Datasheet BFQ270 Datasheet (Philips)

Page 1
DISCRETE SEMICONDUCTORS
DATA SH EET
BFQ270
NPN 6 GHz wideband transistor
Product specification File under Discrete Semiconductors, SC14
September 1995
Page 2
NPN 6 GHz wideband transistor BFQ270
FEATURES
High power gain
Emitter-ballasting resistors for
good thermal stability
Gold metallization ensures excellent reliability.
DESCRIPTION
PINNING
PIN DESCRIPTION
1 collector 2 emitter 3 base 4 emitter
age
4
3
1
Silicon NPN transistor mounted in a 4-lead dual-emitter SOT172A1. envelope with a ceramic cap. All
Top view
2
MBC869
leads are isolated from the mounting base.
It is primarily intended for use in MATV and CATV amplifiers.
Fig.1 SOT172A1.
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
CBO
V
CEO
I
C
P
tot
h
FE
f
T
G
UM
V
O
collector-base voltage open emitter −−25 V collector-emitter voltage open base −−19 V DC collector current −−500 mA total power dissipation up to Tc = 100 °C −−10 W DC current gain IC = 240 mA; VCE = 18 V; Tj = 25 °C60−− transition frequency IC = 240 mA; VCE = 18 V; f = 1 GHz;
T
= 25 °C
amb
maximum unilateral power gain IC = 240 mA; VCE = 18 V;
f = 800 MHz; T
amb
= 25 °C
output voltage dim = 60 dB; IC= 240 mA;
6 GHz
10 dB
1.6 V
VCE = 18 V; RL = 75 ; f
= 793.25 MHz
(p+q-r)
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO discs are not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste.
September 1995 2
Page 3
NPN 6 GHz wideband transistor BFQ270
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
EBO
I
C
P
tot
T
stg
T
j
THERMAL RESISTANCE
SYMBOL PARAMETER THERMAL RESISTANCE
R
th j-c
collector-base voltage open emitter 25 V collector-emitter voltage open base 19 V emitter-base voltage open collector 2V DC collector current 500 mA total power dissipation up to Tc = 100 °C 10 W storage temperature 65 150 °C junction temperature 200 °C
thermal resistance from junction to case 10 K/W
CHARACTERISTICS
T
= 25 °C unless otherwise specified.
j
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
CBO
h C C C C f
T
G
V d
FE
c e re cs
UM
O 2
collector cut-off current IE = 0; VCB = 18 V −−100 µA DC current gain IC = 240 mA; VCE = 18 V 60 110 collector capacitance IE = ie = 0; VCB = 18 V; f = 1 MHz 3.6 pF emitter capacitance IC = ic = 0; VEB = 0.5 V; f = 1 MHz 11 pF feedback capacitance IC = 0; VCB = 18 V; f = 1 MHz 2 2.6 pF collector-stud capacitance 1.2 pF transition frequency IC = 240 mA; VCE = 18 V; f = 1 GHz;
T
= 25 °C
amb
maximum unilateral power gain (note 1)
IC = 240 mA; VCE = 18 V; f = 500 MHz; T
I
= 240 mA; VCE = 18 V; f = 1 GHz;
C
T
= 25 °C
amb
amb
= 25 °C
4.5 6 GHz
16 dB
10 dB
output voltage note 2 1.6 V second order intermodulation
note 3 −−50 dB
distortion
Notes
1. G
is the maximum unilateral power gain, assuming S12 is zero and
UM
2. dim = 60 dB (DIN 45004); IC = 240 mA; VCE = 18 V; RL = 75 ;
=
G
UM
--------------------------------------------------------------
10 log

