Datasheet BDX53B, BDX54B, BDX54C, BDX53C Datasheet (ON Semiconductor)

Page 1
BDX53B, BDX53C (NPN), BDX54B, BDX54C (PNP)
Plastic Medium-Power Complementary Silicon Transistors
These devices are designed for general-purpose amplifier and
low-speed switching applications.
Features
High DC Current Gain -
hFE = 2500 (Typ) @ IC = 4.0 Adc
Collector Emitter Sustaining Voltage - @ 100 mAdc
V
CEO(sus)
V
CEO(sus)
Low Collector-Emitter Saturation Voltage -
V
CE(sat)
V
CE(sat)
Monolithic Construction with Built-In Base-Emitter Shunt Resistors
Pb-Free Packages are Available*
= 80 Vdc (Min) - BDX53B, 54B = 100 Vdc (Min) - BDX53C, 54C
= 2.0 Vdc (Max) @ IC = 3.0 Adc = 4.0 Vdc (Max) @ IC = 5.0 Adc
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DARLINGTON
8 AMPERE
COMPLEMENTARY SILICON
POWER TRANSISTORS
80-100 VOLTS, 65 WATTS
4
MAXIMUM RATINGS
Rating
Collector-Emitter Voltage
BDX53B, BDX54B
BDX53C, BDX54C
Collector-Base Voltage
BDX53B, BDX54B
BDX53C, BDX54C
Emitter-Base Voltage
Collector Current - Continuous
- Peak
Base Current
Total Device Dissipation @ TC = 25°C Derate above 25°C
Operating and Storage Junction Temperature Range
Symbol
V
CEO
V
CB
V
EB
I
C
I
B
P
D
TJ, T
stg
Value
80
100
80
100
5.0
8.0 12
0.2
65
0.48
-65 to +150
Unit
Vdc
Vdc
Vdc
Adc
Adc
W
W/°C
°C
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Symbol
R
q
JA
R
q
JC
Max
70
1.92
Unit
°C/W
°C/W
TO-220AB
CASE 221A
1
2
3
STYLE 1
MARKING DIAGRAM
& PIN ASSIGNMENT
4
Collector
BDX5xyG
AY WW
1
Base
Collector
BDX5xy = Device Code
x = 3 or 4
y = B or C A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package
3 Emitter
2
*For additional information on our Pb-Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2007
November, 2007 - Rev. 13
1 Publication Order Number:
See detailed ordering and shipping information in the package
ORDERING INFORMATION
dimensions section on page 6 of this data sheet.
BDX53B/D
Page 2
BDX53B, BDX53C (NPN), BDX54B, BDX54C (PNP)
TAT
C
80
4.0
60
3.0
T
C
40
2.0
T
A
, POWER DISSIPATION (WATTS)
D
P
1.0
20
0
20 40 80 100 120 160
0 60 140
T, TEMPERATURE (°C)
Figure 1. Power Derating
ELECTRICAL CHARACTERISTICS (T
Characteristic
OFF CHARACTERISTICS
Collector-Emitter Sustaining Voltage (Note 1)
(IC = 100 mAdc, IB = 0) BDX53B, BDX54B
Collector Cutoff Current
(VCE = 40 Vdc, IB = 0) BDX53B, BDX54B (VCE = 50 Vdc, IB = 0) BDX53C, BDX54C
Collector Cutoff Current
(VCB = 80 Vdc, IE = 0) BDX53B, BDX54B (VCB = 100 Vdc, IE = 0) BDX53C, BDX54C
ON CHARACTERISTICS (Note 1)
DC Current Gain
(IC = 3.0 Adc, VCE = 3.0 Vdc)
Collector-Emitter Saturation Voltage
(IC = 3.0 Adc, IB = 12 mAdc)
Base-Emitter Saturation Voltage
(IC = 3.0 Adc, IC = 12 mA)
DYNAMIC CHARACTERISTICS
Small-Signal Current Gain
(IC = 3.0 Adc, VCE = 4.0 Vdc, f = 1.0 MHz)
Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 0.1 MHz) BDX53B, 53C
1. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%.
