
5
10
200
10
500
5
2
MEA915
November 1992 6
Page 7
NPN 2 GHz wideband transistor BFT25
PACKAGE OUTLINE
Plastic surface mounted package; 3 leads SOT23
D
3
A
A
1
12
e
1
b
p
e
w M
B
E
H
E
detail X
AB
Q
L
p
X
v M
A
c
0 1 2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
0.1
b
cD
p
0.48
0.15
3.0
0.38
0.09
IEC JEDEC EIAJ
2.8
1.4
1.2
e
E
1.9
REFERENCES
0.95
e
1
UNIT
mm
A
1.1
0.9
OUTLINE
VERSION
SOT23
max.
November 1992 7
H
2.5
2.1
L
Qwv
p
E
0.55
0.45
0.15
0.45
0.2
0.1
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
Page 8
NPN 2 GHz wideband transistor BFT25
DEFINITIONS
Data Sheet Status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
November 1992 8
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