1
S

2
S
21
2

1
S

11
22
dB
2
Vp = VO;fp = 795.25 MHz; Vq = VO−6 dB; fq = 803.25 MHz; Vr = VO−6 dB; fr = 805.25 MHz; measured at f
= 793.25 MHz.
(p+qr)
3. IC = 240 mA; VCE = 18 V; RL = 75 ;
Vp= Vq = VO = 50.5 dBmV = 335 mV; f
= 810 MHz; fp = 250 MHz; fq= 560 MHz.
(p+q)
˙
September 1995 3
Page 4
,
NPN 6 GHz wideband transistor BFQ270
L2
MBB488
V
CC
(1)
C8
C5 L6
C9
output
n–75
C6
handbook, full pagewidth
input
n–75
(1) +Vcis equivalent to VCE=Vc−Ic(A) ×17.
C1
V
bias
C7
R6
C2L1
L2
L1
R5
L3
C3
R1
C4
L4
L5
DUT
R2 R3 R4
Fig.2 Intermodulation and second order intermodulation distortion test circuit.
List of components (see test circuit)
DESIGNATION DESCRIPTION VALUE DIMENSIONS CATALOGUE NO.
C1 miniature ceramic plate capacitor 0.82 pF 2222 680 03827 C2, C5, C7, C8 multilayer ceramic capacitor 10 nF 2222 852 47103 C3 multilayer ceramic chip capacitor 2.2 pF 2222 855 12228 C4 (note 1) miniature ceramic plate capacitor 1 nF 2222 630 08102 C6 miniature ceramic plate capacitor 1.2 pF 2222 680 03128 C9 electrolytic capacitor 4.7 µF 2222 014 28478 L1 (note 1) 4.5 turns loosely wound 0.4 mm
enamelled copper wire
35 nH internal coil diameter
2 mm L2 Ferroxcube choke 5 µH 3122 108 20153 ML1, ML6 microstripline 75 width 2.46 mm;
length 9 mm ML2, ML5 microstripline 75 width 2.46 mm;
length 22 mm ML3, ML4 microstripline 145 width 0.5 mm;
length 12 mm R1, R2, R3, R4 metal film resistor 68 type MR25 2322 151 76819 R5 (note 1) metal film resistor 240 type SFR16T 2322 180 73241 R6 metal film resistor 10 k type SFR16T 2322 180 73103
Note
1. Components C4, L1, and R5 are mounted in a cavity in the brass ground plate.
The circuit is constructed on a printed circuit board and 10 mm thick brass ground plate, with a relative dielectric constant
= 2.2), thickness 1.57 mm; thickness of copper 0.017 mm (E.G. Rogers’ RT/Duroid 5880).
of (ε
r
September 1995 4
Page 5
NPN 6 GHz wideband transistor BFQ270
V
V
bias
R6
C7
R5
R3 R4
L1
C4
C9
CC
C8
L2
handbook, full pagewidth
input
n–75
L1
C2
C1
copper straps
L4L3
L2
C3
R2
R1
80 mm
L5
C5
C6
L6
MBB487
output
n–75
mounting screw
(4 x M2.5)
Fig.3 Intermodulation test circuit printed circuit board.
September 1995 5
70 mm
MBB486
Page 6
NPN 6 GHz wideband transistor BFQ270
14
handbook, halfpage
P
tot
(W)
12
8
4
0
0 50 100 200
150
T
case
Fig.4 Power derating curve.
MRA747
(oC)
150
handbook, halfpage
h
FE
100
50
0
0
VCE= 18 V; Tj=25°C.
100 500200 300 400
MRA746
IC (mA)
Fig.5 DC current gain as a function of collector
current.
handbook, halfpage
5
C
re
(pF)
4
3
2
1
0
020
ic = 0; f = 1 MHz.
4 8 12 16
MRA736
VCB (V)
Fig.6 Feedback capacitance as a function of
collector-base voltage.
September 1995 6
handbook, halfpage
8
f
T
(GHz)
6
4
2
0
0 100 500
f = 1 GHz; T
amb
=25°C.
200 300 400
V
CE =
Fig.7 Transition frequency as a function of
collector current.
MRA741
18 V
12 V
IC (mA)
Page 7
NPN 6 GHz wideband transistor BFQ270
25
handbook, halfpage
gain (dB)
20
15
10
5
0
0 200
VCE= 12 V.
G
max
G
UM
G
UM
G
max
400 600
Fig.8 Gain as a function of collector current.
500 MHz
1 GHz
IC (mA)
MRA743
25
handbook, halfpage
gain (dB)
20
15
10
5
0
0 200
VCE= 18 V.
MSG
G G
G
G
max
UM
UM
max
400 600
Fig.9 Gain as a function of collector current.
MRA745
500 MHz
1 GHz
IC (mA)
50
handbook, halfpage
gain (dB)
40
30
20
10
0
2
10
Ic= 240 mA; VCE= 12 V.