= 25°C unless otherwise noted)
C
BDX53C, BDX54C
BDX54B, 54C
Symbol
V
CEO(sus)
I
CEO
I
CBO
h
FE
V
CE(sat)
V
BE(sat)
h
fe
C
ob
Min
80
100
-
-
-
-
750
-
-
-
4.0
-
-
Max
-
-
0.5
0.5
0.2
0.2
-
2.0
4.0
2.5
-
300 200
Unit
Vdc
mAdc
mAdc
-
Vdc
Vdc
-
pF
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Page 3
BDX53B, BDX53C (NPN), BDX54B, BDX54C (PNP)
RB AND RC VARIED TO OBTAIN DESIRED CURRENT LEVELS
D1 MUST BE FAST RECOVERY TYPES, e.g.: 1N5825 USED ABOVE IB [ 100 mA MSD6100 USED BELOW IB [ 100 mA
R
V
2
APPROX
+8.0 V
0
V
1
APPROX
-12 V
25 ms
tr, tf v 10 ns DUTY CYCLE = 1.0%
B
D
51
1
[ 8.0 k [ 120
+4.0 V
for td and tr, D1 is disconnected and V2 = 0 For NPN test circuit reverse all polarities
Figure 2. Switching Time Test Circuit
1.0
0.7 D = 0.5
0.5
0.3
0.2
0.1
0.07
0.05
r(t) EFFECTIVE TRANSIENT
0.03
0.02
THERMAL RESISTANCE (NORMALIZED)
0.01
0.01
0.2
0.1
0.05
0.02
SINGLE PULSE
0.01
0.02
0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 1000500
0.03 0.3 3.0 30 300
V
CC
-30 V
R
C
TUT
SCOPE
t, TIME OR PULSE WIDTH (ms)
5.0
3.0
2.0
1.0
0.7
0.5
t, TIME (s)μ
0.3
0.2 VCC = 30 V
IC/IB = 250
0.1
IB1 = I
0.07
TJ = 25°C
0.05
0.1
P
(pk)
t
DUTY CYCLE, D = t1/t
t
s
t
f
t
r
B2
0.2 0.3 0.7 3.0 10
td @ V
0.5 2.0 7.0
= 0 V
BE(off)
1.0 5.0
IC, COLLECTOR CURRENT (AMP)
Figure 3. Switching Times
R
(t) = r(t) R
q
JC
R
q
JC
1
SINGLE
t
2
PULSE
D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t T
J(pk)
2
= 1.92°C/W
- TC = P
q
(pk)
JC
1
R
(t)
q
JC
20
10
5.0
2.0
1.0
0.5
0.2 CURVES APPLY BELOW RATED V
, COLLECTOR CURRENT (AMP)
0.1
C
I
TJ = 150°C BONDING WIRE LIMITED
THERMALLY LIMITED @ TC = 25°C (SINGLE PULSE) SECOND BREAKDOWN LIMITED
0.05
0.02
1.0
2.0 503.0 5.0 7.0
5.0 ms
1.0 ms dc
CEO
BDX53B, BDX54B
BDX53C, BDX54C
10 20 100
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
Figure 5. Active-Region Safe Operating Area
Figure 4. Thermal Response
500 ms
100 ms
a transistor average junction temperature and second breakdown. Safe operating area curves indicate IC -V limits of the transistor that must be observed for reliable operation, i.e., the transistor must not be subjected to greater dissipation than the curves indicate.
variable depending on conditions. Second breakdown pulse limits are valid for duty cycles to 10% provided T Figure 4. At high case temperatures, thermal limitations will reduce the power that can be handled to values less than the
30 70
limitations imposed by second breakdown.
There are two limitations on the power handling ability of
The data of Figure 5 is based on T
t 150°C. T
J(pk)
may be calculated from the data in
J(pk)
= 150°C; TC is
J(pk)
CE
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Page 4
BDX53B, BDX53C (NPN), BDX54B, BDX54C (PNP)
10,000
5000 3000
2000
1000
500 300
200
100
, SMALL-SIGNAL CURRENT GAIN
FE
h
20,000
10,000
5000
3000 2000
1000
, DC CURRENT GAIN
FE
h
500
300 200
TJ = 25°C
= 3.0 V
V
CE
IC = 3.0 A
50 30
20
10
1.0
PNP NPN
2.0 5.0 10 20 50 100 200 1000
f, FREQUENCY (kHz)
Figure 6. Small‐Signal Current Gain
NPN BDX53B, 53C
TJ = 150°C
25°C
-55°C
0.1
0.2 0.3 0.5 0.7 1.0 2.0 10
IC, COLLECTOR CURRENT (AMP)
300
200
100
70
C, CAPACITANCE (pF)
50
500
VCE = 4.0 V
3.0 5.0 0.1
7.0
30
20,000
10,000
5000
3000
2000
1000
, DC CURRENT GAIN
FE
h
500
300 200
0.1
Figure 8. DC Current Gain
TJ = + 25°C
C
ob
C
ib
PNP NPN
1.0 2.0 5.0 20 10010
VR, REVERSE VOLTAGE (VOLTS)
Figure 7. Capacitance
PNP BDX54B, 54C
VCE = 4.0 V
TJ = 150°C
25°C
-55°C
