Product specification
File under Discrete Semiconductors, SC14
November 1992
Page 2
Philips SemiconductorsProduct specification
NPN 9 GHz wideband transistorBFS540
FEATURES
• High power gain
• Low noise figure
• High transition frequency
• Gold metallization ensures
excellent reliability
PINNING
PINDESCRIPTION
Code: N4
1base
2emitter
3collector
handbook, 2 columns
3
• SOT323 envelope.
12
DESCRIPTION
Top view
MBC870
NPN transistor in a plastic SOT323
envelope.
Fig.1 SOT323.
It is intended for RF wideband
amplifier applications such as satellite
TV systems and RF portable
communication equipment with signal
frequencies up to 2 GHz.
QUICK REFERENCE DATA
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
CBO
V
CEO
I
C
P
tot
h
FE
f
T
G
UM
Fnoise figureI
collector-base voltageopen emitter−− 20V
collector-emitter voltageopen base−− 15V
DC collector current−− 120mA
total power dissipationup to Ts=80°C; note 1−− 500mW
DC current gainIC= 40 mA; VCE= 8 V; Tj=25°C60120250
transition frequencyIC= 40 mA; VCE= 8 V; f = 1 GHz;
T
=25°C
amb
maximum unilateral power gainIC= 40 mA; VCE= 8 V; f = 900 MHz;
T
=25°C
amb
= 10 mA; VCE= 8 V; f = 900 MHz;
C
T
=25°C
amb
−9−GHz
−14−dB
−1.31.7dB
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
V
V
I
P
T
T
CBO
CES
EBO
C
tot
stg
j
collector-base voltageopen emitter−20V
collector-emitter voltageRBE=0−15V
emitter-base voltageopen collector−2.5V
DC collector current−120mA
total power dissipationup to Ts=80°C; note 1−500mW
storage temperature−65150°C
junction temperature−175°C
Note
is the temperature at the soldering point of the collector tab.
1. T
s
November 19922
Page 3
Philips SemiconductorsProduct specification
NPN 9 GHz wideband transistorBFS540
THERMAL RESISTANCE
SYMBOLPARAMETERCONDITIONS
R
th j-s
thermal resistance from junction to
up to Ts=80°C; note 1190 K/W
THERMAL
RESISTANCE
soldering point
Note
is the temperature at the soldering point of the collector tab.
1. T
s
CHARACTERISTICS
T
=25°C, unless otherwise specified.
j
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
I
CBO
h
FE
C
e
C
c
C
re
f
T
G
UM
2
S
21
Fnoise figureΓ
P
L1
collector cut-off currentIE= 0; VCE=8 V−−50nA
DC current gainIC= 40 mA; VCE= 8 V60120250
emitter capacitanceIC=ic= 0; VEB= 0.5 V; f = 1 MHz−2−pF
collector capacitanceIE=ie= 0; VCB= 8 V; f = 1 MHz−0.9−pF
feedback capacitanceIC= 0; VCB= 8 V; f = 1 MHz−0.6−pF
transition frequencyIC= 40 mA; VCE= 8 V; f = 1 GHz;
T
=25°C
amb
maximum unilateral power gain
(note 1)
IC= 40 mA; VCE= 8 V; f = 900 MHz;
T
=25°C
amb
I
= 40 mA; VCE= 8 V; f = 2 GHz;
C
T
=25°C
amb
insertion power gainIC= 40 mA; VCE= 8 V; f = 900 MHz;
T
=25°C
amb
output power at 1 dB gain
compression
= Γ
s
f = 900 MHz; T
Γ
= Γ
s
f = 900 MHz; T
Γ
= Γ
s
f = 2 GHz; T
Ic= 40 mA; VCE= 8 V; RL=50Ω;
f = 900 MHz; T
= 10 mA; VCE=8 V;
opt;IC
amb
= 40 mA; VCE=8 V;
opt;IC
amb
= 10 mA; VCE=8 V;
opt;IC
=25°C
amb
amb
=25°C
=25°C
=25°C
−9−GHz
−14−dB
−8−dB
1213−dB
−1.31.8dB
−1.92.4dB
−2.1−dB
−21−dBm
ITOthird order intercept pointnote 2−34−dBm
Notes
1. G
2. I
is the maximum unilateral power gain, assuming S12is zero and
In Figs 6 to 9, GUM= maximum unilateral power gain;
MSG = maximum stable gain; G
gain.
20
handbook, halfpage
G
UM
(dB)
16
V = 8 V
CE
12
4 V
= maximum available
max
MRC007
15
handbook, halfpage
gain
(dB)
10
MRC006
G
max
G
UM
8
4
0
0 1020304050
f = 900 MHz; T
amb
=25°C.
I (mA)
C
Fig.6Maximum unilateral power gain as a
function of collector current.
50
handbook, halfpage
gain
(dB)
40
G
UM
30
MSG
20
MRC004
5
0
0 204060
VCE= 8 V; f = 2 GHz; T
amb
=25°C.
Fig.7 Gain as a function of collector current.