MSG
G
UM
G
max
1
10
110
MRA744
f (GHz)
Fig.10 Gain as a function of frequency.
September 1995 7
50
handbook, halfpage
gain (dB)
40
30
20
10
0
2
10
Ic= 240 mA; VCE= 18 V.
Fig.11 Gain as a function of frequency.
MSG
MRA742
G
UM
G
max
1
10
110
f (GHz)
Page 8
NPN 6 GHz wideband transistor BFQ270
30
handbook, halfpage
d
im
MRA739
(dB)
40
50
60
70
75 125 175
225
IC (mA)
3-tone dim;(VCE= 18 V);
= 445.25 MHz; Vo= 65.11 dBmV (1.8 V);
f
p
= 453.25 MHz; Vo= 59.11 dBmV;
f
q
= 455.25 MHz; Vo= 59.11 dBmV;
f
r
= 443.25 MHz.
f
(p+q-r)
Fig.12 Intermodulation distortion as a function of
collector current.
275
30
handbook, halfpage
d
im
MRA740
(dB)
40
50
60
70
75 125 175
225
IC (mA)
3-tone dim;(VCE= 18 V);
= 795.25 MHz; Vo= 64.08 dBmV (1.6 V);
f
p
= 803.25 MHz; Vo= 58.08 dBmV;
f
q
= 805.25 MHz; Vo= 58.08 dBmV;
f
r
= 793.25 MHz.
f
(p+q-r)
Fig.13 Intermodulation distortion as a function of
collector current.
275
30
handbook, halfpage
d
2
MRA738
(dB)
40
50
60
70
80
75 325
125 175 225 275
IC (mA)
VCE= 18 V;
= 50 MHz; Vo= 50.5 dBmV (0.335 V);
f
p
= 400 MHz; Vo= 50.5 dBmV;
f
q
= 450 MHz.
f
(p+q)
Fig.14 Second order intermodulation distortion as
a function of collector current.
30
handbook, halfpage
d
2
MRA737
(dB)
40
50
60
70
80
75 325
125 175 225 275
IC (mA)
VCE= 18 V;
= 250 MHz; Vo= 50.5 dBmV (0.335 V);
f
p
= 560 MHz; Vo= 50.5 dBmV;
f
q
= 810 MHz.
f
(p+q)
Fig.15 Second order intermodulation distortion as
a function of collector current.
September 1995 8
Page 9
NPN 6 GHz wideband transistor BFQ270
handbook, full pagewidth
Ic= 240 mA; VCE= 18 V.
=50Ω.
Z
o
1
0.5 3 GHz
0.2
+ j
0
– j
0.2 40 MHz
0.5
10.2 10520.5
1
2
2
Fig.16 Common emitter input reflection coefficient (S11).
5
10
10
5
MBB484
handbook, full pagewidth
Ic= 240 mA; VCE= 18 V.
90°
60°
30°
0°
30°
60°
MBB482
180°
150°
150°
40 MHz
40 2050 30 10
120°
120°
3 GHz
90°
Fig.17 Common emitter forward transmission coefficient (S21).
+ ϕ
− ϕ
September 1995 9
Page 10
NPN 6 GHz wideband transistor BFQ270
handbook, full pagewidth
Ic= 240 mA; VCE= 18 V.
90°
120°
150°
60°
30°
3 GHz
+ ϕ
180°
0.4 0.20.5 0.3 0.1
150°
120°
40 MHz
90°
0°
− ϕ
30°
60°
MBB483
Fig.18 Common emitter reverse transmission coefficient (S12).
handbook, full pagewidth
Ic= 240 mA; VCE= 18 V. Zo=50Ω.
1
0.5
0.2
+ j
0
– j
0.2
0.5
3 GHz
10.2 10520.5
40 MHz
1
2
2
MBB485
Fig.19 Common emitter output reflection coefficient (S22).
5
10
10
5
September 1995 10
Page 11
NPN 6 GHz wideband transistor BFQ270
PACKAGE OUTLINE
Studded ceramic package; 4 leads SOT172A1
D
A
Q
D
N
2
N
N
3
1
D
2
A
w
M
1
X
c
A
M
M
1
W
H
b
4
b
1
H
1
3
2
0 5 10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
UNIT
mm
inches
A W
3.31
3.04
0.130
0.120
0.89
0.63
0.035
0.025
5.31
4.34
0.209
0.171
c
b
1
0.16
0.10
0.006
0.004
Db
5.20
4.95
0.205
0.195
D
5.33
5.08
0.210
0.200
D
2
1
5.33
26.17
5.08
24.63
1.03
0.210
0.97
0.200
MH
3.05
2.79
0.12
0.11
M
1.66
1.39
0.065
0.055
1
N
11.82
10.89
0.465
0.429
N
2
8.89
6.90
0.350
0.272
N
3
3.69
2.92
0.145
0.115
detail X
Q
2.90
2.31
0.114
0.091
8-32 UNC
w
0.38
0.015
1
OUTLINE
VERSION
SOT172A1
IEC JEDEC EIAJ
REFERENCES
September 1995 11
EUROPEAN
PROJECTION
ISSUE DATE
97-06-28
Page 12
NPN 6 GHz wideband transistor BFQ270
DEFINITIONS
Data Sheet Status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
September 1995 12
Loading...