0.2 0.3 0.5 0.7 1.0 2.0 10
IC, COLLECTOR CURRENT (AMP)
3.0 5.0
500.2 0.5
7.0
3.0
2.6 IC = 2.0 A
2.2
1.8
1.4
, COLLECTOR-EMITTER VOLTAGE (VOLTS)
CE
V
1.0
0.3 0.5 1.0 2.0 3.0 5.0 7.0 30
0.7 2010
4.0 A 6.0 A
IB, BASE CURRENT (mA)
Figure 9. Collector Saturation Region
TJ = 25°C
, COLLECTOR-EMITTER VOLTAGE (VOLTS)
V
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4
3.0
2.6 IC = 2.0 A
2.2
1.8
1.4
CE
1.0
0.3 0.5 1.0 2.0 3.0 5.0 7.0 30
0.7 2010
4.0 A 6.0 A
IB, BASE CURRENT (mA)
TJ = 25°C
Page 5
BDX53B, BDX53C (NPN), BDX54B, BDX54C (PNP)
V, VOLTAGE (VOLTS)
3.0
TJ = 25°C
2.5
2.0
1.5
1.0
0.5
VBE @ VCE = 4.0 V
V
@ IC/IB = 250
BE(sat)
V
@ IC/IB = 250
CE(sat)
IC, COLLECTOR CURRENT (AMP)
3.0
TJ = 25°C
2.5
2.0
V
@ IC/IB = 250
V, VOLTAGE (VOLTS)
1.5
BE(sat)
VBE @ VCE = 4.0 V
1.0 V
@ IC/IB = 250
CE(sat)
0.5
0.1 0.2 0.3 0.5 0.7 1.0 2.0 107.03.0 5.0 0.1 0.2 0.3 0.5 0.7 1.0 2.0 107.03.0 5.0
IC, COLLECTOR CURRENT (AMP)
Figure 10. “On” Voltages
NPN BDX53B, BDX53C
+5.0
+4.0
+3.0
+2.0
+1.0
-1.0
-2.0
-3.0
, TEMPERATURE COEFFICIENT (mV/ C)°θ
-4.0
V
-5.0
*IC/IB v h
FE/3
25°C to 150°C
0
*qVC for V
CE(sat)
-55°C to 25°C
25°C to 150°C
qVB for V
BE
0.1 0.2 0.3 1.0 2.0 3.0 5.0 7.0 10
0.5 0.7
-55 to 150°C
IC, COLLECTOR CURRENT (AMP)
+5.0
+4.0
*IC/IB v h
+3.0
+2.0
+1.0
0
-1.0
-2.0
-3.0
, TEMPERATURE COEFFICIENT (mV/ C)°θ
-4.0
V
-5.0
qVB for V
0.1 0.2 0.3 1.0 2.0 3.0 5.0 7.0 10
PNP BDX54B, BDX54C
FE/3
-55°C to 25°C
*qVC for V
CE(sat)
25°C to 150°C
BE
0.5 0.7
IC, COLLECTOR CURRENT (AMP)
Figure 11. Temperature Coefficients
25°C to 150°C
-55 to 150°C
5
10
REVERSE FORWARD
4
10
VCE = 30 V
3
10
2
10
TJ = 150°C
1
10
, COLLECTOR CURRENT (A)μI
C
10
-1
10
100°C
0
25°C
+0.2 +0.40-0.2-0.4-0.6
+0.6 +0.8 +1.0 +1.2 + 1.4
VBE, BASE‐EMITTER VOLTAGE (VOLTS)
5
10
REVERSE
4
10
VCE = 30 V
3
10
2
10
TJ = 150°C
1
10
, COLLECTOR CURRENT (A)μI
0
C
10
-1
10
100°C
25°C
FORWARD
-0.2 -0.40+0.2+0.4+0.6
-0.6 -0.8 -1.0 -1.2 -1.4
VBE, BASE‐EMITTER VOLTAGE (VOLTS)
Figure 12. Collector Cut-Off Region
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BDX53B, BDX53C (NPN), BDX54B, BDX54C (PNP)
NPN BDX53B BDX53C
BASE
COLLECTOR
[ 8.0 k [ 120
EMITTER
PNP BDX54B BDX54C
BASE
COLLECTOR
[ 8.0 k [ 120
EMITTER
Figure 13. Darlington Schematic
ORDERING INFORMATION
Device Package Shipping
BDX53B TO-220
BDX53BG TO-220
(Pb-Free)
BDX53C TO-220
BDX53CG TO-220
(Pb-Free)
BDX54B TO-220
BDX54BG TO-220
(Pb-Free)
BDX54C TO-220
BDX54CG TO-220
(Pb-Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
50 Units / Rail
50 Units / Rail
50 Units / Rail
50 Units / Rail
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BDX53B, BDX53C (NPN), BDX54B, BDX54C (PNP)
l
PACKAGE DIMENSIONS
TO-220
CASE 221A-09
ISSUE AE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
SEATING
-T-
PLANE
B
4
Q
123
F
T
A
U
C
S
H
K
Z
L
V
R
J
G
D
N
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED.
DIM MIN MAX MIN MAX
A 0.570 0.620 14.48 15.75 B 0.380 0.405 9.66 10.28 C 0.160 0.190 4.07 4.82 D 0.025 0.035 0.64 0.88 F 0.142 0.161 3.61 4.09 G 0.095 0.105 2.42 2.66 H 0.110 0.155 2.80 3.93 J 0.014 0.025 0.36 0.64 K 0.500 0.562 12.70 14.27 L 0.045 0.060 1.15 1.52 N 0.190 0.210 4.83 5.33 Q 0.100 0.120 2.54 3.04 R 0.080 0.110 2.04 2.79 S 0.045 0.055 1.15 1.39 T 0.235 0.255 5.97 6.47 U 0.000 0.050 0.00 1.27 V 0.045 --- 1.15 --- Z --- 0.080 --- 2.04
MILLIMETERSINCHES
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BDX53B/D
7
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