50
handbook, halfpage
gain
(dB)
40
30
20
G
MSG
UM
I (mA)
C
MRC005
G
10
0
−2
10
IC= 10 mA; VCE= 8 V; T
10
−1
amb
=25°C.
max
110
f (GHz)
Fig.8 Gain as a function of frequency.
November 19925
10
0
−2
10
IC= 40 mA; VCE= 8 V; T
10
amb
−1
=25°C.
Fig.9 Gain as a function of frequency.
G
max
110
f (GHz)
Page 6
Philips SemiconductorsProduct specification
NPN 9 GHz wideband transistorBFS540
handbook, halfpage
4
F
(dB)
3
f =
2 GHz
2
900 MHz
1
500 MHz
0
11010
VCE= 8 V; T
amb
=25°C.
I (mA)
C
Fig.10 Minimum noise figure as a function of
collector current.
MRC009
2
handbook, halfpage
4
F
(dB)
3
2
1
0
−1
10
VCE= 8 V; T
amb
=25°C.
I =
C
40 mA
10 mA
110
f (GHz)
Fig.11 Minimum noise figure as a function of
frequency.
MRC003
November 19926
Page 7
Philips SemiconductorsProduct specification
NPN 9 GHz wideband transistorBFS540
handbook, full pagewidth
90°
1.0
0.8
0.6
pot. unst.
region
135°
0.5
1
45°
2
IC= 10 mA; VCE= 8 V;
f = 900 MHz; Z
handbook, full pagewidth
o
=50Ω.
stability
circle
180°
0.2
0.20.5125
0
0.2
−135°
F = 2 dB
F = 3 dB
0.5
F
= 1. 3 dB
min
Γ
OPT
F = 1.5 dB
1
−90°
Fig.12 Noise circle.
90°
1
135°
0.5
5
5
2
−45°
MRC079
45°
2
0.4
0.2
0°
0
1.0
1.0
0.8
0.6
0.2
F = 3 dB
F
min
Γ
0.5
OPT
F = 2.5 dB
= 2. 1 dB
−90°
IC= 10 mA; VCE= 8 V;
f = 2 GHz; Z
=50Ω.
o
G
max
180°
= 8.7 dB
0.20.5125
0
Γ
MS
G = 8 dB
0.2
G = 7 dB
G = 6 dB
−135°
Fig.13 Noise circle.
November 19927
F = 4 dB
1
5
5
2
−45°
MRC080
0.4
0.2
0°
0
1.0
Page 8
Philips SemiconductorsProduct specification
NPN 9 GHz wideband transistorBFS540
handbook, full pagewidth
IC= 40 mA; VCE= 8 V;
=50Ω.
Z
o
90°
1
180°
135°
0
0.2
−135°
0.5
0.2
3 GHz
0.20.5125
0.5
1
−90°
2
40 MHz
2
45°
−45°
Fig.14 Common emitter input reflection coefficient (S11).
5
5
MRC062
1.0
0.8
0.6
0.4
0.2
0°
0
1.0
handbook, full pagewidth
IC= 40 mA; VCE= 8 V.
90°
135°
45°
40 MHz
−90°
3 GHz
0°
−45°
MRC063
180°
5040302010
−135°
Fig.15 Common emitter forward transmission coefficient (S21).
November 19928
Page 9
Philips SemiconductorsProduct specification
NPN 9 GHz wideband transistorBFS540
handbook, full pagewidth
IC= 40 mA; VCE= 8 V.
90°
135°
45°
3 GHz
180°
0.50.40.30.20.1
−135°
40 MHz
−45°
−90°
0°
MRC064
Fig.16 Common emitter reverse transmission coefficient (S12).
handbook, full pagewidth
IC= 40 mA; VCE= 8 V;
=50Ω.
Z
o
90°
1
180°
135°
0
0.5
0.2
0.20.5125
45°
2
5
3 GHz
40 MHz
0.2
−135°
0.5
2
1
−90°
5
−45°
MRC065
Fig.17 Common emitter output reflection coefficient (S22).
1.0
0.8
0.6
0.4
0.2
0°
0
1.0
November 19929
Page 10
Philips SemiconductorsProduct specification
NPN 9 GHz wideband transistorBFS540
PACKAGE OUTLINE
Plastic surface mounted package; 3 leadsSOT323
D
y
3
A
12
e
b
1
p
e
w M
B
E
H
E
A
1
detail X
AB
Q
L
p
X
v M
A
c
012 mm
scale
DIMENSIONS (mm are the original dimensions)
A
max
0.1
1
b
cD
p
0.4
0.25
0.10
2.2
1.8
0.3
IEC JEDEC EIAJ
E
1.35
1.15
REFERENCES
1.3
e
e
1
0.65
UNIT
A
1.1
mm
0.8
OUTLINE
VERSION
SOT323SC-70
November 199210
H
E
2.2
2.0
L
p
0.45
0.15
Qwv
0.23
0.13
0.20.2
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
Page 11
Philips SemiconductorsProduct specification
NPN 9 GHz wideband transistorBFS540
DEFINITIONS
Data Sheet Status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
November 199211
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