Datasheet BFQ251A, BFQ251 Datasheet (Philips)

Page 1
DATA SH EET
Product specification Supersedes data of 1997 Oct 02
1998 Oct 06
DISCRETE SEMICONDUCTORS
BFQ251
PNP video transistor
ook, halfpage
M3D186
Page 2
1998 Oct 06 2
Philips Semiconductors Product specification
PNP video transistor BFQ251
FEATURES
High breakdown voltages
Low output capacitance
High gain bandwidth
Good thermal stability
Gold metallization ensures
excellent reliability.
APPLICATIONS
Buffer/driver in high-resolution colour graphics monitors.
DESCRIPTION
PNP video transistor in a SOT54 (TO-92) plastic package. NPN complement: BFQ231.
PINNING
PIN DESCRIPTION
1 base 2 collector 3 emitter
Fig.1 Simplified outline
(SOT54; TO-92).
age
1
3
2
MSB033
QUICK REFERENCE DATA
Note
1. T
s
is the temperature at the soldering point of the collector pin, 4 mm from the body.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Notes
1. T
s
is the temperature at the soldering point of the collector pin, 4 mm from the body.
2. Transistor mounted on a printed-circuit board with a metallized pad area of 10 mm2.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
CBO
collector-base voltage open emitter −−−100 V
V
CER
collector-emitter voltage RBE= 100 −−−95 V
I
C
collector current (DC) −−−300 mA
P
tot
total power dissipation Ts≤ 65 °C; note 1 −−1W
h
FE
DC current gain IC= 50 mA; VCE= 10 V 20 30
f
T
transition frequency IC= 50 mA; VCE= 10 V; T
amb
=25°C 1 1.3 GHz
SYMBOL P ARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
collector-base voltage open emitter −−100 V
V
CEO
collector-emitter voltage open base −−65 V
V
CER
collector-emitter voltage RBE= 100 Ω−95 V
V
EBO
emitter-base voltage open collector −−3V
I
C
collector current (DC) −−300 mA
P
tot
total power dissipation Ts≤ 65 °C; notes 1 and 2; see Fig.3 1W
T
stg
storage temperature 65 +150 °C
T
j
junction temperature 150 °C
Page 3
1998 Oct 06 3
Philips Semiconductors Product specification
PNP video transistor BFQ251
THERMAL CHARACTERISTICS
Note
1. Ts is the temperature at the soldering point of the collector pin, 4 mm from the body.
CHARACTERISTICS
T
j
=25°C unless otherwise specified.
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-s
thermal resistance from junction to soldering point note 1 85 K/W
R
th j-a
thermal resistance from junction to ambient 185 K/W
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)CBO
collector-base breakdown voltage IC= 0.1 mA; IE=0 −100 −−V
V
(BR)CEO
collector-emitter breakdown voltage IC= 10 mA; IB=0 −65 −−V
V
(BR)CER
collector-emitter breakdown voltage IC= 10 mA; RBE= 100 Ω−95 −−V
V
(BR)EBO
emitter-base breakdown voltage IE= 0.1 mA; IC=0 −3 −−V
I
CES
collector-emitter cut-off current IB= 0; VCE= 50 V −−−100 µA
I
CBO
collector-base cut-off current IE= 0; VCB= 50 V −−−20 µA
h
FE
DC current gain IC= 50 mA; VCE= 10 V; see Fig.4 20 30
C
cb
collector-base capacitance IC=ic= 0; VCB= 10 V; f = 1 MHz;
see Fig.5
2 pF
f
T
transition frequency IC= 50; VCE= 10 V; see Fig.6 1 1.3 GHz
Fig.2 DC SOAR.
T
amb
=25°C.
handbook, halfpage
0 40 100
400
300
100
0
200
MEA232 - 1
20 60 80
I
C
(mA)
V
CEO
(V)
Fig.3 Power derating curve.
handbook, halfpage
0 50 100 200
0.8
0.6
0.2
0
0.4
MEA228 - 1
150
1.0
1.2
Ts (oC)
P
tot
(W)
Page 4
1998 Oct 06 4
Philips Semiconductors Product specification
PNP video transistor BFQ251
Fig.4 DC current gain as a function of collector
current; typical values.
VCE= 10V; T
amb
=25°C.
handbook, halfpage
0
20
0 100 200 300
MEA231
40
30
10
h
FE
IC (mA)
f = 1 MHz; T
amb
=25°C.
Fig.5 Collector-base capacitance as a function of
collector-base voltage; typical values.
handbook, halfpage
0
2
0
10 20 40
MEA229
30
6
4
C
cb
(pF)
VCB (V)
VCE= 10 V; T
amb
=25°C.
Fig.6 Transition frequency as a function of
collector current; typical values.
handbook, halfpage
0
1.5
1
0.5
0
50 100 150
IC (mA)
f
r
(GHz)
MBK897
Page 5
1998 Oct 06 5
Philips Semiconductors Product specification
PNP video transistor BFQ251
PACKAGE OUTLINE
UNIT
A
REFERENCES
OUTLINE VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
5.2
5.0
b
0.48
0.40
c
0.45
0.40
D
4.8
4.4
d
1.7
1.4
E
4.2
3.6
L
14.5
12.7
e
2.54
e
1
1.27
L
1
(1)
2.5
b
1
0.66
0.56
DIMENSIONS (mm are the original dimensions)
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
SOT54 TO-92 SC-43
97-02-28
A L
0 2.5 5 mm
scale
b
c
D
b
1
L
1
d
E
Plastic single-ended leaded (through hole) package; 3 leads SOT54
e
1
e
1
2
3
Page 6
1998 Oct 06 6
Philips Semiconductors Product specification
PNP video transistor BFQ251
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Page 7
1998 Oct 06 7
Philips Semiconductors Product specification
PNP video transistor BFQ251
NOTES
Page 8
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